➀ Fraunhofer IZM-ASSID celebrated 15 years as a pioneer in 3D system integration and wafer-level packaging, driving innovations like TSV processing and chiplet architectures;

➁ Flagship projects CEASAX (300mm microelectronics R&D) and APECS (EU Chips Act pilot line) strengthen Europe's competitiveness in semiconductor advanced packaging and edge AI;

➂ Strategic collaborations with GlobalFoundries, Infineon, Siemens, and academia solidify its role in global high-tech ecosystems and technological resilience.

➀ Counterpoint Research's analysis defines Foundry 2.0 as encompassing packaging and mask-making alongside wafer fabrication, with TSMC leading at 35% market share and Intel ranking second at 6.5%;

➁ The expanded definition may mitigate monopoly concerns for TSMC, whose traditional wafer fabbing dominance reaches nearly 70%;

➂ The Foundry 2.0 market reached $72 billion in Q1 2025, with Intel gaining 0.6% quarterly market share but declining 0.3% year-over-year.

➀ Nordic Semiconductor acquired IoT connectivity platform Memfault for $120 million to establish a hardware/software ecosystem for connected products;

➁ The integration will enable lifetime software updates, enhanced security, lower power consumption, and improved device management through Memfault's device observability platform and Nordic’s nRF Cloud services;

➂ The deal aligns with evolving IoT edge AI demands and EU Cyber Resilience Act requirements, aiming to simplify compliant product development for global customers.

➀ TrendForce releases the 2024 ranking of the top ten OSAT (Outsourced Semiconductor Assembly and Testing) companies;

➁ The article references related rankings of semiconductor companies and market trends;

➂ Highlights the critical role of OSAT providers in the semiconductor supply chain.

➀ The BMFTR-funded SPINNING project demonstrated a diamond spin-photon quantum computer with 12 qubits, showcasing superior coherence times (over 10 ms) and lower error rates (<0.5%) compared to superconducting IBM models (Eagle, Heron);

➀ Photonic coupling over 20 meters enabled scalable, distributed quantum registers with high fidelity (over 0.9), offering flexible integration with classical computing systems;

➂ The project involved collaboration among 28 entities, advancing diamond material processing, qubit fabrication, and AI-driven quantum applications, funded with €16.1 million by the German government.

➀ Researchers at Technical University of Munich (TUM) developed a robotic system to treat life-threatening tension pneumothorax during evacuation flights, using ultrasound-guided needle decompression;

➁ The system, part of the EU-funded iMEDCAP project, integrates a robotic arm and diagnostic tools for both military and civilian emergencies, such as gunshot wounds or traffic accidents;

➂ The project also includes drone-based evacuation (Avilus Grille) and telemedicine capabilities, with additional robotic modules under development for osseous access, tourniquet application, and chemical weapon response.

➀ The UK House of Lords Committee will hold a session with space industry leaders to discuss the space economy, domestic launch capabilities, and national security implications;

➁ Expert panels include representatives from techUK, Maersk, Orbex, and independent advisors, addressing topics like orbital launch plans and economic impacts;

➂ The Committee's final report will be submitted to the government in autumn 2025, with proceedings available for public viewing via Parliament TV.

➀ Ed meets water company lobbyists concerned about mandatory reporting of data centers' water usage under EU's CSRD and UK pressure;

➁ High-workload AI data centers consume water equivalent to towns of 50,000 people, sparking community resistance fears;

➂ Despite ethical concerns, Ed considers supporting reporting delays due to water firms' history of lucrative payouts to executives and shareholders.

➀ X Display Company (XDC) unveiled a 1 million FPS microLED display paired with a high-speed camera for machine-to-machine communication, potentially reaching 1 Tb/s speeds;

➁ The system offers 2-3x higher energy efficiency than 800G optical transceivers and eliminates physical cables, but requires high-speed encoding/decoding and infrastructure redesign;

➂ While promising for hyperscale data centers, challenges remain in practical implementation and industry adoption beyond niche applications.

➀ CAST introduces the MC-SDMA Multi-Channel Streaming DMA IP core to reduce the CPU's workload by managing data transfers between system memory and peripherals;

➁ The IP core supports multiple channels and streaming interfaces, improving efficiency and system performance for resource-intensive applications;

➂ Designed for real-time systems and complex SoC designs, it offloads data transfer tasks to enhance overall processing capabilities.

➀ Imec and Tokyo Electron (TEL) have extended their partnership to advance semiconductor R&D for nodes beyond 2nm, focusing on patterning, logic devices, memory, and 3D integration;

➁ Their prior collaboration achieved breakthroughs in High NA EUV lithography and EUV resist coating technology, critical for production-level EUV adoption;

➂ The renewed efforts target High NA patterning, CFET devices, and sustainable manufacturing processes to drive innovation and reinforce global semiconductor leadership.

➀ Greenerwave secured a €10 million contract from the French DGA to provide satellite connectivity for the Armed Forces, leveraging its multi-orbit terminals with Reconfigurable Intelligent Surfaces (RIS) technology;

➁ The project, part of a collaboration with Airbus Defence and Space and Eutelsat OneWeb, aims to validate mobile satcom performance in vehicles using Ku-band and support France's sovereign connectivity goals via LEO and future IRIS² constellations;

➂ Greenerwave's software-driven approach reduces semiconductor dependency and power consumption, aligning with DGA's strategy to enhance military capabilities and promote domestic tech innovation.

➀ Researchers developed an automated data analysis method for Kelvin Probe Force Microscopy (KPFM) to measure millisecond-level voltage changes on photoelectrode surfaces, enhancing insights into charge transport dynamics.

➀ The technique, demonstrated using titanium dioxide (TiO2), enables precise correlation between local morphology and optoelectronic properties, critical for improving photoelectrochemical cells (PECs) for sustainable hydrogen and fuel production.

➂ The innovation paves the way for designing more efficient and durable materials, advancing solar fuel technologies by leveraging high-resolution microscopy and data science approaches.

➀ X-Fab enhances 25V isolation to improve SPAD integration in its 180nm XH018 process;

➁ New Isomos2 module enables 25% smaller pixel arrays and 30% higher fill factor;

➂ Technology supports lidar, 3D imaging, and quantum communications applications

➀ Researchers from ETH Zürich and Empa developed a perovskite-based image sensor that captures more light with better color accuracy and fewer artifacts compared to traditional silicon sensors;

➀ The stacked perovskite layers enable full-spectrum light absorption without filters, tripling both light capture and resolution potential;

➀ The technology shows promise for hyperspectral imaging in medical diagnostics, environmental monitoring, and machine vision applications, with plans to miniaturize pixels further for commercialization.

➀ Three graduates from Frankfurt UAS were awarded the Friedrich-Dessauer-Preis for their theses on IPv6 privacy in IoT, 5G network control, and thermal modeling of power electronics;

➁ Nico Lick developed Privacy Extensions for IoT devices using RIOT OS to address IPv6 tracking vulnerabilities, enhancing user privacy and protocol standardization;

➂ Thomas Zielasny integrated a Network Exposure Function into open-source 5G networks to optimize dynamic data flow, while Svenja Zöller validated a digital twin thermal model for predicting aging in wind turbine electronics.

➀ Marco Stucki won the Berlin University Alliance's open knowledge lab competition with an innovative method for manufacturing diamond-based quantum light sources, crucial for future quantum computing and secure communication networks;

➁ The competition, themed "Art meets Science," highlighted cutting-edge research in quantum technologies, exemplified by Stucki's "Sawfish Cavity"—a photonic crystal resonator that efficiently traps and amplifies light using wave-like structures;

➂ The project will be showcased through an artistic poster campaign under the Berlin University Alliance's Open Knowledge Lab initiative, bridging technical innovation and public engagement.

➀ The International Superconductive Electronics Conference (ISEC) 2025 in Erfurt convenes global experts to advance discussions on quantum computing, energy-efficient electronics, and brain-inspired computing.

➁ Thuringia positions itself as a technological innovation hub, with applications spanning secure communication, environmental sciences, and AI data center energy challenges.

➂ Forschungszentrum Jülich introduces the QSolid project, targeting scalable quantum computing through qubit integration and novel control electronics.

➀ Marco Stucki won the Berlin University Alliance's ideas competition with a novel method for creating diamond nanostructures for quantum technologies, enabling future quantum computing and secure communication networks;

➁ The competition showcased Berlin's diverse research fields, attracting over 80 submissions spanning global health, climate, and quantum technologies;

➂ Stucki's "Sawfish Cavity" uses diamond-based optical resonators to trap and amplify light, with artistic visualizations displayed publicly in Berlin as part of the campaign.

➀ Fraunhofer IAF developed a miniaturized diamond-based quantum magnetometer using nitrogen-vacancy (NV) centers, achieving high sensitivity (picotesla range) and robustness for applications in biomedicine, materials testing, and navigation;

➁ The sensor enables vector magnetic field measurements with reduced calibration, supports autonomous GNSS-free navigation in challenging environments, and aids in geological mineral exploration;

➂ Ongoing advancements aim to further reduce sensor size by 5x and enhance sensitivity for sub-picotesla measurements, while expanding diamond wafer production to industrial 4-inch scales.