electronicsweekly

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July 31

  • Automotive decline hits Europe component market, says DMASS

    ➀ European semiconductor distribution sales fell 14% YoY in Q2 2025 due to automotive sector decline, with Austria (-36.6%), France (-20%), and Germany (-17%) hit hardest, while Iberia saw a 2.4% rise.

    ➁ Component categories varied widely: power and programmable logic sales dropped 21%, while sensors/actuators and discrete components grew. IP&E rose 1.43%, driven by circular connectors (+122.7%) and power supplies.

    ➂ DMASS cites geopolitical tensions and supply chain volatility as key challenges, urging Europe to prioritize nearshoring and AI/IoT innovation to counter industrial stagnation.

    automotivesemiconductor
  • Samsung Q2 chip profit down 94%

    ➀ Samsung's Q2 chip profit plunged 94% YoY to $288 million, with sales of $20 billion, compared to $4.7 billion profit in Q2 2024;

    ➁ The company secured a $16.5 billion order from Tesla for its Texas fab and anticipates more large foundry orders, with plans to ramp up 2nm process production in H2;

    ➂ Samsung noted HBM3E oversupply affecting pricing and is sampling HBM4, targeting volume production in 2025.

    2nmHBMSamsung
  • Arm’s FY begins with a record royalty quarter

    ➀ Arm's Q1 2026 revenue reached $1.05 billion, with royalty revenue up 25% year-over-year to $585 million, while licensing revenue dipped slightly to $468 million;

    ➁ Over 70,000 enterprises now use Arm Neoverse chips for AI workloads in data centers, powering platforms like NVIDIA Grace and AWS Graviton, with Arm projecting nearly 50% market share among hyperscalers this year;

    ➂ Arm launched Zena CSS, a compute subsystem for AI-driven automotive applications, accelerating vehicle development timelines by at least one year, with adoption by Tesla, Mercedes-Benz, and other major automakers.

    AIArmautomotive
  • Socionext licenses ADAS IP from aiMotive

    ➀ Socionext licenses aiMotive's aiWare IP and tools to develop chiplet-based SoCs for automotive ADAS;

    ➁ The collaboration aims to accelerate AI adoption in automotive solutions, integrating energy-efficient neural network accelerators;

    ➂ Partnership focuses on mass production-ready Custom SoCs with SDK support, enhancing road safety and intelligence.

    AI ChipChipletautomotive
  • EU-US Trade Pretty Level Already

    ➀ EU-US trade was broadly balanced before the tariff agreement, with the EU exporting more goods but importing significantly more services from the U.S., including intellectual property and IT services;

    ➁ The U.S. trade deficit with the EU dropped sharply to $58 billion in 2024, while the new 15% tariff on EU imports may reduce sales and disrupt supply chains;

    ➂ Global trade shifts and economic uncertainty could further burden European companies through redirected exports and delayed investments.

July 30

  • Infineon licenses auto IP to Skywater

    ➀ SkyWater licenses Infineon's mixed-signal ASIC design IP to enable secure U.S.-based manufacturing of high-reliability chips for automotive and defense systems;

    ➁ The IP, originally developed by Cypress Semiconductor, is validated in automotive-grade applications and will be deployed via SkyWater's S130 platform;

    ➂ The partnership aims to reduce offshore dependency and accelerate development of complex ASICs through proven IP integration and Technology as a Service (TaaS℠) support.

    Infineonautomotivesemiconductor
  • Q2 wafer shipments up 9.6% y-o-y

    ➀ Q2 2025 silicon wafer shipments rose 9.6% YoY to 3,327 million square inches (MSI), with a 14.9% QoQ increase from Q1;

    ➁ SEMI SMG highlights strong demand for AI datacenter chips, including HBM, while fab utilization for other devices remains low;

    ➂ Geopolitical and supply chain uncertainties may affect future silicon shipment trends despite current recovery signs.

    AIHBMsemiconductor
  • Three SSDs for AI datacentres

    ➀ Micron launched three datacentre SSDs, including the 9650 PCIe Gen6 with 28GB/s read speeds and liquid-cooling options for AI training/inference;

    ➁ The 6600 ION E3.S 122TB SSD offers 245TB capacity per drive, reducing storage footprint and energy consumption by up to 37% vs. HDDs;

    ➂ The 7600 PCIe Gen5 SSD focuses on low latency (sub-1ms) and energy efficiency for critical workloads, with samples of all three models shipping in 2025-2026.

    AIMicronSSD
  • Open Cosmos preparing 6GStarLab satellite for launch

    ➀ Open Cosmos is preparing to launch the 6GStarLab satellite, Europe's first in-orbit laboratory for 6G experimentation, aimed at validating new communication technologies in space;

    ➁ The project, led by i2CAT with contributions from MWSE and Transcelestial, is funded by Spain's Recovery Plan and EU NextGenerationEU, totaling €10 million;

    ➂ Scheduled for Q4 2025 launch, the satellite will feature multi-frequency devices and optical terminals, with ground control in Móra la Nova to advance terrestrial-nonterrestrial network integration.

    6GEUsatellites
  • Top Ten Fabless In Q1

    ➀ The article lists the top ten fabless semiconductor companies in Q1 2025, based on data from research firm TrendForce;

    ➀ It highlights the rankings and market dynamics within the fabless industry, emphasizing the role of key players in driving semiconductor innovation;

    ➂ The analysis underscores trends such as AI demand, memory advancements, and high-performance computing (HPC) influencing the competitive landscape.

    HPCmemorysemiconductor

July 29

  • Quad-core MCU for AI edge computing and HMI

    ➀ Renesas launches the RZ/G3E 64-bit MCU with a 1.8GHz quad-core Arm Cortex-A55, Cortex-M33, and a 512Gop/s Ethos-U55 NPU for AI tasks like image classification and anomaly detection.

    ➁ Supports dual 1080p@60Hz displays via LVDS, MIPI-DSI, and RGB interfaces, with Linux compatibility, low power consumption (50mW active, 1mW standby), and industrial temperature range (-40°C to 125°C).

    ➂ Features PCIe 3.0, USB 3.2 Gen2, CAN-FD, and Gigabit Ethernet, targeting edge computing and HMI applications with 15-year supply commitment and modular solutions from partners.

    AIArm
  • amsOSRAM sells ENI unit to Ushio

    ➀ amsOSRAM sold its Entertainment & Industry Lamps (ENI) unit to Japan's Ushio for €114 million, transferring 500 employees as part of its deleveraging plan;

    ➁ ENI generated €170 million in 2024 revenue, specializing in high-end lamps for semiconductor wafer fabrication and cinema;

    ➂ Ushio, with 6,000 employees, expands its industrial lighting portfolio, while amsOSRAM aims to raise over €500 million through strategic divestments to refocus on core markets.

    businesssemiconductor
  • RFFE market on a ~4.5% CAGR 2024-30

    ➀ The RF Front End (RFFE) market is projected to grow from $51.3 billion in 2024 to $69.7 billion by 2030, driven by 5G, consumer connectivity, and emerging 6G technologies;

    ➁ GaN technology is reshaping telecom infrastructure by replacing LDMOS, while automotive RF evolves with ADAS radars, UWB, and defense sectors adopt GaN for high-power broadband systems;

    ➂ Leading players like Qualcomm, Qorvo, and Infineon dominate key segments, alongside Chinese firms accelerating domestic RF solutions to reduce foreign dependency.

    GaNQorvoQualcomm
  • Global Space economy passes $600 billion milestone

    ➀ The global space economy grew 7.8% to $613 billion in 2024, driven by commercial sectors (78%) and government investments (22%), with U.S. civil and military spending at $77 billion;

    ➁ Record space launches in 2025 averaged one every 28 hours, led by SpaceX, while satellite broadband competition expanded with Amazon's Kuiper and OneWeb;

    ➂ U.S. military space funding prioritized the $25 billion Golden Dome missile defense system and infrastructure upgrades, signaling rapid growth in Earth Observation and sovereign space capabilities.

    GovernmentSatellite CommunicationsSpace
  • SEMI sees 7.4% 2025 growth for manufacturing equipment

    ➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 7.4% YoY to $125.5B in 2025, with further growth to $138.1B in 2026 driven by logic, memory, and next-gen technologies;

    ➁ Wafer Fab Equipment (WFE) and backend segments (test, assembly/packaging) show strong growth, fueled by AI, HBM demand, and advanced nodes like 2nm GAA, though automotive/consumer sectors lag;

    ➂ Regional investments led by China, Taiwan, and Korea face trade policy risks, while NAND/DRAM rebounds highlight memory's role in AI infrastructure.

    HBMmemorysemiconductor
  • 80V MXT MV MOSFET in TOLT package.

    ➀ Magnachip introduces the MDLT080N017RH, an 80V MXT MV MOSFET in a TOLT package with top-side cooling for efficient heat dissipation;

    ➁ The TOLT package reduces thermal resistance, making it ideal for high thermal demand applications like e-scooters and LEVs;

    ➂ Applications include e-bikes, power distribution systems, and battery management systems.

    Coolingautomotivesemiconductor

July 28

  • Tough cable for marine applications

    ➀ Huber+Suhner's Radox cables received DNV type-approval for critical marine energy systems, offering electrical performance and resistance to harsh conditions;

    ➁ The certified cables operate at voltages up to 1.5kVdc/1kVac across temperatures from -40°C to +130°C, complying with ISO 19642 and IEC 60332-1-2 standards for fire safety and durability;

    ➂ Available in 12 pre-certified sizes (4–120mm²), they target hybrid/electric vessels for battery systems, charging sockets, and auxiliary applications, with resistance to oils and fuels.

  • Intel’s Sorry Plight

    ➀ Intel's SEC filing suggests uncertainty about its 14A node development, hinging on securing external customers to justify continued investment;

    ➀ Employee morale and talent retention face risks due to potential project cancellations and R&D cuts, as competitors like TSMC outspend Intel in capex;

    ➂ The company’s struggle to maintain process leadership, despite its Moore’s Law legacy, highlights a strategic crisis threatening its long-term viability.

    IntelTSMCsemiconductor
  • Just couldn’t throw it away – cnc lathe gets a reprieve

    ➀ The author salvages a CNC lathe with irreplaceable faulty ballscrews by purchasing a cost-effective Chinese-made replacement through a UK supplier, though its compatibility with existing hardware posed challenges;

    ➁ Prototype 3D-printed bearing blocks and nut blocks were designed to adapt the new ballscrew, exhibiting ±50μm flex under load, prompting further refinement for rigidity;

    ➂ A 0.2° misalignment in the 3D printer was resolved through shimming, restoring printing accuracy and reigniting progress in the experimental repair project.

    3D printingMechanical Engineering
  • Tesla does $16.5bn deal to make ICs at Samsung’s Taylor, Texas fab

    ➀ Tesla signs a $16.5 billion deal with Samsung to produce next-gen AI6 chips at Samsung's Taylor, Texas fab, with Elon Musk emphasizing the strategic importance of the collaboration;

    ➁ Samsung's 2nm yield struggles and TSMC's dominance in 2nm technology led major clients like Apple and AMD to choose TSMC, leaving Samsung's Texas fab initially without customers;

    ➂ Construction of the Texas fab, 90% complete but unequipped due to lack of demand, has now secured Tesla's order and delayed its operational timeline to 2026.

    SamsungTeslasemiconductor manufacturing
  • Intel considers abandoning leading-edge production

    ➀ Intel may pause or discontinue development of its Intel 14A and successor nodes if external customer commitments are not secured, impacting future manufacturing plans;

    ➁ CEO Lip-Bu Tan emphasizes investments in Intel 14A will depend on confirmed customer needs and consistent execution to build trust;

    ➂ Intel will honor existing commitments for 18A production but future node expansion remains uncertain without major external contracts.

    IntelManufacturingsemiconductor
  • Optical transport market to return to growth this year

    ➀ The optical transport market is forecast to grow at 5% annually through 2029 after a 9% decline in 2024, reaching $19 billion;

    ➁ Growth is driven by AI datacenters and cloud providers investing in DCI technologies, including ZR/ZR+ optics and DWDM systems;

    ➂ Metro DCI shifts to IPoDWDM, while DWDM Long Haul for DCI projects 15% CAGR, with ZR/ZR+ optics revenue growing 20% annually.

    AIHPC
  • NASA examines onboard AI test for autonomous Dynamic Targeting EO

    ➀ NASA成功测试了搭载在CogniSAT-6立方星上的AI系统Dynamic Targeting,利用Ubotica的SPACE:AI平台实现实时地形分析,自主调整观测角度,避开云层干扰;

    ➁ 该技术通过预判轨道前方300英里范围,仅拍摄无云区域数据,将有效数据比例提升三分之二,未来将扩展至野火、极端天气等动态目标监测;

    ➂ 后续计划包括联邦自主测量(FAME)多卫星协同观测,并探索将技术应用于雷达监测冬季强对流冰暴等罕见气象事件。

    AINASAUbotica
  • Ed Gets An Offer He Can’t Refuse

    ➀ Ed receives a foreign government's offer to incarcerate UK prisoners at £12,000 per year, significantly below domestic costs;

    ➁ The proposal could save budgets and avoid new prison constructions but raises human rights and legal concerns;

    ➂ Ed plans to privately discuss with ministers to gauge reactions while emphasizing delicate negotiation stages requiring his personal involvement.

July 25

  • Isolated 500kHz 1mΩ current sensor ICs

    ➀ Allegro MicroSystems introduces CT4022 and CT4032 current sensors using tunnel magnetoresistance (TMR) technology, offering 500kHz bandwidth and lower noise compared to Hall effect solutions;

    ➁ Devices provide 1mΩ resistance, support ±12-65A current ranges, and feature different isolation ratings (up to 5kVrms) across two package types (8-pin/16-pin SOIC);

    ➂ Automotive-grade variants (AEC-Q100) are available, targeting industrial and automotive applications with high precision and temperature stability.

    automotivesensor
  • GamerCard combines Raspberry Pi Zero and handheld gaming

    ➀ The GamerCard integrates a Raspberry Pi Zero 2W, a 4-inch IPS display, and gaming controls into a credit-card-sized device for portable gaming;

    ➁ It features pre-loaded indie games (e.g., Bloo Kid 2) and supports emulation/retro gaming via platforms like RetroPie and PICO-8;

    ➂ Designed as an educational tool, it supports coding in MicroPython and C++, and ships worldwide for £125 with expandable ports like HDMI and USB-C.

    ArmRaspberry Pigaming
  • IEC 63171-6 connector for industrial single-pair Ethernet

    ➀ Kyocera introduced IEC 63171-6-compliant connectors for industrial single-pair Ethernet (T1), supporting 1Gbit/s data and power transmission over 40m;

    ➁ The product series includes PCB-mount jacks, pre-terminated cables, and floating couplers, with IP20 and higher certifications for rugged environments;

    ➂ Designed for industrial IoT and automation, it aims to simplify network infrastructure through standardized single-pair Ethernet ecosystems.

    Ethernetindustrial
  • When Programmables Got Stuck In A Niche

    ➀ The programmable logic sector (FPGA) outperformed the semiconductor market in 2008 but faces challenges competing with ASICs, with ASICs holding a significantly larger revenue share ($24B vs. FPGA's $3.6B);

    ➀ Industry leaders debate FPGA's potential in consumer markets, with SiliconBlue and Actel emphasizing low-power, cost-effective solutions (e.g., 2–20μW consumption, $1–$3 pricing) to revive FPGA growth against ASICs;

    ➁ The future of programmables may hinge on optimizing differentiation from ASICs through power efficiency rather than integrating fixed functionalities.

    ASICEDAsemiconductor
  • Productive Machines gets £0.5m from the Digital Catapult

    ➀ The UK's Digital Catapult invests £510,000 in Sheffield startup Productive Machines to support its autonomous milling optimization software, SenseNC, which simulates and optimizes CNC machine settings;

    ➁ SenseNC reduces waste, lowers costs, and improves sustainability and productivity, currently available for Siemens NX/Mastercam users and Siemens' Xcelerator Marketplace;

    ➂ The investment (via convertible loan) aims to expand Productive Machines' customer base and boost UK manufacturing reshoring efforts, with plans for direct sales and partnerships.

    SoftwareUK manufacturing
  • ST to buy NXP’s MEMS sensor business

    ➀ STMicroelectronics (ST) plans to acquire NXP’s MEMS sensor business for up to $950 million, with $900 million upfront and $50 million tied to technical milestones.

    ➁ The acquisition combines complementary MEMS technologies, enhancing ST’s portfolio across automotive safety, industrial, and consumer markets, leveraging ST’s IDM model for faster innovation.

    ➂ NXP’s MEMS division generated $300 million in 2024 revenue, with margins accretive to ST; the deal is expected to boost ST’s EPS and strengthen its position in automotive sensors and advanced MEMS applications.

    MEMSNXPSTMicroelectronics