➀ Samsung Foundry faces challenges as it delays EUV orders; ➁ The low yields of Samsung's 3nm and 2nm processes may have led to cancelled orders; ➂ Samsung's pushback on equipment deliveries may impact its leading-edge foundry capability.

➀ Advanced logic chips have up to 20 metal layers to support two types of lines; ➁ The move of power lines to the back of the wafer is expected to reduce complexity and increase space for transistors; ➂ The challenges of wiring on the front side of the wafer need to be addressed to extend transistors to 2nm and below; ➃ The progression in graphic technology allows for smaller transistor characteristics but also requires smaller wiring, leading to increased resistance and signal delay; ➄ Innovations in materials and material engineering are crucial to overcome the challenges of miniaturization and extend the life of copper wiring; ➅ The industry is seeking innovative products to extend copper to 2nm and beyond.

➀ The US Chips and Science Act's main goal, to restore the US as a manufacturer of leading-edge logic ICs, is in jeopardy due to a disconnect between US bureaucracy and Intel. ➁ Intel, the only US company with a plan to produce these ICs, has not received any of the $19.5 billion in grants and loans promised under the Act. ➂ The delay in funding is due to officials waiting for Intel to show progress in building infrastructure, while Intel is unable to invest in new fabs due to the chip demand slump.