1. ASML launches its latest High-NA EUV lithography machine, priced at $380 million, to advance semiconductor miniaturization; 2. The machine enables chips with 2nm and smaller nodes, extending Moore's Law and improving performance/power efficiency; 3. Intel is the first buyer, but mass production challenges and high costs may slow industry adoption.
Recent #Moore's Law news in the semiconductor industry
➀ 十九年前，在2006年的DATE会议上，飞利浦半导体首席技术官Rene Penning de Vries表示，当前的EDA技术无法处理被称为‘More than Moore’的新一代多样化技术；
➁ de Vries提到，为了将这些非CMOS技术在系统级封装（SiP）中集成，“需要我们今天不拥有的EDA环境”。“我们离那还很远，”他说；
➂ 然而，Cadence和Synopsys都对开发能够应对这一挑战的设计工具充满信心。
➀ Malcolm Penn at IFS2025 discussed the threat to Moore's Law, emphasizing that it is not technological challenges but a lack of competitive vigour that poses the threat. ➁ He cited Intel and Samsung's failure to catch up with TSMC in leading-edge processes as a contributing factor. ➂ Penn highlighted TSMC's cost management and the potential for price increases without competition, emphasizing the importance of cost reduction for industry growth.
➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.
➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.
➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.
➀ According to Jensen Huang, CEO of NVIDIA, AI is more likely to augment jobs than fully replace them, automating up to 80% of tasks.
➁ Huang compares this shift to the early invention of electricity, heralding the beginning of a new Industrial Revolution.
➂ He suggests that AI advancements are outpacing Moore's Law, with computing power increasing by a million times in 10 years.
➀ Dr. Tahir Ghani discussed the impact of Moore's Law and the challenges of energy efficiency in semiconductor technology. ➁ He highlighted the evolution of transistor technology over six decades. ➂ He advocated for new transistor designs and collaborations to improve energy efficiency for AI computing.
➀ TSMC's Mii presented a keynote at the 70th IEDM, discussing the semiconductor industry's growth and the impact of AI, predicting a revenue of one trillion dollars by 2030. ➁ He highlighted the evolution of logic technologies and introduced CFET architectures. ➂ He discussed the importance of advanced silicon stacking and packaging technologies.
➀ ASML's new CEO, Christophe Fouquet, discussed High NA EUV and the rapid adoption of the technology; ➁ Doubling the size of photomasks from 6″x6″ to 6″x12″ was proposed by Intel and supported by ASML; ➂ Intel has installed two High NA systems, showing significant improvement over standard EUV.
➀ Reversible computing is a model where the computational process is time reversible, aiming to minimize heat generation; ➁ Vaire Computing is developing near-zero energy chips using reversible computing principles; ➂ The company aims to disrupt the industry with its innovative technology.
➀ TSMC's Senior Vice President, Kevin Zhang, stated that as long as technological scaling continues, he is indifferent to the status of Moore's Law. ➁ Zhang emphasized that Moore's Law should not be narrowly defined by 2D scaling alone but should include advancements in 3D integration and advanced packaging. ➂ TSMC continues to improve PPA (Performance, Power, and Area) by over 30% with each node transition, highlighting the ongoing relevance of technological innovation.