➀ MIPI D-PHY and C-PHY standards have evolved to support up to 11 Gbps and 24.84 Gbps per-lane throughput, respectively, through advanced signal integrity techniques like DFE and 18-Wirestate encoding;

➁ Innovations such as Alternate Low Power (ALP) mode in D-PHY and enhanced voltage slicing in C-PHY improve energy efficiency and reliability for automotive, XR, and industrial applications;

➂ MIPI D-PHY v3.5 introduces Embedded Clock Mode (ECM), increasing throughput by 25% and reducing EMI, while C-PHY v3.0 achieves faster lane turnaround and higher encoding efficiency.

➀ Infineon finalized its $2.5 billion acquisition of Marvell's Automotive Ethernet business, enhancing its leadership in automotive semiconductors and system expertise for software-defined vehicles;

➁ Marvell's Brightlane portfolio (PHY transceivers, switches, bridges) supports 100 Mbps–10 Gbps networks, with a $4 billion design-win pipeline by 2030;

➂ The acquired unit will form a new "Ethernet Solutions" business line, projected to generate $225–250 million revenue in 2025 at ~60% gross margins.

➀ Dr. Sebastian Raab successfully defended his Ph.D. at THWS's TTZ-EMO, addressing electrical disturbances in electric vehicles through an adaptive active filter system;

➁ His compact, lightweight design outperforms traditional passive filters by dynamically adjusting to minimize energy losses and component interference;

➂ The research, conducted with Barcelona’s UPC, marks the 13th doctorate completed at TTZ-EMO, advancing sustainable electromobility solutions.

➀ The ZIRKEL consortium developed automated disassembly and material recovery methods for electric motors and high-voltage batteries in vehicles, focusing on resource efficiency;

➁ Fraunhofer IWU created a robot-assisted system using AI and machine vision to dismantle components even when dirty or worn, generating detailed disassembly guidelines and design recommendations for recyclability;

➂ Key insights emphasize integrating 'Design for Recycling' into product development to enable economically viable circular systems, with practical solutions like unified screw connections and magnet recovery techniques.

➀ Cloud2GND and Ezurio launched the Aurawave AW100 series to enhance LE Audio and Auracast development;

➀ The modules integrate Nordic Semiconductor's nRF5340 SoC, nRF21540 RF front-end, and AKM's audio codec for high-quality audio and extended range;

➂ Designed for consumer electronics, assistive listening, public broadcasting, and automotive infotainment, the platform simplifies integration and reduces engineering complexity.

➀ Saarland University launches a new Master’s program, ‘Sustainable Materials and Engineering,’ focusing on environmentally friendly material design, resource efficiency, and circular economy integration;

➁ The interdisciplinary curriculum combines chemistry, materials science, and systems engineering, emphasizing practical research and industry applications;

➂ Students gain expertise in developing recyclable materials, energy-efficient production, and lifecycle management for sustainable solutions in packaging, construction, and automotive sectors.

➀ EnSilica establishes a mixed-signal design center in Budapest to strengthen EU presence and tap into the local automotive and industrial tech ecosystem;

➁ The facility will focus on mixed-signal ICs for automotive and industrial applications, targeting 16 specialized engineers by September 2025;

➂ This expansion brings EnSilica's global headcount to ~210, with design centers across the UK, India, Brazil, and Hungary, enhancing RF/mmWave and cryptography IP capabilities.

➀ Researchers developed a switched-capacitor-based nine-level inverter achieving 96.5% efficiency, eliminating magnetic components and simplifying system design;

➀ The design uses capacitors and optimized switching to generate nine voltage levels with balanced voltages and low device stress;

➂ Applicable for solar, EV charging, and grid-compatible AC conversion with scalable configurations.

➀ MIT research shows AI-enabled eco-driving techniques can reduce intersection CO₂ emissions by 11-22% without impacting traffic flow, using simulations of 6,000+ U.S. intersections;

➀ A 10% adoption rate achieves 25-50% of maximum potential emission cuts, while optimizing speed limits at key intersections delivers 70% of benefits;

➀ The approach integrates deep reinforcement learning and aligns with EV adoption, offering scalable solutions for climate and public health goals.

➀ Cyient Semiconductors partners with GlobalFoundries as an authorized reseller of semiconductor manufacturing services, expanding access to advanced process technologies;

➁ The collaboration offers fabless companies end-to-end support including fabrication, design consultation, and testing to accelerate innovation in automotive, industrial, and medical sectors;

➂ The agreement strengthens GloFo's channel strategy and enhances Cyient's role in the global semiconductor supply chain.

➀ Industry 4.0 integrates IoT, AI, and robotics to enable flexible factories with software-controlled production, real-time analytics, and sustainability;

➁ Software-configurable hardware reduces costs by dynamically adapting sensors and I/O systems without physical modifications, enhancing operational efficiency;

➂ The smart manufacturing market is projected to grow from $210.2bn in 2024 to $348.2bn by 2030, driven by demand for scalability and adaptability in industries like automotive and process control.

➀ Vishay introduces IHDM-1107BBEV-2A/-3A powdered iron inductors for automotive applications, offering 30% higher current handling than ferrite solutions at 125°C;

➁ The inductors feature ultra-low DC resistance (down to 220μΩ), edge-wound conductors, and three customization options (bare copper/SMT/press fit), qualified to AEC-Q200;

➂ Designed for 48V-12V bidirectional converters and automotive systems, they maintain stable performance across temperatures up to 180°C with soft saturation characteristics.

➀ Semiconductor demand shifts toward automotive, industrial AI, and communication infrastructure, while consumer electronics (e.g., smartphones) show slow recovery;

➁ GlobalFoundries pivots manufacturing and IP capabilities to prioritize high-value segments like automotive, datacenters, and industrial computing;

➂ Strategic repositioning targets sustainable growth by capitalizing on automotive electrification and industrial AI applications amid market changes.

➀ Vishay Intertechnology launches high-temperature automotive inductors (IHDM-1107BBEV series) designed for operation up to +180°C, offering stable performance and 30% higher current handling than ferrite alternatives;

➀ Crafted with powdered iron cores and edge-wound coils, these inductors feature ultra-low DCR (down to 0.22 mΩ), soft saturation behavior, and AEC-Q200 qualification for automotive reliability;

➂ Ideal for EVs, hybrids, and high-power systems, the inductors are available in two variants with customizable configurations for DC/DC converters, inverters, and on-board chargers.

➀ Astute Group签署协议，分销Puya Semiconductor的超低功耗非易失性存储器（NVM）和基于Arm Cortex-M0+/M4内核的MCU产品；

➁ Puya的产品适用于低功耗蓝牙模块、汽车导航系统、消费电子等领域，已为三星、OPPO等品牌供货；

➂ 合作将提升欧洲市场供应能力，加速工业、汽车及消费应用中低功耗嵌入式技术的普及。

➀ X-FAB delivered solid Q2 2025 results, capitalizing on rising demand for analog/mixed-signal technologies in automotive, industrial, and medical sectors;

➁ The company differentiates itself by avoiding the digital node race, focusing instead on specialty process technologies for power efficiency and reliability;

➂ Strategic positioning in critical growth areas strengthens its potential against larger foundries pursuing advanced nodes.

➀ EIS enhances Li-ion battery management in EVs by analyzing electrochemical parameters, enabling optimized safety and performance through sensor fusion and AI algorithms.

➁ EIS enables early prediction of thermal runaway, a critical safety requirement under China's GB 38031-2020 standard, reducing reliance on physical sensors and improving cell utilization.

➂ EIS dynamically adjusts fast-charging profiles based on real-time cell state, proposing implementation models like centralized or localized excitation to balance cost and efficiency.

➀ TDK introduces EPCOS B3264xH series metallized film capacitors for high-frequency resonant applications, featuring pulse handling up to 6,500 V/µs and automotive-grade AEC-Q200 compliance;

➁ Offers compact sizes (13.0x4.0x9.0 mm to 26.5x14.5x29.0 mm), wide capacitance range (2.2–470 µF), and 200,000-hour lifespan at +85°C;

➂ Targets EVs (OBCs, DC-DC converters), SMPS, and UPS systems, with SPICE/ANSYS models for integration support.

➀ Knowles launches new X1/Y2 safety-certified MLCCs with voltage ratings up to 500Vrms, the first Y2-class capacitors in the market at this specification;

➁ Features include compact 2720 case design with 5mm creepage distance, AEC-Q200 automotive qualification, and resilience in harsh environments (-55°C to 125°C, 85% humidity);

➂ Targets high-power AC/DC converters and industrial applications requiring robust safety compliance.

➀ Akeana demonstrates leadership in high-performance RISC-V-based SMT IP cores, addressing compute density challenges in edge AI and automotive sectors;

➁ Their SMT implementation supports up to 4 threads per core across three product series, enhancing resource utilization and system efficiency;

➂ SMT enables safety redundancy in automotive systems and performance gains (20-30% Spec score uplift) while reducing chip area and power consumption.