➀ Apple is set to unveil its new M4 family of processors; ➁ The new MacBook Pros will be powered by the M4, M4 Pro, and M4 Max SoCs; ➂ TSMC's 3nm process node is used for the new processors.

➀ Analog Bits showcased its on-die sensing IP and power management solutions at TSMC OIP; ➁ The company highlighted its progress in 3nm and 2nm technology nodes; ➂ Collaborations with Arm were discussed, focusing on power management and clocking IPs.

➀ NVIDIA's Blackwell AI GPU issues caused tension with TSMC; ➁ NVIDIA considered Samsung for GeForce RTX 50 series GPU production; ➂ TSMC and NVIDIA blame each other for the defects.

➀ NVIDIA's Blackwell AI GPUs are 'sold out' for the next 12 months due to high demand; ➁ The GPUs are in high demand among major tech companies like Google, Meta, and Microsoft; ➂ Despite the delay in production, Blackwell is expected to deliver significant performance improvements for AI training and inference.

➀ TSMC's 3DBlox framework addresses complexities in 3DIC design; ➁ Innovations in 2024 focus on simplifying 3D design challenges; ➂ TSMC's strategies for managing electrical and physical constraints in 3DIC systems.

➀ AMD is reportedly set to produce next-gen, high-performance HPC AI chips at TSMC's new Arizona fab; ➁ This makes AMD the second major client for the new fab after Apple; ➂ Production is expected to begin in 2025 at TSMC's 5nm process node.

➀ Apple's new A18 Pro and A18 SoC die sizes are compared; ➁ The A18 Pro has a 105mm² die size, while the A18 is 90mm²; ➂ Apple is using TSMC's N3E node for fabrication, which has a lower density than N3B.

➀ Apple's iPhone 18 in 2026 will use TSMC's 2nm chips; ➁ Some iPhone 18 models might have 3nm chips; ➂ iPhone 17 models will use 3nm chips in 2025.

➀ ByteDance is developing two AI GPUs to be produced on TSMC's 5nm process node; ➁ Expected to enter mass production in 2026; ➂ The move is to reduce reliance on NVIDIA and comply with US export regulations.

➀ Analog Bits is aggressively moving to advanced nodes, with new IP developments at 3nm and 2nm. ➁ The company continues to enhance its catalog with technologies like glitch detection, power management, and high-accuracy PVT sensors. ➂ The future may see Analog Bits integrating AI for adaptive control, enhancing system performance and power efficiency.

➀ Weebit Nano is leading the ReRAM revolution, addressing the limitations of flash memory. ➁ TSMC and other foundries are exploring and adopting ReRAM technology. ➂ ReRAM is gaining momentum in various applications, including AI and automotive.

1. TSMC reported record revenue in Q2-2024, indicating the semiconductor industry is recovering from a downcycle. 2. The company introduced its Foundry 2.0 strategy, focusing on advanced packaging and 3D integration. 3. TSMC is transitioning from a components company to a subsystems company, aiming to control more of the supply chain.

1. TSMC declined NVIDIA's request for a dedicated packaging line for its GPUs. 2. The request was made during a meeting between NVIDIA CEO Jensen Huang and TSMC executives. 3. TSMC is struggling to meet the high demand for advanced packaging capacity due to the booming AI market.

1. TSMC's Trusted Foundry strategy has limited Samsung's market share to non-TSMC customers. 2. Intel's IDM 2.0 has shown impressive progress and could potentially take market share from Samsung. 3. TSMC's Foundry 2.0 strategy focuses on expanding products and services, with N2 and N2P technologies expected to lead in performance and power efficiency.

1. TSMC's Q2 2024 revenue reached $20.82 billion, marking the best quarter in the company's history. 2. HPC revenue share exceeded 52%, driven by AI processor demand and a rebound in the PC market. 3. Advanced technologies (N3, N5, N7) accounted for 67% of total wafer revenue, with N3 process technologies contributing 15%.

1. TSMC and Global Unichip have secured bulk orders for base dies used in SK hynix's next-gen HBM4 memory. 2. The collaboration between TSMC and Creative is focused on developing HBM key peripheral components for AI servers. 3. The industry anticipates significant changes in HBM4, including increased stack height and the integration of logic ICs to enhance bandwidth transmission speeds.

1. NVIDIA has reportedly placed additional orders with TSMC for its Blackwell platform chips, including GB200, B100, and B200, due to high demand for AI chips. 2. The increased production volume has led to a surge in orders for back-end packaging and testing plants, with ASE Investment Holdings and KYEC experiencing a doubling of related order volume. 3. The complexity and testing time for NVIDIA's new Blackwell chips have increased, positively impacting the average selling price and gross profit margin of third-party companies involved in the testing process.

1. TSMC is exploring a 'radically new' semiconductor packaging technique called panel-level packaging. 2. Panel-level packaging uses rectangular substrates instead of conventional round wafers, which can accommodate more chips. 3. The research is still in early stages and would require significant development of production tools and materials, as well as a potential overhaul of facilities for a long-term plan.

1. Bernstein analysts have increased the price target for TSMC's shares; 2. TSMC is expected to exceed its 2024 guidance driven by demand from US tech giants and the success of the N3 process node; 3. Continued growth in data center AI revenue and the launch of new smartphones with AI capabilities contribute to TSMC's success.

1. TSMC's construction of its new CoWoS advanced packaging plant in Chiayi, Taiwan was halted this month after archaeological ruins were discovered. 2. TSMC has proposed a plan to build a second CoWoS advanced packaging facility in the Southern Science Park Administration of the National Science and Technology Council. 3. A cultural review meeting has been convened, and it was resolved that construction process will be monitored daily, regardless of whether it's a sensitive area or not.