1. Siemens has introduced Innovator3D IC, a comprehensive solution for 3D IC design, focusing on early feasibility planning and analysis. 2. The solution includes a unified cockpit for design planning, prototyping, and predictive multi-physics analysis, leveraging digital twin technology. 3. Innovator3D IC supports industry standards and integrates AI for co-optimization, ensuring efficient and reliable 3D IC system designs.

➀ Siemens integrates AI into its design tools to enhance the design experience; ➁ The unified platform combines Xpedition, Hyperlynx, and PADS Professional with AI capabilities and cloud connectivity; ➂ The platform aims to address the skills shortage in design and to foster collaboration and adaptability.

➀ Siemens has launched SIMOCODE M-CP, a motor management product series tailored for motor control centres (MCC); ➁ The product can adapt to different operational requirements by purchasing licenses for additional functions; ➂ The integration of condition monitoring directly into the motor management system eliminates the need for separate sensors; ➃ The device uses Single Pair Ethernet (SPE) technology and reduces wiring complexity.

➀ Siemens introduces the SIRIUS 3RC7 intelligent link module to enhance data transparency in industrial automation; ➁ The module merges IT and OT while requiring minimal installation; ➂ It integrates with existing systems and offers diagnostic functions for fault detection and predictive maintenance.

➀ Discover complete end to end solutions for automotive semiconductor development; ➁ Explore Siemens EDA's offerings; ➂ Learn about the latest advancements in automotive semiconductor technology

➀ Siemens and Merck announce a strategic partnership to develop smart manufacturing technology; ➁ The collaboration aims to bring new products to market faster, more cost-effectively, and with a focus on sustainability; ➂ The partnership includes a centralized governance structure and a contractual framework to streamline decision-making and reduce time to market.

1. Siemens introduces Calibre 3D Thermal for thermal analysis of 3D IC designs; 2. The tool aims to provide fast and accurate die-level thermal analysis; 3. This advancement helps in understanding heat distribution within 3D chip designs.

1. Siemens Digital Industries Software introduces a tool for rapid transistor-level isolation of scan chain defects at 5nm nodes; 2. The tool enhances diagnosis resolution by over 1.5x, reducing the need for extensive failure analysis; 3. Tessent Hi-Res Chain uses layout-aware and cell-aware technology to pinpoint defect locations and mechanisms.