1. Samsung has filed a patent for a revolutionary foldable display. 2. The display can be expanded horizontally and resized based on usage. 3. The technology could change how we interact with devices.
Recent #Samsung news in the semiconductor industry
1. SK hynix reported a 125% annual increase in revenue for Q2 2024, driven by high demand for HBM memory in AI applications. 2. The company plans to mass-produce 12-layer HBM3e products and launch 32 Gb DDR5 DRAM for servers. 3. SK hynix is expanding its production capacity with new fabs and aims to solidify its position in the AI memory market.
1. The Galaxy Watch FE is an entry-level smartwatch model by Samsung Electronics Japan, set to be released on July 31st for 34,760 yen; 2. It offers over 100 workout measurements, body composition analysis, and insights into sleep habits and health to support lifestyle improvements; 3. The watch features an Exynos W920 processor, 1.5GB of memory, 16GB of storage, a 1.2-inch Super AMOLED display, and runs on Wear OS powered by Samsung with One UI 5 Watch interface.
1. Namhae Chemical's subsidiary, NES Materials, has provided a prototype of high-purity sulfuric acid to Samsung for chip production. 2. The sulfuric acid, used for cleaning wafers, is undergoing performance testing by Samsung. 3. NES Materials is a joint venture established in 2021.
1. TSMC's Trusted Foundry strategy has limited Samsung's market share to non-TSMC customers. 2. Intel's IDM 2.0 has shown impressive progress and could potentially take market share from Samsung. 3. TSMC's Foundry 2.0 strategy focuses on expanding products and services, with N2 and N2P technologies expected to lead in performance and power efficiency.
1. Samsung has validated its LPDDR5X-10700 memory with MediaTek's upcoming Dimensity 9400 SoC, achieving a speed of 10.7 GT/s. 2. The 16 GB LPDDR5X package provides a memory bandwidth of 85.6 GB/second, enhancing AI and graphics performance. 3. This collaboration aims to improve power efficiency by over 25% and enhance on-device AI capabilities.
1. Samsung announces the Galaxy Tab S6 Lite (2024) with an S Pen for under $500; 2. The tablet features a 10.4-inch display, Exynos 1280 processor, 4GB of RAM, and 64GB of storage; 3. It runs on Android 14 and includes a 7,040mAh battery.
1. Samsung has introduced a 61.44 TB SSD, the BM1743, using 7th generation V-NAND QLC memory. 2. The company plans to offer the drive in U.2 and E3.S form factors for PCIe 4.0 and 5.0 respectively. 3. Samsung envisions future drives reaching up to 120 TB capacity based on the same technology.
1. Neosem has become the first company to supply inspection equipment for CXL 2.0 memory production. 2. The equipment is used to determine the operability of CXL 2.0 memory modules. 3. The customer for this new equipment is Samsung.
1. Samsung is developing a new chip package technology to address overheating issues in application processors (AP). 2. The technology involves attaching a heat path block (HPB) on top of the SoC. 3. It is expected to be implemented in future Exynos chips.
1. Samsung is using molybdenum in the metalization process of its 9th generation V-NAND. 2. The company has acquired five molybdenum deposition machines from Lam Research. 3. Samsung plans to introduce twenty more units next year.
1. Samsung and SK Hynix, South Korean memory chipmakers, are planning to adopt hybrid bonding technology for their upcoming 3D DRAM products. 2. SK Hynix announced its intention to use wafer bonding, a form of hybrid bonding, in the production of 3D DRAM during the International Memory Workshop 2024 in Seoul.
1. Samsung has unveiled its updated roadmap at the Samsung Foundry Forum U.S., detailing the evolution of its 2nm-class nodes through 2027. 2. The roadmap includes the introduction of BSPDN technology and the development of a 1.4nm-class node by 2027. 3. Samsung also rebranded its SF3P node to SF2, aiming at high-performance devices with improved PPA benefits.
1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.
Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration
Samsung’s chip division has returned to profitability in the first quarter on the back of the recovery of the memory chip market.The South Korean electronics maker said on Tuesday that it recorded 71.92 trillion won in revenue and 6.61 trillion won in operating profit, an increase of 13% and 932%, r
Samsung was considering applying metal oxide resist (MOR) during the extreme ultraviolet (EUV) lithography process for its next-generation DRAM, TheElec has learned.MOR is considered the next-generation photoresist (PR) to the chemically amplified resist (CAR) currently used in the lithography of ad
Samsung’s smartphone business is planning to use OLED on silicon (OLEDoS) from Sony for its extended reality (XR) device, TheElec has learned.Samsung MX Business’ decision to use the Japanese company’s technology over its affiliate Samsung Display, which has also been developing its own OLEDoS techn
➀ Genuine marketing images of Samsung's upcoming Galaxy S25 Edge have emerged, showcasing three colorways: Jet Black, Icy Blue, and Silver.
➁ The S25 Edge is expected to be the thinnest Android flagship phone ever, with a thickness of around 5.8mm.
➂ It is powered by a Qualcomm Snapdragon 8 Elite processor, 12GB of RAM, and up to 512GB of storage.
➀ Samsung has launched a new line of monitors, including a glasses-free 3D gaming monitor;
➁ The G90XF model offers a 4K resolution and 165 Hz refresh rate with an autostereoscopic display;
➂ Samsung's Odyssey G8 OLED monitor, the G81SF, features a 4K QD-OLED panel running at 240 Hz.