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March 19
- Top Ten Chip Vendors 2024
➀ This article provides an overview of the top ten semiconductor companies in 2024, based on Gartner's data.
➁ The list includes the ranking, revenue, market share, and growth percentage compared to 2023.
➂ Notable companies like Samsung Electronics, Intel, NVIDIA, and Apple are highlighted.
March 18
- Gender & Race Pay Gaps
➀ Women in the U.S. have to work through 2024 and into March 2025 to earn the equivalent of the 2024 wages of U.S. men, with women earning 83 cents for every dollar men make.
➁ The U.S. equal pay day has been pushed back from March 12 to March 25 due to a recent shrinkage in women's income.
➂ The AAUW has published a series of equal pay days for different races and ethnicities, with the Asian, Pacific Islander & Native Hawaiian women's equal pay day on April 7, 2025, Black Women's on July 10, and Native American Women's on November 18, 2025.
- Raspberry Pi Pico powers 3DOF Pitch ‘n’ Roll sound pedal
➀ This article introduces a Raspberry Pi Pico system designed for a sound-effect pedal for electric guitar;
➁ The system, called the Gesture Controller, uses three angles of control (Yaw, Pitch, and Roll) to manipulate MIDI parameters;
➂ It utilizes a 6-axis AHRS IMU sensor and 3D printing technology, with the software coded in Python using Adafruit’s MIDI library.
- Saxavord spaceport highlights sovereign space launch capability
➀ Saxavord Spaceport in the Shetlands is emphasizing its role for future sovereign space launches;
➁ The spaceport announced at SpaceComm expo in London that it will support the launch of intelligence monitoring and commercial satellites;
➂ The UK spaceport aims to lead Europe's space launch ambitions with the help of German companies like Rocket Factory Augsburg (RFA) and HyImpulse.
- TI’s hot-swap eFuse targets 48V data centre design
➀ TI introduces the TPS1685, the first 48V integrated hot-swap eFuse with power-path protection for data centre hardware.
➁ The TPS1685 simplifies design and reduces solution size by half compared to existing hot-swap controllers.
➂ TI also launches a new family of GaN power stages, the LMG3650R035, LMG3650R025, and LMG3650R070, offering high efficiency and high power density.
- Solid State EV battery start-ups in sample mode
Several startups, including Factorial Energy, QuantumScape, and SES AI, are advancing to the sample delivery and pilot runs for semi-solid or quasi-solid-state batteries. These first-generation products are expected to enter mass production next year. Despite technical barriers, semi-solid or quasi-solid-state batteries, with a small amount of liquid electrolyte, are seen as interim options for U.S. and European automakers.
17 U.S. and European solid-state battery companies have raised over $4.2 billion in funding. Supported by programs like the US Department of Energy and the EU’s Horizon Europe initiative, some companies are already conducting vehicle integration tests with automakers.
US and European manufacturers are focusing on polymer-based or oxide-based solid electrolytes as their core technologies.
- NMI hosts industry conference in Glasgow with theme of growth
➀ NMI will host a conference on March 26th in Glasgow to explore new markets and technologies for expansion.
➁ The event at the University of Strathclyde focuses on the expected growth of the global semiconductor industry, which is projected to reach a $2 trillion market in the next decade.
➂ Key speakers will discuss topics like manufacturing innovation, market trends, sustainability, and the impact of emerging technologies.
- Transistor Computer
➀ In September 1960, Electronics Weekly featured a story about the development of a new all-transistor general purpose computer, the GE-225, by International General Electric.
➁ The GE-225 was said to have a 'general compiler' programming technique that automatically translated words and symbols into machine language.
➂ The machine was claimed to be one-third less costly per computation than civil-sized computers of the time.
March 17
- RISC-V MCU certified for PSA L2 security
➀ Espressif宣布其ESP32-C6 RISC-V MCU获得PSA Level 2认证；
➁ 该认证符合即将实施的法规，包括欧盟的网络安全韧性法案、美国网络安全改进法案、欧盟无线电设备指令和英国产品安全和电信基础设施制度；
➂ ESP32-C6的安全特性包括物理内存保护、内存隔离和权限管理、板载私钥生成、安全启动、闪存加密、AES、SHA、RSA和ECC的硬件加速器以及安全的JTAG模式。
- House of Lords seeks public’s input on space policy
➀ The House of Lords is conducting an inquiry into UK space policy and inviting submissions from individuals and organizations.
➁ The inquiry focuses on opportunities and challenges in the UK space sector, international partnerships, space safety, international space law, academic collaboration, education and skills, and the future of space science and civil exploration.
➂ The submission deadline is 10 am on Thursday, April 17th.
- Magnachip adds 25 SJ MOSFETs
➀ Magnachip has introduced 25 Gen6 SJ MOSFETs with improved switching speeds and reduced RSP;
➁ The new products offer enhanced reliability with a Zener diode and smaller chip sizes;
➂ The lineup includes various voltage ratings and package types for high-power efficiency applications.
- SIG Awards 2025 highlight satcoms innovation
➀ The 2025 SIG Awards highlighted innovations in satellite communications at SATShow '25 in Washington D.C.;
➁ Mission Microwave Technologies won the Innovation of the Year for its one-kilowatt Hub mount Ku-band BUC;
➂ Kacific Broadband Satellites was recognized for providing affordable high-speed internet in the Asia-Pacific region;
➃ Space Skills Alliance won the Educational Project of the Year for addressing UK space skills shortages;
➄ Lukas Nyström of Satcube was named Young Engineer of the Year.
- Farnell publishes its first buyers’ survey
➀ Farnell has released the results of its first Buyer Survey, offering insights into buyers' priorities and preferences in the engineering and electronics sectors.
➁ The survey, with over 900 participants, highlights the factors influencing supplier choice, loyalty, and purchase decisions.
➂ Farnell has published a whitepaper, 'Shaping the Procurement Future', to guide buyers through today's dynamic market.
- Ed Eyes Up €1trn
➀ Ed reflects on the sources of €1trn and his strategy to secure a share of it;
➁ Ed discusses the possibility of the US raising €800 billion for 'ReArm Europe' and €200 billion for 'InvestAI';
➂ Ed's assignment to the EU as 'Digital Envoy' and his plan to spend on meals and indulgences to identify influential figures in the spending of the funds.
- Sponsored Content: Longsys Debuts at MWC25, Unleashing the Power of Storage Innovation in Mobile Communications
➀ Longsys, a branded semiconductor memory enterprise, showcased a series of innovative storage products at MWC 2025.
➁ The PTM Business Model demonstrated Longsys' full-stack customization capabilities.
➂ Longsys presented a range of embedded storage solutions for mobile devices and server storage for AI computing.
March 14
- Voice Is Still The Killer App
➀ 21年前，当移动互联网刚刚兴起时，电信行业与现在大不相同；
➁ 根据剑桥顾问公司（CCL），3G是为了降低成本，而不是用于多媒体数据传输，如流媒体视频和视频电话；
➂ 语音仍然是杀手级应用，运营商的问题在于过去两年ARPU（每用户平均收入）下降了20%；
➃ CCL对无线局域网（802.11）持怀疑态度，认为其能耗高，不适合用户密集的地方。
- Arduino compatible Teesny Cortex-M7 dev boards now made by SparkFun
➀ SparkFun Electronics will manufacture the Teensy 4.0 and 4.1 Cortex-M7 development boards;
➁ The boards offer a powerful processor and Arduino compatibility;
➂ PJRC and SparkFun have a collaborative relationship, with SparkFun handling manufacturing and sales, allowing PJRC to focus on software development.
- UKSA boasts record European Space Agency contract wins
➀ The UK Space Agency (UKSA) has achieved a record six-month period for contract wins involving the European Space Agency (ESA).
➁ The agency highlights a significant increase in funds for ESA programmes, with an additional £112 million (€134 million) in contracts for the UK space sector between June 2022 and December 2024.
➂ The UK now receives 99p back in contracts for every £1 invested, after overheads, marking an improvement from the previous 93p.
- Most Read – Andy Grove, Smallest MCU, ST China fab
➀ TSMC正在与Nvidia、Broadcom、Qualcomm和AMD讨论收购英特尔晶圆厂的合资企业；
➁ Sanan Optoelectronics和STMicroelectronics在重庆合资建立了32亿美元的碳化硅晶圆厂；
➂ 本周嵌入式世界2025展会的最新电子新闻综述；
➃ 德州仪器宣布其最新的微控制器是“世界上最小”的，尺寸为1.6 x 0.86mm；
➄ 美国总统特朗普对格罗夫之后英特尔CEO的表现持批评态度。
- Rapidus wrestles with funding issues
➀ Rapidus faces funding issues as it prepares to produce its first prototype chips next month.
➁ The company requires $32 billion for 2nm chip production by 2027, but has only secured $9.6 billion.
➂ The Japanese government plans to contribute an additional $674 million this year and is facing pressure to explain how the remaining $27 billion will be raised.
- Classical-Quantum computing platform installed at Harwell
➀ SEEQC of New York has installed a Cross-Qubit Scaling Platform at the National Quantum Computing Centre (NQCC) in Oxfordshire.
➁ SEEQC uses digital ICs to deliver quantum computing and will develop and test technologies to improve quantum efficiency and build scalable architectures.
➂ The SFQ chips from SEEQC can be integrated with quantum computers, creating a quantum/classical processor with ultra-low latency readout and control.
- Synaptics extends Veros
➀ Synaptics has expanded its Veros connectivity portfolio with the SYN461x family;
➁ The SYN461x is designed for embedded Edge AI IoT and offers ULP Wi-Fi, Bluetooth 6.0, and BLE;
➂ It is optimized for power, integration, size, and market time while providing high performance and interoperability.
- PAVE360 SDV tech available on AMD CPUs and GPUs on Azure
➀ Siemens Digital Industries Software has expanded its cloud platform for systems-of-systems development with PAVE360 technology for Software Defined Vehicle (SDV) development.
➁ PAVE360 requires graphics acceleration for accurate simulation and AI processing, which is provided by AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure.
➂ PAVE360 running on Azure offers cloud development features and system-aware views, helping to uncover defects early in the design cycle.
- JEDEC, OCP design kits progress automated SiP design using chiplets
➀ JEDEC and OCP announce new Chiplet Design Kits for EDA use;
➁ The kits cover Assembly, Substrate, Material, and Test;
➂ The kits aim to automate SiP design and build using chiplets.
- How Vaccines Have Beaten Diseases
➀ Vaccines have been used since May 14, 1796, when Edward Jenner first vaccinated against smallpox.
➁ Diseases like polio and smallpox have been eradicated, with no new cases in the United States for decades, compared to over 10,000 cases per year in the 20th century.
➂ Progress in eradicating measles has slowed in recent years but remains significantly lower than the 20th century average of half a million cases per year.
March 13
- Fable: Putting Your Foot In It
➀ The satellite launch went smoothly until a mid-flight course correction was needed.
➁ Two teams were guiding the rocket, one using metric measurements and the other using imperial measurements.
➂ A wrong measurement was used for the course correction, leading to the rocket crashing into a planet and burning up.
- What caught your eye? (ANDtr interview, TSMC, Tiny 32bit MCU, ATC)
➀ This week's highlights include an interview with ANDtr, TSMC's $100 billion investment in Arizona fabs, TI's claim of the 'world's smallest' MCU, and ESA's investment in the Edinburgh Astronomy Technology Centre.
➁ The Electronics Weekly team shares their picks of the week, including announcements, developments, product releases, quotes, and more from the electronics industry.
➂ The team discusses the second episode of the CHIIPS podcast, featuring insights from ANDtr's Valerie Lynch and Nicola Thorn, and the announcement of new facilities at the UK Astronomy Technology Centre.
- Gilmour Space’s Australian orbital rocket launch clears last hurdle
➀ Gilmour Space Technologies获得澳大利亚民用航空安全局（CASA）和Airservices Australia的最终空域批准；
➁ 计划于3月15日或之后进行Eris火箭的首次发射，Eris是澳大利亚设计建造的第一枚火箭；
➂ Gilmour Space的联合创始人兼首席执行官Adam Gilmour强调团队的努力和承诺，并强调澳大利亚本土火箭制造的历史意义。
- Lip-Bu Tan is Intel CEO
➀ Lip-Bu Tan will become the CEO of Intel starting March 18th;
➁ Tan resigned from the board last August due to dissatisfaction with the company's workforce, culture, and AI strategy;
➂ Tan expressed confidence in Intel's ability to win and emphasized the company's essential role in the global technology ecosystem.
- Imec and ASML sign five year R&D agreement
➀ ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.
➁ The agreement aims to deliver valuable solutions in two areas: advancing the semiconductor industry and developing sustainable innovation initiatives.
➂ The collaboration includes ASML's full product portfolio, focusing on high-end nodes and advanced technologies.