➀ China's semiconductor industry is rapidly advancing, with significant developments in memory chip technology and AI chips. ➁ Despite US sanctions, Chinese companies like YMTC and SMIC continue to make strides in chip manufacturing and innovation. ➂ The Chinese government is heavily investing in the semiconductor sector, aiming to reduce reliance on foreign technology and become a global leader in the industry.

➀ Samsung plans to introduce its first High-NA EUV equipment, ASML’s EXE:5000, by the end of 2024 or early 2025, primarily for foundry operations. ➁ The company aims for full commercialization of High-NA EUV technology by 2027, collaborating with EDA companies to develop new mask designs. ➂ SK hynix is set to bring in ASML’s next-generation High-NA EUV machine, the EXE:5200, in 2026, with plans to apply it to advanced DRAM production.

➀ Japanese engineer Tsumoru Shintake has developed a four-mirror EUV system that is over ten times more efficient than current ASML scanners. ➁ The design reduces the number of mirrors from ten to four, cutting EUV light generation power by 92% and lowering manufacturing and maintenance costs. ➂ Despite its efficiency, the setup is unlikely to be commercially adopted due to reduced resolution and smaller field size, according to ASML and Zeiss.

1. proteanTecs introduces a Real Time Safety Monitoring (RTSM) solution for automotive electronics at DAC 2024; 2. The solution monitors chip performance in real-time under actual workloads to predict and prevent failures; 3. RTSM uses embedded sensors, sophisticated software, and AI to ensure system reliability and performance.

1. Researchers from Technical University of Berlin and Fraunhofer IZM developed a simulation to assess the quality of wire bonds in semiconductors. 2. The simulation helps understand how new, more durable wire materials affect bonding quality. 3. This innovation aids in reinterpreting shear codes for novel wire types, improving quality management in microelectronics.

1. Faraday Technology expands its MIPI D-PHY and V-by-One PHY IP support to 55nm to 22nm processes on UMC platform; 2. The company has shipped over 100 million video interface IP solutions for various applications including AIoT, industrial, consumer, and automotive; 3. This announcement highlights Faraday's commitment to providing advanced ASIC design services and IP solutions.

1. TSMC's Q2 revenue increased by 33% year-on-year to $20.8 billion, with net income up 36% to $7.6 billion. 2. Advanced technologies, including 3nm, 5nm, and 7nm, accounted for 67% of total wafer revenue. 3. The company expects strong demand for its leading-edge process technologies in the third quarter, driven by smartphone and AI-related applications.

1. Keysight's PD1550A Double Pulse Tester is introduced; 2. It performs repeatable measurements of wide-bandgap semiconductors.

1. The article discusses the unexploited piezoelectric properties of semiconductors, particularly those of gallium arsenide and cadmium sulphide. 2. By forming a depletion layer, these properties can be utilized to maintain high electric field strengths required for observing piezoelectric effects. 3. Resonant frequencies ranging from 300Mc/s to over 1,000 Mc/s are achievable, with ongoing research at Bell Telephone Laboratories aimed at increasing frequency and bandwidth.

1. The automotive semiconductor market is expected to grow significantly across various segments including logic, memory, microprocessors, analogue, opto, discretes, and sensors by 2027. 2. Auto memory revenue is projected to exceed $7 billion, while auto microprocessors are anticipated to reach over $15 billion. 3. Auto analogue, logic, optoelectronic devices, discretes, and sensors are also expected to see substantial revenue growth, driven by advancements in technology and increasing demand for sophisticated vehicle functionalities.

1. SK hynix plans to invest $74.6 billion over the next 3 years to strengthen its memory business. 2. An additional $58 billion will be invested in AI and semiconductors by SK Group. 3. The investments aim to enhance competitiveness in the AI market, including HBM chips and AI data centers.

1、NI 公司展示了其在测试行业中的 AI 视图。 2、CTO 케빈·슈츠解释说，今天的产品都是软件定义的，并且具有嵌入式 AI 和机器学习（ML），因此需要fundamental 上的变化。 3、NI 的 LabView AI 可以快速解析数据和规格，并提供专家主导的方法来加速开发。

1、PI（Physik Instrumente）LP提供基于石英石的多轴精密运动系统，用于晶圆测量和玻璃基板检测。 2、这些系统基于模块化概念，允许快速定制。 3、这些系统具有高精度和大旅行范围，能够满足半导体应用的需求。

1、台积电将在2025年推出N3X和N2P两种工艺技术，前者关注极致性能，后者关注能效和密度。 2、N3X相比N3P，可以降低7%的功耗或提高5%的性能。 3、N2P和A16将于2026年推出，前者是高性能版，后者是1.6nm级别的工艺技术，具备后端电源网络。

1、台積電计划扩展其特色技术生产能力，到2027年增长50%。 2、该公司将推出新的4nm N4e低功率生产节点，用于各种应用。 3、台積電预计未来四到五年内将其特色生产能力扩大到1.5倍。

1、TSMC将在2024年下半年开始大量生产N3P工艺，提高性能效率和transistor密度。2、N3E工艺已经实现大量生产，yield性能优良。3、N3P工艺是N3E的光学缩小版，具有更高的性能效率和transistor密度。