Recent #Intel news in the semiconductor industry
➀ Arm CEO, Rene Haas, expresses his views on Intel's current situation, highlighting the importance of innovation in the tech industry.
➁ Haas discusses Intel's strategic challenges, particularly the IDM vs. Fabless debate, and his belief in the potential advantages of vertical integration.
➂ The CEO addresses rumors about Arm's potential acquisition of Intel and its plans to expand its chip manufacturing business.
➀ Intel, TSMC, and Samsung are advancing their processes to 1.8nm (18A) and 1.6nm (16A) with full-gate transistors (Intel calls them RibbonFET) and further to the 14A node.
➁ Imec is researching the next-generation complementary field-effect transistor (CFET) stacked transistors on the process roadmap.
➂ Imec will showcase its CFET standard cell at the 2024 IEEE International Electronic Devices Meeting (IEDM) this week, which includes two rows of CFET with a shared signal wiring wall, reducing the area of logic and SRAM units significantly.
➃ Intel has made breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technologies.
➄ Intel's RibbonFET is the company's first new transistor design since the introduction of FinFET 13 years ago and is the company's first full-gate (GAA) transistor.