<p>The article discusses the development of cost-effective silicon carbide (SiC) power electronics through research projects like ThinSiCPower. It highlights the advantages of SiC over traditional silicon, emphasizing the need for reducing costs and improving thermal-mechanical stability. The project focuses on creating thin SiC chips and cost-effective substrates without the need for sawing and grinding, aiming to accelerate the market penetration of efficient SiC power electronics.</p>
Related Articles
- Thin Chips and Robust Substrates - Key Technologies for Cost-Efficient Silicon Carbide Power Electronics3 months ago
- GaN picked for Mazda automotive power project2 months ago
- Next-Generation Tester For High-Power Chips2 months ago
- Strathclyde Uni gets £9m for IC packaging R&D2 months ago
- Large-Scale Fuel Cell Project: Production Technologies for Mass Production3 months ago
- PCIM Expo & Conference 20253 months ago
- Diamond Semiconductors: The Key To Next-Generation Power Electronics3 months ago
- Cambridge GaN Devices completes $32m Series C3 months ago
- European Chiplet Innovation: APECS Pilot Line Starts Operation under the EU Chips Act5 months ago
- Chiplet Innovations for Europe: Launch of APECS Pilot Line under the EU Chips Act5 months ago