<p>➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;</p><p>➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;</p><p>➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.</p>