electronicdesign12 months agoSiemens Helps Understand Heat Inside 3D Chip Designs—and Out1. Siemens introduces Calibre 3D Thermal for thermal analysis of 3D IC designs; 2. The tool aims to provide fast and accurate die-level thermal analysis; 3. This advancement helps in understanding heat distribution within 3D chip designs.3D Chip DesignsSiemensThermal Analysis
