Recent #AMD news in the semiconductor industry

9 months ago
➀ Ayar Labs, an optical I/O specialist, has raised $155 million, bringing its total funding to $370 million and valuing the company over $1 billion.➁ The round was led by Advent Global Opportunities and Light Street Capital, with participation from AMD Ventures, Intel Capital, Nvidia, 3M Ventures, and Autopilot, among others.➂ Ayar Labs has developed in-package optical I/O technology to enhance AI infrastructure efficiency and performance.
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9 months ago
➀ AMD is integrating direct RF-sampling data converters into its Versal adaptive SoCs, aiming at high-resolution and high sample-rate RF applications. The Versal RF Series is set to provide advanced capabilities for aerospace and defense, as well as test and measurement markets. ➁ The new series combines high-resolution RF data converters, hard IP DSP compute blocks, AI engines, and an Arm subsystem in a single chip. ➂ The series is expected to deliver up to 80 TOPS of DSP compute power, with improved performance over the previous generation.
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9 months ago
➀ This article highlights the significant growth in server CPU core counts from 2010 to 2025, showing the increasing competition and architectural choices in the market. ➁ The growth rate of server CPU core counts is accelerating, and the number of vendors participating is proliferating. ➂ The article discusses the challenges of selling general-purpose compute servers versus AI servers, and the impact of AI on the industry.
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9 months ago
➀ Geekom is reportedly preparing the QS series of mini-PCs with the Qualcomm Snapdragon X Elite chip; ➁ This device will be the first Snapdragon X Elite mini-PC, as Qualcomm unexpectedly canceled the Snapdragon X Elite dev kit; ➂ The mini-PC's specifications, pricing, or additional information are not yet known.
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10 months ago

➀ AMD is considering 'multi-chip stacking' for its future Ryzen SoC to achieve chip scalability.

➁ AMD has been committed to innovating its existing consumer CPU product lines, being the first to introduce a dedicated '3D V-Cache' module (known as the 'X3D' product line) in processors.

➂ A new patent application suggests AMD is exploring a 'novel packaging design' that aims to innovate chip stacking processes, ultimately reducing interconnect latency and bringing significant performance improvements.

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