AnandTech
AnandTech 以其深度和详尽的硬件评测而闻名，其文章通常包括对硬件技术的深入分析和基准测试。
June 13
- Noctua Shows Off Thermosiphon Based CPU Cooler Prototype At Computex 20241. Noctua showcased a Thermosiphon-based CPU cooler prototype at Computex 2024, which operates without a pump and relies on natural thermodynamic principles. 2. The prototype features a 240mm radiator cooled by two Noctua fans, utilizing vaporization to absorb heat efficiently. 3. Although still in early development, the Thermosiphon technology promises improved cooling performance and reliability without the noise and mechanical issues of traditional AIO coolers.
- The Qualcomm Snapdragon X Architecture Deep Dive: Getting To Know Oryon and Adreno X11. Qualcomm is set to launch the Snapdragon X Elite and Snapdragon X Plus, with the chips already shipped to laptop partners and the first laptops expected to ship next week. 2. The Snapdragon X includes Qualcomm's new custom Arm v8 'Oryon' CPU core, Adreno GPU, and Hexagon NPU, emphasizing AI capabilities. 3. Oryon, as Qualcomm's first new high-performance CPU design from scratch in years, is crucial for Qualcomm's future in both Windows-on-Arm SoCs and traditional Snapdragon mobile SoCs.
- Samsung Foundry Unveils Updated Roadmap: BSPDN and 2nm Evolution Through 20271. Samsung has unveiled its updated roadmap at the Samsung Foundry Forum U.S., detailing the evolution of its 2nm-class nodes through 2027. 2. The roadmap includes the introduction of BSPDN technology and the development of a 1.4nm-class node by 2027. 3. Samsung also rebranded its SF3P node to SF2, aiming at high-performance devices with improved PPA benefits.
June 11
- SK hynix: GDDR7 Mass Production To Start in Q1'20251. SK hynix announced plans to start mass production of GDDR7 memory chips in Q1 2025, positioning itself as the last among major memory vendors to do so. 2. Samsung and Micron are ahead in the race, with Samsung already sampling and Micron aiming for early mass production this year. 3. SK hynix showcased GDDR7 chips at Computex 2024, highlighting their roadmap which includes 16Gbit and 24Gbit chips with data transfer rates up to 40 GT/s.
May 21
- Lenovo Unveils Yoga Slim 7x 14 Gen 14 and ThinkPad T14 Gen 6 Notebooks Powered By Qualcomm Snapdragon X Elite1、Lenovo Yoga Slim 7x Gen 14ThinkPad T14 Gen 6Qualcomm Snapdragon X Elite Windows on Arm。2、Yoga Slim 7x Gen 14 12.9 mmAI3、ThinkPad T14s Gen 6Microsoft 365。
May 16
- The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well1、Arctic Cooling Freezer 36 ARGB CPU soğutucusu, düşük bütçeli soğutma çözümüdür. 2、Soğutucu, 104 x 126 x 159 mm boyutlarında ve 920 gram ağırlığındadır. 3、Soğutucu, dört ısıboru sahip olup, maksimum 2000 RPM'ye kadar hızlanacak iki adet P12 FDB fan sahiptir.
- TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes1、TSMC 将生产基于 12nm 和 5nm 节点的下一代 HBM4 基底_die。 2、该公司正在与 Micron、Samsung 和 SK Hynix 等 MEMORY 厂商合作，使用高级逻辑 process 制作 HBM4 基底_die。 3、HBM4 基底_die 将采用 N12FFC+ 和 N5 两种制程技术，提供更高的性能和更低的功耗
- TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year1、TSMC将在2024年下半年开始大量生产N3P工艺，提高性能效率和transistor密度。2、N3E工艺已经实现大量生产，yield性能优良。3、N3P工艺是N3E的光学缩小版，具有更高的性能效率和transistor密度。
May 14
- Supermicro E102-13R-H Review: A Raptor Lake-P 3.5" SBC System for Embedded ApplicationsSingle-board computers in the 3.5" form-factor have become extremely popular for embedded applications involving a mix of high performance requirements as well as extended peripherals support. Typical use-case scenarios include digital signage, edge inferencing solutions, retail applications, and IoT gateways. The requirements in these segments call for processors and components that can operate in a wide temperature range. The chassis and cooling solution handle other duties such as ruggedness and avoidance of moving parts. The Supermicro X13SRN-H-WOHS is a 3.5" SBC with a soldered-down Intel Core i7-1370PE - a Raptor Lake-P embedded processor with vPro support. It has plenty of I/O support, including a SlimSAS PCIe expansion slot. Supermicro also offers a ready-to-deploy solution using the SBC in the actively-cooled SYS-E102-13R-H box PC. This review takes a detailed look at the features and performance profile of the SYS-E102-13R-H, along with an evaluation of the thermal solution.
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