➀ Siemens for Startups is a program designed to empower early-stage engineering and manufacturing startups by accelerating innovation and streamlining development processes. ➁ The program includes three pillars: Connect, Collaborate, and Empower, aiming to provide startups with access to global markets, advanced capabilities, and essential software tools. ➃ Siemens partners with AWS to enhance the program, offering startups advanced software, generative AI, and cloud services, enabling them to bring their ideas to life quickly and drive industry transformation.

➀ Introduces the challenges in PCB design and verification; ➁ Highlights the features of HyperLynx DRC by Siemens; ➂ Discusses the area-crop function and its benefits in PCB design verification; ➃ Provides a case study of MediaTek using HyperLynx DRC for complex PCB design verification.

➀ Introduction to Siemens' next-generation EDA tools; ➁ Overview of new features like unified GUI, AI integration, and cloud connectivity; ➂ Benefits for engineers in productivity and collaboration; ➃ Integration with other Siemens products and PLM systems

➀ Siemens integrates AI into its design tools to enhance the design experience; ➁ The unified platform combines Xpedition, Hyperlynx, and PADS Professional with AI capabilities and cloud connectivity; ➂ The platform aims to address the skills shortage in design and to foster collaboration and adaptability.

➀ Siemens has introduced a new In-System Test Controller, the ISTC, to enable deterministic in-system testing with the Tessent Streaming Scan Network software. ➁ The ISTC supports all Tessent MissionMode features and can target specific cell-internal and aging defects. ➂ The new product addresses challenges in safety and security, as well as quality in networking and data centers.

➀ Siemens has announced the acquisition of Altair Engineering; ➁ Altair is a leading software provider in the EDA industry; ➂ The acquisition aims to strengthen Siemens' position in the software market.

➀ Introduces the challenge of updating obsolete FPGA designs; ➁ Explains the benefits of retargeting to newer technologies; ➂ Describes the Questa Equivalent FPGA retargeting flow; ➃ Provides three use cases for applying the flow.

➀ Siemens has launched SIMOCODE M-CP, a motor management product series tailored for motor control centres (MCC); ➁ The product can adapt to different operational requirements by purchasing licenses for additional functions; ➂ The integration of condition monitoring directly into the motor management system eliminates the need for separate sensors; ➃ The device uses Single Pair Ethernet (SPE) technology and reduces wiring complexity.

➀ Siemens introduces the SIRIUS 3RC7 intelligent link module to enhance data transparency in industrial automation; ➁ The module merges IT and OT while requiring minimal installation; ➂ It integrates with existing systems and offers diagnostic functions for fault detection and predictive maintenance.

➀ Discover complete end to end solutions for automotive semiconductor development; ➁ Explore Siemens EDA's offerings; ➂ Learn about the latest advancements in automotive semiconductor technology

➀ Siemens and Merck announce a strategic partnership to develop smart manufacturing technology; ➁ The collaboration aims to bring new products to market faster, more cost-effectively, and with a focus on sustainability; ➂ The partnership includes a centralized governance structure and a contractual framework to streamline decision-making and reduce time to market.

1. Siemens introduces Calibre 3D Thermal for thermal analysis of 3D IC designs; 2. The tool aims to provide fast and accurate die-level thermal analysis; 3. This advancement helps in understanding heat distribution within 3D chip designs.

1. Siemens Digital Industries Software introduces a tool for rapid transistor-level isolation of scan chain defects at 5nm nodes; 2. The tool enhances diagnosis resolution by over 1.5x, reducing the need for extensive failure analysis; 3. Tessent Hi-Res Chain uses layout-aware and cell-aware technology to pinpoint defect locations and mechanisms.

1. Siemens has donated to create a tenured professor chair at the University of Saskatchewan to foster local talent in electronic design automation (EDA). 2. The chair will focus on advancing EDA research and teaching, benefiting the next generation of electronic device development. 3. Applications are open for the Siemens EDA Chair in Electronic Design Automation, aiming to establish a research program and engage with local industry.

1. Siemens has introduced Innovator3D IC, a comprehensive solution for 3D IC design, focusing on early feasibility planning and analysis. 2. The solution includes a unified cockpit for design planning, prototyping, and predictive multi-physics analysis, leveraging digital twin technology. 3. Innovator3D IC supports industry standards and integrates AI for co-optimization, ensuring efficient and reliable 3D IC system designs.