➀ SambaNova introduces SambaManaged, an AI inference-optimized datacentre deployable in 90 days, far faster than the traditional 18-24 months;

➁ The solution uses air-cooled power (10kW), minimizes infrastructure changes, offers modular scalability, and supports open-source models to avoid vendor lock-in;

➂ Already adopted by a major US company, it provides efficient AI operations with options for managed services or self-operation as expertise grows.

➀ Key soldering tools on sale include the portable Fnirsi HS-01 and multifunctional Yihua 995D+ hot air station, offering portability and professional-grade performance.

➁ Essential accessories like magnetic helping hands, lead-free/leaded solder, and silicone mats enhance workspace safety and efficiency.

➂ Health-focused gear such as the Kotto fume extractor addresses ventilation concerns during soldering sessions.

➀ Fraunhofer FEP developed a roll-to-roll production method to create metal-polymer current collectors, replacing conventional metal foils with polymer substrates coated in copper/aluminum layers, improving battery energy density and safety;

➁ The novel collectors interrupt current flow during short circuits by melting the polymer layer, preventing thermal runaway, and use gas-cooled rollers for heat management during high-speed processing;

➂ Prototype pouch cells with these collectors matched traditional cells in performance tests, demonstrating industrial feasibility for next-gen lithium-ion batteries.

➀ Renesas launched three 650V GaN power transistors (TP65H030G4PRS/WS/QS) in TOLT, TO-247, and TOLL packages for server power supplies and e-mobility chargers, featuring silicon-compatible gate drive and enhanced thermal management;

➁ The Gen IV plus cascode design combines depletion-mode GaN HEMT and Si MOSFET, achieving 30mΩ on-resistance, a 4V threshold voltage, and 20% improvement in R_DS(on)·C_oss product;

➂ A 4.2kW totem-pole PFC evaluation kit (RTDTTP4200W066A-KIT) is provided, following Navitas Semiconductor's recent motor drive-focused GaN solution.

➀ Multiple users in Japan report overheating issues with Nintendo Switch 2, causing crashes in both demanding games like Cyberpunk 2077 and lighter titles like Pokémon;

➁ Thermal problems observed in both docked and handheld modes, with console temps reaching 47°C (117°F) docked and 39°C (102°F) handheld;

➂ Nintendo advises basic troubleshooting measures but cautions repairs may be needed if issues persist amid ongoing supply shortages.

➀ Fraunhofer researchers developed OPTIMA PRO and DressMAN360°, combining sensor measurements (temperature, noise, lighting) with worker surveys to holistically evaluate industrial workplace comfort;

➁ The approach addresses dynamic factory conditions (e.g., machinery noise, airflows) and subjective perceptions, aiming to enhance employee health and productivity;

➂ DressMAN360°, originally used in vehicle cabins, evolved into an industrial standard tool to reduce strain on workers and improve occupational appeal in manufacturing settings.

➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;

➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;

➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.

➀ Fraunhofer IAP develops ultrathin electrocaloric polymer films (4 micrometers) for refrigerant-free heating/cooling systems, targeting applications in vehicles, electronics, and laser systems;

➁ These polymers use electric fields to generate rapid temperature changes, enabling energy-efficient heat pump designs with alternating warm/cold zones;

➂ Multilayer stacking and material optimization enhance performance, offering eco-friendly alternatives to compressor-based refrigeration in the ElKaWe flagship project.

➀ Fraunhofer IAP develops ultrathin electrocaloric polymer films (4μm) for efficient heating/cooling systems that eliminate harmful refrigerants;

➁ Applications include automotive interiors, battery modules, and electronics, leveraging temperature changes via electric field modulation;

➂ Part of the ElKaWe project, aiming to replace traditional compressor-based systems with eco-friendly polymer-based heat pumps.

➀ Jiushark launches JF15K Diamond, a budget-friendly CPU air cooler with dual-tower heatsinks and four 100mm PWM fans, supporting up to 280W TDP;

➁ The 153mm-height cooler offers wide compatibility for motherboards and memory modules, featuring ARGB lighting in black/white variants;

➂ Priced at 260–280 Yuan ($36–39), it targets the mid-range cooling market with a focus on cost-effective thermal performance.

➀ Fraunhofer IWU launches an 80 kW fuel cell test stand to evaluate performance, durability, and reliability of fuel cell systems under varied operational conditions, supporting the industrial scale-up of hydrogen technologies;

➁ The facility expands testing infrastructure with additional units for electrolyzers and component-level analysis, including impedance measurements and material testing to optimize production costs and functionality;

➂ Collaboration with the Hydrogen Lab Görlitz and regional partners strengthens Saxony’s position as a hydrogen research hub, focusing on large-scale electrolysis simulation and climate-resilient testing.

➀ Noctua has released its new flagship NF-A12x25 G2 120mm fan, introducing several innovations for improved performance-to-noise efficiency.

➁ The G2 features a new motor design and blade geometry, including an optimized Progressive Bend impeller and a new Centrifugal Turbulator Hub.

➂ The fan is available in various versions, including PWM and ultra-quiet LS-PWM, and comes with a 6-year warranty.

➀ X Display Company (XDC) unveiled a 1 million FPS microLED display paired with a high-speed camera for machine-to-machine communication, potentially reaching 1 Tb/s speeds;

➁ The system offers 2-3x higher energy efficiency than 800G optical transceivers and eliminates physical cables, but requires high-speed encoding/decoding and infrastructure redesign;

➂ While promising for hyperscale data centers, challenges remain in practical implementation and industry adoption beyond niche applications.

➀ AI GPU power consumption is projected to reach up to 15,360W by 2035, driven by higher compute and HBM integration;

➁ Advanced cooling methods like immersion cooling (for 4,400W-9,000W GPUs) and embedded cooling structures (for 15,360W) will be critical;

➂ Innovations include thermal transmission lines, fluidic TSVs, and double-sided interposers to manage extreme thermal loads.

➀ Microchip Technology's reference design proposes an intelligent cooling plate using a PIC16F17146 microcontroller and Peltier technology for precise thermal management in electronics;

➁ The design integrates Core Independent Peripherals (CIPs) to handle temperature monitoring, current sensing, and user interfaces, minimizing external components and cost;

➂ It features safety mechanisms like fault detection, fan monitoring, and EMI-friendly regulators, making it suitable for industrial, laboratory, and consumer applications.