1. TSMC plans to adopt ASML's High-NA EUV machines for its A16 chip manufacturing technology by 2026; 2. The technology aims to improve chip performance and power efficiency, maintaining TSMC's competitive edge; 3. ASML's High-NA EUV systems are critical for next-gen chips but face challenges in cost and production complexity.
Recent #chip manufacturing news in the semiconductor industry
1. TSMC introduces A16 chip manufacturing technology with backside power delivery, targeting production by 2026; 2. Claims A16 outperforms Intel’s 18A process in power efficiency and transistor density; 3. Emphasizes confidence in maintaining leadership despite Intel’s advancements in process technology.
1. TSMC's Arizona fab faces labor disputes, cost overruns, and delayed subsidies; 2. The company plans to bring Taiwanese workers to train local staff, sparking union opposition; 3. Production focus may shift to 2nm technology amid challenges in workforce training and technology transfer.
1. The semiconductor industry is grappling with severe disruptions in global supply chains, impacting production and delivery timelines; 2. Geopolitical tensions and trade restrictions are exacerbating material shortages and technological competition; 3. Industry leaders urge collaborative investments in regional manufacturing and R&D to mitigate long-term risks.
1. TSMC's A16 chip manufacturing technology will utilize ASML's advanced High-NA EUV machines, enabling higher transistor density and efficiency; 2. The technology aims to address challenges in scaling beyond 2nm nodes, enhancing performance for AI and HPC applications; 3. This advancement positions TSMC to maintain leadership in semiconductor innovation amid global competition.
1. TSMC plans to adopt ASML's High-NA EUV lithography machines for its A16 chip manufacturing technology by 2026; 2. The A16 technology focuses on improving power efficiency and transistor density using backside power delivery; 3. This move positions TSMC to compete with Intel's 14A process in advanced semiconductor manufacturing.
1. TSMC's Arizona plant faces delays and labor disputes, exposing challenges in U.S. efforts to reshore semiconductor production; 2. The project highlights U.S.-China tech rivalry, with TSMC navigating geopolitical pressures from both nations; 3. Success or failure may reshape global chip supply chains and determine technological leadership in AI and advanced computing.
➀ Taiwan's United Microelectronics Corporation (UMC) has launched a new US$5 billion wafer fabrication facility in Singapore;
➁ The facility, located in the Pasir Ris Wafer Fab Park, features a 22nm wafer fabrication process;
➂ The event was attended by senior Singaporean officials, highlighting the importance of the project.
➀ Jiang Shangyi, former Co-CEO of TSMC, openly discussed Intel's chip manufacturing challenges in a speech in Taiwan.
➁ He suggested that Intel should adopt mature chip manufacturing processes to compete, as it is far behind TSMC and unable to catch up.
➂ Jiang believes that Intel, once the 'king' of the chip industry, is now a 'minor player' and should merge with a company specializing in mass production of mature chip technology.
➀ Nvidia is reportedly close to adopting Intel Foundry's 18A process node for gaming GPUs.
➁ Analyst Timothy Arcuri suggests that Nvidia is more likely to choose Intel over Broadcom.
➂ Intel is preparing its enhanced 18A-P fabrication technology for better performance or lower power consumption.
➀ eFabless, a well-known open-source chip platform, has announced its shutdown due to financial difficulties.
➁ Founded in 2014, eFabless aimed to bridge the gap between large and small companies in chip manufacturing, connecting startups, universities, and manufacturers.
➂ Despite its achievements, eFabless faced financial challenges and has now ceased operations, leaving behind an unfinished dream and a cautionary tale for the semiconductor industry.
➀ Toto, a leading loo manufacturer in Tokyo, is expected to make a profit of $130 million with a 40% operating margin from the chip industry in fiscal year 2024.
➁ The chip and loo industries share a commonality in fine ceramics, which is crucial for both industries.
➂ Toto's high precision microscopes enable the company to produce ceramics that are sufficiently pure to withstand extreme conditions without cracking.
➀ China's Big Fund III has begun spending its $47 billion allocation; ➁ The fund aims to support chip production equipment developers and makers; ➂ The investment is part of China's effort to become self-sufficient in semiconductor production.
➀ TSMC's chip manufacturing costs have surged; ➁ The transition from the A7's 28nm to A18 Pro's 3nm node has led to a significant increase in wafer prices; ➂ Third-party suppliers have confirmed the dramatic rise in costs.
➀ The competition in 2nm wafer fabrication has become a clear victory for TSMC, with its advanced technology and strong customer demand.
➁ TSMC has achieved significant milestones in 2nm technology, including successful trial production and high yields.
➂ Apple and AMD are expected to be among the first customers for TSMC's 2nm technology, with Apple's A20 Pro and M5 chips set to be produced on this process.
➃ Intel and NVIDIA are also turning to TSMC for its 2nm technology, with Intel's Nova Lake desktop chips and NVIDIA's Rubin Next platform expected to be produced on TSMC's N2 process.
➄ Samsung faces challenges in 2nm technology, including yield issues and the potential loss of its own customers to TSMC.
➅ Intel's 2nm technology, known as 18A, faces delays and yield challenges, with concerns about its ability to compete with TSMC.
➆ Rapidus, a Japanese semiconductor company, is working on 2nm technology but faces significant challenges in the current market.
➇ The rise of TSMC in 2nm technology raises concerns about pricing power and the potential impact on the semiconductor industry.
➀ Despite U.S. sanctions and China's localization efforts, Chinese companies remain reluctant to adopt domestic chips; ➁ The reluctance stems from technological limitations, availability of reliable foreign alternatives, and lack of government requirements; ➂ AI and HPC sectors are particularly challenging, with limited access to advanced technologies and domestic alternatives struggling to compete.
➀ Intel's 18A process is on track for production ramp-up next year, according to Naga Chandrasekaran, Intel's chief global operations officer and GM of the foundry business. ➁ The plan is to sample 18A chips to customers in H1 2025 and start production in H2 at Intel's Oregon fab. ➂ The defect density on 18A is currently at 0.4 defects per cm^2, comparable to TSMC's N7 and N5 processes before mass production.
➀ Japan's government is accelerating the development of its advanced chip manufacturing industry, planning to invest 200 billion yen ($1.9 billion) in chipmaker Rapidus in the fiscal year 2025 to stimulate further investment and financing from the private sector.
➁ Rapidus aims to achieve mass production of 2nm chips by 2027, requiring a total investment of up to 5 trillion yen. The Japanese government has agreed to provide 920 billion yen in subsidies, but the remaining 4 trillion yen gap is a focus of attention.
➂ The government plans to support the company's financing through guarantees of debt and investments by state institutions, and aims to include this proposal in the upcoming economic stimulus plan.
➀ Huawei's Ascend AI chip progress stalls due to US sanctions; ➁ The 7nm node lags behind TSMC by eight years; ➂ Huawei struggles to secure EUV equipment from ASML.
➀ OpenAI, Broadcom, and TSMC are collaborating on an AI inference chip; ➁ This move deviates from OpenAI's previous strategy of raising funds to build a network of fabs for AI IC production; ➂ Intel has also shifted its focus to inference ICs, possibly due to Nvidia's strong position in the AI training IC market.