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June 24
- Soft Test Method For Micro-LED Wafers
➀ Researchers at Tianjin University developed a non-destructive 'soft-touch' testing method for micro-LED wafers using flexible 3D probes with minimal pressure (0.9 MPa) to prevent surface damage;
➁ The system achieves 1/10,000th the pressure of traditional probes, ensuring wafer integrity and extending probe lifespan to over 1 million cycles;
➂ This innovation addresses critical quality control challenges in micro-LED production, enabling efficient yield screening and showing potential for commercialization in flexible electronics.
- World’s First Automotive 5G Satellite Module
➀ LG Innotek unveiled the world's first automotive 5G communication module with satellite connectivity, enabling high-speed data transmission (tens of Mbps) in remote areas via 30MHz NR-NTN bandwidth;
➁ The module reduces latency to hundreds of milliseconds, supports real-time video/voice services, and ensures emergency connectivity for autonomous vehicles under 3GPP Release 17 standards;
➂ Designed for software-defined vehicles, it enhances navigation updates and safety systems, aligning with LG's goal to expand automotive components into an $800M business.
- JOB: Engineer/ Sr. Engineer – Electronics At WIKA In Chennai
- World’s Highest 321-Layer 4D NAND Flash
➀ SK Hynix unveiled a UFS 4.1 storage solution using 321-layer 4D NAND flash, marking the industry's highest layer count;
➁ It delivers 4300MB/s read speed, 15%-40% faster random operations, 7% power efficiency improvement, and ultra-thin 0.85mm design for AI smartphones;
➂ The 1Tb TLC chip will expand to SSDs, strengthening SK Hynix's position as a full-stack AI memory provider.
June 23
- JOB: Test Technician At Alstom In Bengaluru
- JOB: EV Trainer At Imperial Society of Innovative Engineers (ISIE) In Aurangabad
- JOB: Testing Technician In Bengaluru at Ohmium
- JOB: MOD/SSD Process Engineer At Micron Technology In Sanand
- High Speed, Low Power 3D Chip Integration Tech
➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;
➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;
➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.
- Low-power DRAM For Faster AI On Smartphones
➀ Micron Technology introduces the world's first LPDDR5X memory using 1γ node technology, achieving 10.7 Gbps speed and 20% power savings;
➁ The ultra-thin 0.61mm package enables slimmer designs for smartphones and foldable devices, supporting on-device AI tasks like real-time translation and image generation;
➂ Performance tests show 30-50% faster AI responses compared to previous generations, with potential applications in AI PCs and automotive systems.
June 20
- JOB: Technical Support Engineer – Electronics / Electrical At Vision Mechatronics Private Limited In Thane
- Electronics And Embedded Engineering Internship At Apeiron Mobility In Bengaluru
➀ Apeiron Mobility offers a 6-month full-time internship in Bengaluru for electronics and embedded engineering, requiring skills in PCB design, C programming, and microcontroller development;
➁ Responsibilities include hardware prototyping, firmware development for 8/32-bit microcontrollers, and end-to-end project execution from ideation to testing;
➂ Successful candidates may receive job offers with annual salaries ranging from ₹200,000 to ₹600,000, along with certifications and recommendation letters.
- 60GHz mmWave Sensor Reference Design
➀ The system encountered an upstream connection termination error before processing HTTP headers;
➁ Reset was triggered due to connection interruption at the network level;
➂ The error indicates a potential server or infrastructure stability issue.
- The World’s First Neuromorphic Microcontroller
➀ Innatera launched Pulsar, the world’s first neuromorphic microcontroller, using brain-inspired Spiking Neural Networks (SNNs) and combining a RISC-V CPU with hardware accelerators for mixed AI processing;
➁ The chip achieves ultra-low power consumption (e.g., 600 µW for radar-based detection) and reduces latency by 100x while enabling on-device sensor data processing for wearables, IoT, and automotive applications;
➂ Pulsar supports standalone intelligent sensor modules, eliminates cloud dependency, enhances data privacy, and allows on-device adaptive learning for edge systems.
June 19
June 18
- JOB: Engineer, PCB Design At Molex In Bengaluru
- JOB: Principal/Staff Serdes Design Engineer At Fermionic Design Private Limited In Bengaluru
- JOB: Senior Engineer – Electronics Board Design engineer (Analog and Digital Design) At Thales In Bengaluru
- USB Cameras With Enhanced Speed And Performance
➀ Infineon Technologies collaborates with CIS Corporation to launch high-speed USB cameras powered by EZ-USB FX10/FX5 controllers, achieving up to 275% faster data transfer via USB 3.2 (5/10 Gbit/s);
➁ Integrated USB-C orientation detection and compact design reduce component needs, lowering costs and enabling deployment in medical, logistics, and robotics applications;
➂ Models with resolutions up to 20M pixels and 4K support will enter production in July, featuring CIS's Clairivu image processor and ultra-compact form factors.
- 1.6kW LLC Resonant AC-DC Converter Reference Design
➀ Toshiba's 1.6kW reference design converts 100-200V AC to 54.5V DC for 48V server systems in data centers, using MOSFET-based active bridges and interleaved PFC technology;
➁ The 3-phase LLC resonant converter with Y-connected transformers and Toshiba's TMPM372FWUG microcontroller achieves Titanium-level efficiency (exceeding 80 PLUS standards) and balanced power distribution;
➂ Modular design with separate control/power boards simplifies maintenance and supports 1U rack integration, enhancing data center energy efficiency and scalability.
- 3D Chips Could Make Electronics Faster
➀ MIT researchers developed a low-cost method to integrate gallium nitride (GaN) transistors onto standard silicon chips using copper bonding, enabling higher performance and efficient scaling;
➁ The process eliminates wafer-level bonding, reduces GaN material waste by 95%, and operates at temperatures below 400°C to prevent thermal damage;
➂ Demonstrated power amplifiers showed superior bandwidth and signal gain, with potential applications in consumer electronics, AI infrastructure, and quantum computing.
- Single-Chip Timing Solution For AI Clusters
➀ SiTime Corporation introduces the SiT5977 Super-TCXO, a single-chip timing device with 80 femtosecond phase jitter and support for 800G+ interconnects, designed for AI clusters and datacenters;
➁ The device consolidates multiple timing components, reduces board complexity, and simplifies power supply design by eliminating external LDOs;
➂ Enhances AI cluster efficiency through precise synchronization, dynamic frequency adjustment, and improved energy utilization while addressing datacenter scalability challenges.
- The Most Compact 2D MEMS Evaluation Kit
➀ OQmented introduces the HYPERION Evaluation Kit, featuring a 1.3mm MEMS mirror with adjustable 15°-70° field of view and dual-axis scanning at 35kHz/19kHz frequencies;
➁ Integrated UltraDRIVE electronics with energy recovery and vacuum packaging enable high-speed, stable operation in compact designs;
➂ Targets AR, biomedical, and industrial applications with 3-5V power input, low consumption, and robust integration capabilities.
June 17
- “To Build On Our R&D Capabilities, We Provide Customised Drone Development Services”- Rohith Dacharla, Parova Technologies
➀ Parova Technologies, founded by Rohith Dacharla in 2019, offers customized drone design and development services, particularly aiding startups and students with limited resources in UAV development;
➁ The company is focused on creating a city-to-city logistics drone network (Bajrang project), utilizing cost-effective materials like 3D-printed recycled plastic and collaborating with Indian manufacturers for locally sourced components;
➂ Challenges include R&D funding, balancing customer budgets, and navigating partnerships while emphasizing innovation in propeller design and sustainable logistics solutions.
- JOB: Executive – Electronics and Instrumentation At Bangalore International Airport Ltd In Bengaluru
- JOB: PCB Designer At Kura System In Delhi
- JOB: CAD Designer At Rockwell Automation In Bengaluru
- JOB: Power Supply Design & Testing Engineer At Rug-Rel Components & Systems Pvt Ltd In Bengaluru
- Quantum Dot CMOS Sensor For X-Ray And SWIR
➀ CSEM and QDI Systems developed a quantum dot CMOS sensor that directly converts X-rays to signals and operates across X-ray, visible light, and SWIR spectrums;
➁ The sensor eliminates traditional components like scintillators, uses spray-coated quantum dots on CMOS chips, and enables cost-effective mass production;
➂ Applications span medical imaging (low-radiation X-rays), industrial inspection, agriculture, and environmental monitoring.