1. TSMC's 3nm process capacity for 2024 is fully booked by Apple and Intel; 2. AMD, NVIDIA, and Qualcomm must wait until 2025 for 3nm orders; 3. TSMC is expanding production but faces intense competition among clients for advanced chip capacity.
Recent #TSMC news in the semiconductor industry
1. TSMC accelerates its 2nm chip production timeline to 2025, ahead of original plans; 2. The 2nm technology promises significant performance and power efficiency improvements for AI and mobile devices; 3. The move reinforces TSMC's leadership in advanced semiconductor manufacturing amid growing global demand.
➀ In 2011, Intel announced plans for a 450mm wafer pilot line by 2015, targeting test wafers in 2012 and equipment readiness by 2013;
➁ Developing 450mm fab equipment was estimated to cost $20 billion, with unclear funding sources and a pending EU proposal;
➂ Only Intel, Toshiba, TSMC, and Samsung were deemed financially capable of adopting 450mm fabs at the time, amid skepticism about Intel's execution capabilities.
1. TSMC's 3nm process adoption is slower than expected, with key clients like Apple, Qualcomm, and MediaTek showing limited interest; 2. Intel's potential outsourcing of 3nm chips may partially offset reduced demand from other clients; 3. Challenges include high production costs, yield issues, and competition from Samsung's 3nm technology.
1. TSMC plans to adopt ASML's High-NA EUV lithography machines for its A16 chip manufacturing technology, targeting 1.7nm process nodes by 2027; 2. The A16 technology focuses on improving power efficiency and performance for AI and data center applications; 3. TSMC's move intensifies competition with Intel, which is developing its 14A (1.4nm) process using similar advanced tools.
➀ TSMC dominates advanced semiconductor processes, leading to Samsung's 56% profit drop due to HBM delays and foundry losses;
➁ Euro-processor developer SiPearl secures €130m funding amid EU tech sovereignty efforts;
➂ Google invests in nuclear fusion, fission, and renewables to meet surging datacenter energy demands, targeting carbon neutrality by 2030.
1. TSMC plans to adopt ASML's next-generation High-NA EUV lithography machines for its A16 chip manufacturing process by 2026; 2. The technology enables higher resolution and efficiency, supporting advanced chip production; 3. The A16 process aims to compete with Intel's 14A node, reinforcing TSMC's leadership in cutting-edge semiconductor manufacturing.
➀ TSMC reported Q2 2025 revenue of $31.9 billion, a 38.6% YoY increase, with January-June total reaching $60 billion (up 40% YoY);
➁ June revenue dipped 17.7% MoM to $9 billion but rose 26.9% YoY;
➂ AI and HPC now account for 59% of revenue (up from 46% in 2024), with full-year growth projected in the mid-20% range.
1. TSMC announces groundbreaking 3nm semiconductor process technology with improved performance and energy efficiency; 2. The technology is expected to solidify TSMC's leadership in advanced chip manufacturing, outperforming competitors like Intel and Samsung; 3. Major tech companies are anticipated to adopt the 3nm nodes for next-gen devices, driving AI, 5G, and high-performance computing markets.
➀ TSMC faces a U.S. class-action lawsuit with over 30 plaintiffs alleging systemic bias against non-Asian employees, unsafe working conditions, and harassment at its Arizona fab;
➁ Accusations include racial slurs, Mandarin-language exclusion, preferential hiring of Taiwanese workers, and purchasing safety gear from Temu;
➂ TSMC denies allegations, emphasizing diversity, while employees describe toxic work culture with high turnover and extreme pressure.
➀ The semiconductor industry's high costs have consolidated leading-edge logic fabs to three players: TSMC, Samsung, and Intel;
➁ TSMC's conservative 2nm strategy with GAA/BSPD adoption secured majority market share, while Samsung and Intel faced yield failures and customer losses;
➂ Revenue dominance at 2nm positions TSMC to monopolize future generations, leaving rivals' foundry prospects uncertain.
➀ TSMC denies delaying Japan/Germany fabs, stresses U.S. expansion won't disrupt other regions;
➀ Arizona Fab 21 phase 2 accelerated for 2027 3nm AI chip production;
➂ Japan/Germany delays attributed to infrastructure readiness, not resource allocation.
➀ Samsung delays equipping its Texas fab to 2026 due to lack of customers for its 2nm process;
➁ TSMC dominates 2nm production with Apple, MediaTek, and AMD as major clients, planning significant capacity expansion;
➂ Intel faces challenges with its 18A process amid high TSMC wafer costs impacting industry competition.
1. TSMC plans to mass-produce 2nm chips in 2025 using GAAFET technology, improving performance and energy efficiency; 2. TSMC's 2nm process is expected to outperform Intel's 18A node, intensifying competition in advanced chip manufacturing; 3. The breakthrough will benefit AI, HPC, and mobile devices, with Apple likely being the first major customer.
1. TSMC's market value plummeted by $420 billion, triggering shockwaves in global tech stocks; 2. The crash impacts global semiconductor supply chains and investor confidence; 3. Analysts attribute the decline to weakening chip demand and geopolitical uncertainties.
1. TSMC faces challenges in Arizona due to insufficient skilled workers and union opposition, delaying 4nm chip production to 2025; 2. The company is sending Taiwanese technicians to accelerate progress, sparking local worker dissatisfaction; 3. TSMC's Japan expansion progresses smoothly with government support, contrasting with US struggles.
➀ Intel may halt marketing its 18A process to foundry customers, focusing instead on 14A, which could leverage high-NA EUV advantages to compete with TSMC;
➁ TSMC dominates the 2nm foundry market with high yields and significant planned capacity (50k wpm by 2025, 120-130k wpm by 2026), securing major clients like Apple and AMD;
➂ Existing 18A contracts with Microsoft and Amazon will continue, though Intel’s strategic shift aims to prioritize 14A for future competitiveness.
1. TSMC achieves mass production of 3nm chips, with Apple as a key client for future iPhones; 2. The breakthrough strengthens TSMC's leadership in advanced chip manufacturing, impacting competitors like AMD and NVIDIA; 3. 3nm technology enables higher performance and energy efficiency, driving innovation in AI, 5G, and autonomous vehicles.
➀ Yole Group predicts China will dominate global semiconductor foundry capacity by 2030, reaching 30% share despite US sanctions;
➁ China's wafer production surged to 8.85M/month in 2024, with 18 new fabs like Huahong Semiconductor driving growth;
➂ The US relies heavily on imports (57% demand vs. 10% production), but ongoing TSMC/Intel projects and tech export controls add uncertainty to China's advanced chip ambitions.
1. TSMC achieves a breakthrough in 2nm semiconductor technology using Gate-All-Around (GAA) transistors, enhancing performance and energy efficiency; 2. Mass production is expected by 2025, solidifying TSMC's leadership in advanced chip manufacturing; 3. The development intensifies competition with Intel and Samsung in next-generation semiconductor nodes.