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Recent #power electronics news in the semiconductor industry
➀ A new die-attach process is introduced; ➁ It promises to cool power devices up to 15X more efficiently; ➂ It reduces failure-inducing stresses caused by conventional sintering techniques.
➀ Traco Powers introduces a new series of compact DC/DC converters, TEC 3UI, with an ultra-wide 8:1 input range, designed for industrial operations and space-constrained environments. ➁ The converters support input DC voltages from 9V to 75V and operate reliably at temperatures from -40°C to +80°C and altitudes up to 5000m. ➂ They feature enhanced protection and remote ON/OFF functionality, making them suitable for various industrial applications.
➀ The article discusses a three-phase ANPC based on GaN technology; ➁ The design details, including GaN power devices, modular construction, and voltage sensing, are outlined; ➂ The design's efficiency, flexibility, and potential applications in solar inverters and power conversion systems are highlighted.
➀ XP Power has developed two new DC-DC converter series with a 12:1 ultra-wide input range, addressing various applications in renewable energy, battery systems, and railways; ➁ The RDF150 and RDF200 series operate from a 14V-160V DC input range and are designed to simplify power solutions in railway systems; ➂ These converters are suitable for engineers and designers in renewable energy, battery systems, and railway infrastructure.
➀ The RAC04NE-K series by RECOM offers a reliable 4W output across a wide input range without derating; ➁ It is designed for demanding environments with features like Class II insulation and OVCIII rating up to 3000m; ➂ The series is suitable for automation, lighting, and industrial equipment applications.
➀ Texas Instruments' TIDA-020030 reference design offers a power stage solution for various applications, including inverter and motor control development, especially for hybrid and electric vehicle traction inverters; ➁ The design supports high-voltage and high-current loads with protections for overcurrent and short-circuit; ➂ It integrates diagnostic and system monitoring features for real-time performance validation and fault detection.
➀ This reference design from Texas Instruments introduces a compact power solution for various charging applications using GaN technology; ➁ It improves efficiency and power density with reduced losses and higher switching frequencies; ➂ The design allows for smaller inductors, reduced core sizes, and fewer primary windings, making it suitable for mobile wall chargers and USB wall power outlets.
➀ The three-phase design simplifies the development and testing of power electronics systems; ➁ Equipped with six GD3160 gate drivers for IGBT/SiC MOSFET devices; ➂ Offers a comprehensive evaluation platform with robust fault management and additional support circuits.
➀ A new non-isolated digital Intermediate Bus Converter (IBC) with peak efficiency of 97.9%; ➁ Developed by Flex Power Modules for modern AI and machine learning systems; ➂ Offers 3kW peak power in a compact size, ideal for space-constrained environments like high-performance GPUs and AI servers.
➀ ST has introduced new 40V STripFET F8 MOSFETs, enhancing noise immunity for non-logic-level control applications; ➁ The MOSFETs offer high drain current and low RDS(on) for efficiency; ➂ The technology ensures ruggedness and high maximum operating temperature for harsh environments.
➀ Infineon Technologies AG has introduced the OptiMOS 5 Linear FET 2, a MOSFET designed to enhance safe hot-swap functionality in AI servers and telecom applications; ➁ The Linear FET 2 delivers enhanced performance with improved SOA, reduced gate leakage, and expanded packaging options; ➂ The MOSFET provides a significant increase in SOA, improving current distribution in BMS applications and enabling compact, high-density designs.
➀ Microchip has introduced its new IGBT 7 power device portfolio; ➁ The devices are designed for high efficiency and performance in power electronics; ➂ They support applications in e-mobility, sustainability, and data centers.
➀ This article discusses a 750W AC/DC reference design; ➁ It highlights Microchip's role in the design, focusing on the ZVS Full-Bridge topology and digital control techniques; ➂ The design aims to improve efficiency and reliability in power electronics applications.
➀ Nexperia introduces a 110V 4A half-bridge gate driver IC designed for use in consumer devices, servers, telecommunications equipment, and micro-inverters. ➁ The NGD4300 offers a peak sourcing current of 4A and can sink 5A, with a delay as low as 13ns. ➂ It supports operation across a wide ambient temperature range and has built-in features for compatibility with CMOS and TTL.
➀ ST's STGAP3S family integrates the latest galvanic isolation technology with optimized desaturation protection and flexible Miller-clamp architecture; ➁ The drivers feature reinforced capacitive galvanic isolation and can withstand high transient isolation voltage; ➂ They are used in various industrial and power applications, offering different current capabilities and protection thresholds for optimal performance.
➀ The SEPIC converter reference design offers a high-efficiency, precise control, and compact solution for server battery backup systems; ➁ It is suitable for critical applications requiring uninterrupted power, such as data centers and industrial servers; ➂ The design by Texas Instruments features a non-isolated topology and adjustable output voltage and current.
The article introduces a 100 W LLC DC-DC converter reference design, highlighting its efficiency, compact design, and suitability for industrial equipment and various applications. The design achieves 88% efficiency at full load and utilizes an LLC resonant circuit for high efficiency and minimal heat generation.