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AnandTech

AnandTech 以其深度和详尽的硬件评测而闻名，其文章通常包括对硬件技术的深入分析和基准测试。

May 21

May 18

May 17

May 16

May 14

  • Supermicro E102-13R-H Review: A Raptor Lake-P 3.5" SBC System for Embedded Applications
    Single-board computers in the 3.5" form-factor have become extremely popular for embedded applications involving a mix of high performance requirements as well as extended peripherals support. Typical use-case scenarios include digital signage, edge inferencing solutions, retail applications, and IoT gateways. The requirements in these segments call for processors and components that can operate in a wide temperature range. The chassis and cooling solution handle other duties such as ruggedness and avoidance of moving parts. The Supermicro X13SRN-H-WOHS is a 3.5" SBC with a soldered-down Intel Core i7-1370PE - a Raptor Lake-P embedded processor with vPro support. It has plenty of I/O support, including a SlimSAS PCIe expansion slot. Supermicro also offers a ready-to-deploy solution using the SBC in the actively-cooled SYS-E102-13R-H box PC. This review takes a detailed look at the features and performance profile of the SYS-E102-13R-H, along with an evaluation of the thermal solution.

May 10

  • AMD Hits Record High Share in x86 Desktops and Servers in Q1 2024
    Coming out of the dark times that preceded the launch of AMD's Zen CPU architecture in 2017, to say that AMD has turned things around on the back of Zen would be an understatement.  Ever since AMD launched its first Zen-based Ryzen and EPYC processors for client and server computers, it has been consistently gaining x86 market share, growing from a bit player to a respectable rival to Intel (and all at Intel's expense). The first quarter of this year was no exception, according to Mercury Research, as the company achieved record high unit shares on x86 desktop and x86 server CPU markets due to success of its Ryzen 8000-series client products and 4th Generation EPYC processors. "Mercury noted in their first quarter report that AMD gained significant server and client revenue share driven by growing demand for 4th Gen EPYC and Ryzen 8000 series processors," a statement by AMD reads. Desktop PCs: AMD Achieves Highest Share in More Than a Decade  Desktops, particularly DIY desktops, have always been AMD's strongest market. After the company launched its Ryzen processors in 2017, it doubled its presence in desktops in just three years. But in the recent years the company had to prioritize production of more expensive CPUs for datacenters, which lead to some erosion of its desktop and mobile market shares. As the company secrued more capacity at TSMC, it started to gradually increase production of desktop processors. In Q4 last year it introduced its Zen 4-based Ryzen 8000/Ryzen 8000 Pro processors for mainstream desktops, which appeared to be pretty popular with PC makers. As a result of this and other factors, AMD increased unit sales of its desktop CPUs by 4.7% year-over-year in Q1 2024 and its market share achieved 23.9%, which is the highest desktop CPU market share the company commanded in over a decade. Interestingly, AMD does not attribute its success on the desktop front to any particular product or product family, which implies that there are multiple factors
    AMD财报

May 9

  • Sabrent Launches Rocket Nano M.2-2242 SSD: Up to 5 GB/sec
    Sabrent tends to get into news when it launches ultra-high-performance SSDs for enthusiast-grade desktops, but this week the company introduced a completely different type of product: a small form-factor M.2-2242 SSD aimed at Lenovo's Legion Go handheld and ultra-thin laptops that don't accomodate M.2-2280 drives. And even though it's not an enthusiast-grade drive, the Rocket Nano still boasts with quite decent performance and capacity. The Sabrent Rocket Nano 2242 (SB-2142) drive is based on the Phison E27T platform, a PCIe 4.0 x4 controller that is that is designed for mainstream DRAM-less SSDs, and in the case of the Rocket Nano, is paired with 3D TLC memory. The SSD is available in a single 1TB configuration, and is rated for read speeds up to 5 GB/s. Interestingly, the Phison E27T controller itself is rated for read speeds up to 7 GB/s, so it appears that the petite Rocket Nano isn't making full use of the controller's performance. Sabrent positions its Rocket Nano 2242 SSD as drives for upgrading Lenovo's Legion Go portable game console, select Lenovo ThinkPad laptops, and other M.2-2242-sized PCs that can't accomodate larger 2280 drives. Keeping in mind that most devices shipping with M.2-2242 SSDscome with pretty slow stock drives, Sabrent solution seems to be a viable product for such upgrades. All the while, Sabrent's Rocket Nano 2242 will also work in systems with a PCIe 3.0 x4 M.2 slots, so the market for these drives is pretty wide. Sabrent's Rocket Nano 2242 SSD 1 TB (SB-2142-1TB) SSD has a recommended price of $99.99, which is more or less in line with other 1 TB drives in the same form-factor and offering comparable performance. The SSD is currently available at Amazon for $101. Sources: Tom's Hardware, Sabrent
    SSD
  • Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330
    As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era. Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings. Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products. Source: Micron LPDDR5X LPCAMM2 Technical Brief It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering
    DRAMMicron

May 8

  • Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings
    Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues.  As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement. To clarify things for consumers, Intel has sent us the following statement: Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.   These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.   Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.   Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.   Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below: Click to En
  • ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th
    Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be introduced at the Next Level. AI Incredible virtual launch event on May 20. The launch of Asustek's new Vivobook S 15 will be hosted by Asus and will be joined by representatives of Qualcomm and Microsoft, who will reveal how they collaborated with PC maker to develop the first notebook based on Qualcomm's Snapdragon X Elite processors. These new SoCs promise to have a significant impact on the PC market in the coming quarters as they are based on the Arm instruction set architecture and are expected to bring together high performance, on-device AI acceleration, and long battery life.  Qualcomm itself calls systems powered by its Snapdragon processors as AI PCs, which is exactly how Asus calls it Vivobook S15 as well. Meanwhile, the only things we know about the machine for now is that it will be based on Qualcomm's Snapdragon X Elite or Snapdragon X Plus processors with 12 or 10 Oryon CPU cores (originally developed by Nuvia), a high-end Adreno GPU, and a 45 TOPS NPU; will come in a metallic chassis, and will feature a 15-inch display. "The launch event, which will feature a collaboration between Microsoft, Qualcomm, and Asus, celebrates the first of the new-era Asus AI PCs, which are set to redefine the very fabric of computing," a statement by Asus reads. "The new laptop will usher in a new era of Asus AI PCs, breaking traditional boundaries and harnessing advanced AI capabilities. With comprehensive support for the latest AI functionality from Asus and Microsoft, it offers personalized AI experiences tailored to individual requirements." Asus is also scheduled showcase its Vivobook laptops based on Qualcomm's processors at Computex in June. Actual systems will be available later this year.
    AI PCASUSQualcomm
  • Upcoming AMD Ryzen AI 9 HX 170 Processor Leaked By ASUS?
    In what appears to be a mistake or a jump of the gun by ASUS, they have seemingly published a list of specifications for one of its key notebooks that all but allude to the next generation of AMD's mobile processors. While we saw AMD toy with a new nomenclature for their Phoenix silicon (Ryzen 7040 series), it seems as though AMD is once again changing things around where their naming scheme for processors is concerned. The ASUS listing, which has now since been deleted, but as of writing is still available through Google's cache, highlights a model that is already in existence, the VivoBook S 16 OLED (M5606), but is listed with an unknown AMD Ryzen AI 9 HX 170 processor. Which, based on its specificiations, is certainly not part of the current Hawk Point (Phoenix/Phoenix 2) platform. The cache on Google shows the ASUS Vivobook S 16 OLED with a Ryzen AI 9 HX 170 Processor While it does happen in this industry occasionally, what looks like an accidental leak by ASUS on one of their product pages has unearthed an unknown processor from AMD. This first came to our attention via a post on Twitter by user @harukaze5719. While we don't speculate on rumors, we confirmed this ourselves by digging through Google's cache. Sure enough, as the image above from Google highlights, it lists a newly unannounced model of Ryzen mobile processor. Under the listing via the product compare section for the ASUS Vivobook S 16 OLED (M5606) notebook, it is listed with the AMD Ryzen AI 9 HX 170, which appears to be one of AMD's upcoming Zen 5-based mobile chips codenamed Strix Point. So with the seemingly new nomenclature that AMD has gone with, it has a clear focus on AI, or rather Ryzen AI, by including it in the name. The Ryzen AI 9 HX 170 looks set to be a 12C/24T Zen 5 mobile variant, with their Ryzen AI NPU or similar integrated within the chip. Given that Microsoft has defined that only processors with an NPU with 45 TOPS of performance or over constitute being considered an 'AI PC',
    AI PCAMDASUS
  • Apple Announces M4 SoC: Latest and Greatest Starts on 2024 iPad Pro
    Setting things up for what is certainly to be an exciting next few months in the world of CPUs and SoCs, Apple this morning has announced their next-generation M-series chip, the M4. Introduced just over six months after the M3 and the associated 2023 Apple MacBook family, the M4 is going to start its life on a very different track, launching alongside Apple’s newest iPad Pro tablets. With their newest chip, Apple is promising class-leading performance and power efficiency once again, with a particular focus on machine learning/AI performance. The launch of the M4 comes as Apple’s compute product lines have become a bit bifurcated. On the Mac side of matters, all of the current-generation MacBooks are based on the M3 family of chips. On the other hand, the M3 never came to the iPad family – and seemingly never will. Instead, the most recent iPad Pro, launched in 2022, was an M2-based device, and the newly-launched iPad Air for the mid-range market is also using the M2. As a result, the M3 and M4 exist in their own little worlds, at least for the moment. Given the rapid turn-around between the M3 and M4, we’ve not come out of Apple’s latest announcement expecting a ton of changes from one generation to the next. And indeed, details on the new M4 chip are somewhat limited out of the gate, especially as Apple publishes fewer details on the hardware in its iPads in general. Coupled with that is a focus on comparing like-for-like hardware – in this case, M4 iPads to M2 iPads – so information is thinner than I’d like to have. None the less, here’s the AnandTech rundown on what’s new with Apple’s latest M-series SoC. Apple M-Series (Vanilla) SoCs SoC M4 M3 M2 CPU Performance 4-core 4-core 4-core (Avalanche) 16MB Shared L2 CPU Efficiency 6-core 4-core 4-core (Blizzard) 4MB Shared L2 GPU 10-Core Same Architecture as M3 10-Core New Architecture - Mesh Shaders & Ray Tracing 10-Core 3.6 TFLOPS Display Controller 2 Displays? 2 Displays 2 Displays
    AI PCAppleApple M4NPU
  • VESA Rolls Out DisplayHDR 1.2 Spec: Adding Color Accuracy, Black Crush, & Wide-Color Gamuts For All
    VESA this morning is taking the wraps off of the next iteration of its DisplayHDR monitor certification standard, DisplayHDR 1.2. Designed to raise the bar on display quality, the updated DisplayHDR conformance test suite imposes new luminance, color gamut, and color accuracy requirements that extend across the entire spectrum of DisplayHDR tiers – including the entry-level DisplayHDR 400 tier. With vendors able to being certifying displays for the new standard immediately, the display technology group is aiming to address the advancements in the display technology market over the last several years, while enticing display manufacturers to make use of them to deliver better desktop and laptop displays than before. Altogether, the DisplayHDR 1.2 is easily the biggest update to the standard since it launched in 2017, and in many respects the first significant overhaul to the standard since that time as well. DisplayHDR 1.2 doesn’t add any new tiers to the standard (e.g. 1400), instead it’s all about increasing and/or tightening the specifications at each of its tier levels. In short, the VESA is raising the bar for displays to reach DisplayHDR compliance, requiring a higher level of performance and testing for more corner cases that trip up lesser displays. All of these changes are coming, in turn, after over half a decade of technology improvements in the display space. Whereas even the original DisplayHDR 400 requirements represented a modestly premium display in 2017, nowadays even sub-$200 displays can hit those relatively loose requirements as panels and backlighting solutions have improved. And even at the high-end of things, full array local dimming (FALD) displays have gone from hundreds of zones to thousands. All of which has finally pushed VESA’s member companies into allowing higher standards going forward.
    DisplayHDRVESA

May 4

  • Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools
    This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic design automation Synopsys, further notes that Samsung used the Synopsys.ai EDA suite to place-n-route the layout and verify design of the SoC, which in turn enabled higher performance. Samsung's unnamed high-performance mobile SoC relies on 'flagship' general-purpose CPU and GPU architectures as well as various IP blocks from Synopsys. SoC designers used Synopsys.ai EDA software, including the Synopsys DSO.ai to fine-tune design and maximize yields as well as Synopsys Fusion Compiler RTL-to-GDSII solution to achieve higher performance, lower power, and optimize area (PPA). And while the news that Samsung has developed a high-performance SoC using the Synopsys.ai suite is important, there is another, even more important dimension to this announcement: this means that Samsung has finally taped out an advanced smartphone application processor on its cutting-edge 3nm GAAFET process. Although Samsung Foundry has been producing chips on its GAA-equipped SF3E (3 nm-class, 'early' node) process for almost two years now, Samsung Electronics has never used this technology for its own system-on-chips for smartphones or other complex devices. To date, SF3E has been used mainly for cryptocurrency mining chips, presumably due to the inevitable early teething and yield issues that come with being the industry's first commercial GAAFET process. For now, Samsung isn't disclosing what specific process node is being used for the SoC; the official Samsung/Synposys announcement only notes that it's for a GAA process node. Along with their first-generation 3nm-class SF3E, Samsung Foundry has a considerably more sophisticated SF3 manufacturing technology that offers numerous improvements over SF3E, and is due to be used for mass production in the coming quarters. Given th
    EDAGAASamsungSynopsys

May 2

  • SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
    Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well. SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators. As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success. This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well. SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out. This leaves Samsung as the only me
    HBMHynix
  • The XPG Core Reactor II VE 850W PSU Review: Our First ATX 3.1 Power Supply
    Just over 18 months ago, Intel launched their significantly revised ATX v3.0 power supply standard, and with it, the 600 Watt-capable 12VHPWR cable to power video cards and other high-drain add-in cards. The release of the standard came with a lot of fanfare and excitement – the industry was preparing for a future where even flagship video cards could go back to being powered by a single cable – but shortly after, things became exciting again for all the wrong reasons. The new 12VHPWR connector proved to be less forgiving of poor connections between cables and devices than envisioned. With hundreds of watts flowing through the relatively small pins – and critically, insufficient means to detect a poor connection – a bad connection could result in a thermal runaway scenario, i.e. a melted connector. And while the issue was an edge case overall, affecting a fraction of a fraction of systems, even a fraction is too much when you're starting from millions of PCs, never mind the unhappy customers with broken video cards. So the PC industry is taking a mulligan on the matter, quickly revising the ATX specification and the 12VHPWR connector to fix their design flaws. In its place we have the new ATX v.3.1 power supply specification, as well as the associated 12V-2×6 connector, the combination of which are intended to serve the same goals, but with far less of a chance of errant electricity causing damage. Ultimately, the combination of the two new standards has required backwards-compatible changes on both the device (video card) side, as well as the power supply side. And as a result, power supply manufacturers are now in the process of releasing ATX v3.1-compliant PSUs that implement these revisions. For PSU vendors, the changes are relatively trivial overall, but they are none the less important changes that for multiple reasons, they are making sure to promote. Getting down to business, the first ATX v3.1 power supply to enter our testing labs comes from ADATA sub-bran
    Intel
  • AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great
    As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year. Most important among these is an update on their Zen 5 CPU architecture, which is expected to launch for both client and server products later this year. Highlighting their progress so far, AMD is confirming that EPYC "Turin" processors have begun sampling, and that these early runs of AMD's next-gen datacenter chips are meeting the company's expectations. "Looking ahead, we are very excited about our next-gen Turin family of EPYC processors featuring our Zen 5 core," said Lisa Su, chief executive officer of AMD, at the conference call with analysts and investors (via SeekingAlpha). "We are widely sampling Turin, and the silicon is looking great. In the cloud, the significant performance and efficiency increases of Turin position us well to capture an even larger share of both first and third-party workloads." Overall, it looks like AMD is on-track to solidify its position, and perhaps even increase its datacenter market share with its EPYC Turin processors. According to AMD, the company's server partners are developing a 30% larger number of designs for Turin than they did Genoa. This underscores how AMD's partners are preparing for even more market share growth on the back of AMD's ongoing success, not to mention the improved performance and power efficiency that the Zen 5 architecture should offer. "In addition, there are 30% more Turin platforms in development from our server partners, compared to 4th Generation EPYC platforms, increasing our enterprise and with new solutions optimized for additional workloads," Su said. "Turin remains on track to launch later this year." AMD's EPYC 'Turin' processors will be drop-in compatible with existing SP5 platforms (i.e., will come in an LGA 6096 package), which will facilitate its faster ramp and adoption of the platform both by cloud giants and server mak
    AMD

May 1

  • PCI-SIG Completes CopprLink Cabling Standard: PCIe 5.0 & 6.0 Get Wired
    The PCI-SIG sends word over this morning that the special interest group has completed their development efforts on the group’s new PCI-Express cabling standard, CopprLink. Designed to go hand-in-hand with PCIe 5.0 and PCIe 6.0, CopprLink defines both internal and external copper cabling for the latest PCIe standards, giving system vendors and assemblers the ability to use wires to connect devices within a system, or even whole systems. The CopprLink standard is, in practice, a pair of standards sharing the same brand-name under the PCI-SIG umbrella. The internal standard, “CopprLink Internal Cable”, is designed to allow for a new generation of PCIe cables up to 1 meter in length that are capable of sustaining PCIe 5.0 and PCIe 6.0 signaling. Internal CopprLink effectively supplants a host of older internal PCIe cabling standards (including the abandoned OCuLink), which were originally designed for earlier generations of PCIe signaling. At a high level, internal CopprLink is intended to provide not only host-to-device connectivity, but even more transparent backhaul applications such as motherboard-to-backplane connectivity, and unique applications such as chip-to-chip PCIe connections. In other words, CopprLink allows for cabled PCIe to be used in almost any situation where a PCIe connection needs to be established within a system. Strictly speaking, CopprLink doesn't replace the PCIe CEM connector in any way – but the relatively thick copper cables have less signal loss than PCB traces, making a cabled standard extremely useful even for internal connections. PCI-SIG sees CopprLink cables taking hold in the storage and data center markets, product categories where we already see PCIe cabling in use today. The companion connector standard for internal CopprLink is the SNIA-developed SFF-TA-1016 connector, which bears more than a passing resemblance to the widely-used SFF-8654 (SlimSAS) connector. SFF-TA-1016 is available in x4, x8, and x16 configurations, and while
    PCIe
  • Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year
    As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation) technology in the second half of the year. Meanwhile in June, Samsung Foundry will formally unveil its SF2 (2 nm-class) process technology, which will offer a mix of performance and efficiency enhancements. Finally, the company the company is preparing a variation of its 4 nm-class technology for integration into stacked 3D designs. SF2 To Be Unveiled In June Samsung plans to disclose key details about its SF2 fabrication technology at the VLSI Symposium 2024 on June 19. This will be the company's second major process node based upon gate-all-around (GAA) multi-bridge channel field-effect transistors (MBCFET). Improving over its predecessor, SF2 will feature a 'unique epitaxial and integration process,' which will give the process node higher performance and lower leakage than traditional FinFET-based nodes (though Samsung isn't disclosing the specific node they're comparing it to). Samsung says that SF2 increases performance of narrow transistors by 29% for N-type and 46% for P-type, and wide transistors by 11% and 23% respectively. Moreover, it reduces transistor global variation by 26% compared to FinFET technology, and cuts product leakage by approximately 50%. This process also sets the stage for future advancements in technology through enhanced design technology co-optimization (DTCO) collaboration with its customers. One thing that Samsung has not mentioned in context of SF2 is backside power delivery, so at least for the moment, there is no indication that Samsung will be adopting this next-gen power routing feature for SF2. Samsung says that the design infrastructure for SF2 – the PDK, EDA tools, and licensed IP – will be finalized in the second quarter of 2024. Once this happe
    2nmGAASamsung

April 29

April 23

  • Lexar SL500 Portable SSD Review: Silicon Motion SM2320 and YMTC NAND in a Potent Package

    Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced a number of portable SSDs targeting different market segments. The Lexar SL500 Portable SSD is one of the moderately priced 20 Gbps PSSDs in that set.

    The SL500 is able to achieve its price point thanks to the use of a native USB flash controller - the Silicon Motion SM2320. The unique aspect is the use of YMTC 3D TLC NAND (compared to the usual Micron or BiCS NAND that we have seen in previous SM2320-based PSSDs). Read on for a detailed look at the SL500, including an analysis of its internals and evaluation of its performance consistency, power consumption, and thermal profile.

    SSD