➀ xMEMS Labs introduces the XMC-2400 µCooling chip, an all-silicon active micro-cooling fan designed for ultramobile devices and AI applications. ➁ The chip measures 9.26 x 7.6 x 1.08 millimeters and weighs under 150 milligrams, making it 96% smaller and lighter than traditional active-cooling solutions. ➂ It can move up to 39 cubic centimeters of air per second and generate 1,000Pa of back pressure, ensuring efficient heat management. ➃ The XMC-2400 is planned for customer sampling in Q1 2025 and full-scale production in Q2 2025.