➀ Onsemi推出首款基于1200V碳化硅（SiC）MOSFET的SPM 31智能电源模块（IPMs），提供更高的能效和功率密度，同时减小了体积。
➁ 这些模块适用于多种工业系统，如AI数据中心的EC风扇、热泵、HVAC系统、伺服电机、变频驱动器（VFD）以及工业泵和风扇，可显著降低能耗和成本。
➂ SPM 31 IPMs具有低损耗、内置低压保护、统一PCB设计支持不同电流选项等特点，有助于减少开发时间并提高整体系统安全性。
Recent #Power Modules news in the semiconductor industry
➀ Infineon Technologies has unveiled the next generation of high-density power modules to enhance AI and HPC capabilities.
➁ The OptiMOS TDM2454xx modules offer industry-leading power density and efficiency, optimizing the total cost of ownership for AI data center operators.
➂ These modules feature vertical power delivery (VPD) to reduce resistive losses and improve performance, building upon the success of previous dual-phase modules.
➀ The power module packaging materials market is expected to reach nearly $6.1 billion by 2030, with a CAGR of nearly 11% between 2024 and 2030;
➁ Packaging materials costs accounted for approximately 32% of the total cost of power modules in 2024;
➂ The market is being reshaped with new entrants, M&As, and strategic shifts.
1. Texas Instruments has introduced six new power modules that are up to 23% smaller and offer higher power density. 2. The modules utilize MagPack™ technology, which is 50% smaller than previous generations and maintains excellent thermal performance. 3. These advancements are crucial for sectors like data centers where power efficiency and space optimization are critical.