1. TSMC announced its A16 chip manufacturing technology, featuring a 1.6nm process node and backside power delivery, set for production in 2026; 2. The technology aims to compete with Intel's 14A process, claiming superior performance and power efficiency; 3. The move highlights the intensifying rivalry between TSMC and Intel in advanced semiconductor manufacturing.

1. TSMC announces its A16 1.6nm chip manufacturing technology with backside power delivery, set for production in 2026; 2. The backside power rail design improves chip performance and energy efficiency, outperforming Intel's 14A process; 3. TSMC reinforces its leadership in advanced semiconductor manufacturing amid intensifying industry competition.

1. Applied Materials unveils a breakthrough in backside power delivery technology to address resistance and thermal issues in traditional front-side power networks; 2. The innovation enables 10-15% performance gains and 30% energy efficiency improvements for 2nm chips; 3. The technology reshapes chip architecture by separating power and signal transmission layers, potentially influencing future industry standards.

1. TSMC announces A16 chip manufacturing technology for 2026, combining GAA transistors and backside power delivery; 2. The technology promises 20% speed improvement and 20% power efficiency gains compared to N2P nodes; 3. TSMC's approach competes with Intel's 14A technology while avoiding reliance on ASML's High-NA EUV systems.

1. Samsung has unveiled its new roadmap detailing the development of 2nm process nodes. 2. The roadmap also includes plans for backside power delivery systems. 3. This strategic outline covers the next three years for Samsung Foundry.