➀ Micron is reportedly acquiring two factories from AUO in the Tainan Science Park Industrial Zone for an estimated price of one to two billion New Taiwan dollars. ➁ The acquisition aims to expand Micron's advanced packaging and high bandwidth memory (HBM) production lines. ➂ AUO has confirmed adjustments in production scale at its Tainan site and plans to activate the use of existing facilities at an appropriate time.

➀ CXL consortium showcased advancements at FMS 2024, including new specifications and product demonstrations. ➁ SK hynix introduced a 128 GB CMM-DDR5 CXL memory module and a Heterogeneous Memory Software Development Kit (HMSDK). ➂ Marvell announced a new CXL product line, Structera, featuring compute accelerators and memory expansion controllers.

1. Micron has started shipping its 9th Generation 276-layer TLC NAND, offering significant improvements in density and performance. 2. The new NAND features a 44% increase in density over the previous generation and supports transfer rates up to 3600 MT/sec. 3. Micron's 2650 client SSD is the first product to utilize this new NAND technology, providing high-speed storage solutions for various applications.

1. Micron announces the 2650 client SSD, featuring 276-layer 3D NAND, marking its 9th generation of 3D flash. 2. The SSD offers a PCIe gen 4 interface and capacities from 256 GB to 1 TB, claiming best-in-class performance. 3. Micron's 276-layer NAND boasts the industry's fastest IO speed at 3.6 GBps, significantly outperforming competitors in read and write bandwidth.

❶ Intel has appointed Dr. Naga Chandrasekaran as the new chief global operations officer, responsible for all manufacturing operations. ❷ Chandrasekaran joins from Micron, where he led global technology development and engineering efforts. ❸ His appointment aims to strengthen Intel's semiconductor supply chain and manufacturing capabilities.

1. Micron announces the world's fastest datacenter SSD, the 9550 NVM SSD, with high-speed data transfer capabilities. 2. DRAM and NAND Flash revenues are expected to significantly increase in 2024 and 2025. 3. Onsemi signs a multi-year deal with Volkswagen to supply silicon carbide power assemblies for automotive traction motors.

1. Micron introduces the 9550 series SSDs, claiming they are the fastest enterprise drives with up to 14 GB/s read speeds. 2. The drives feature a PCIe 5.0 x4 interface and 232-layer 3D TLC NAND, available in various capacities and form factors. 3. Micron emphasizes the power efficiency of the 9550 SSDs, claiming up to 81% less energy per terabyte transferred compared to competitors.

❶ Micron has introduced MRDIMMs designed for Intel Xeon 6 servers, offering up to 256GB DDR5-8800 modules. ❷ These modules feature dual DDR ranks in a multiplexed mode, doubling the speed and reducing latency. ❸ Micron plans to offer a comprehensive lineup of DDR5-8000 and DDR5-8800 MRDIMMs, enhancing performance for AI and HPC applications.

❶ YMTC has filed a lawsuit against Micron in the U.S., accusing Micron of infringing 11 of its patents related to 3D NAND technology. ❷ YMTC is seeking to halt Micron's sales in the U.S. and is asking for royalty fees. ❸ Despite facing challenges due to U.S. sanctions, YMTC continues to innovate and improve its 3D NAND technology.

1. Crucial launches the P310 NVMe SSD, targeting the M.2 2230 market for handheld gaming consoles. 2. The P310 offers top-tier read/write speeds of 7.1 GBps and 6 GBps using Micron's 232L 3D NAND and Phison's E27T controller. 3. Available in 1 TB and 2 TB capacities, the P310 focuses on power efficiency and cost-effectiveness, though it has lower endurance ratings compared to competitors.

1. Micron expands its datacenter DRAM portfolio with MR-DIMMs, offering higher bandwidth and capacity. 2. MR-DIMMs use a data buffer to double transfer rates at standard DDR5 speeds. 3. Micron's MR-DIMMs are designed for Intel's Xeon 6 Family, showing significant performance improvements in benchmarks.

1. Micron announced that its High Bandwidth Memory (HBM) production capacity is fully booked until 2025. 2. This follows SK Hynix's earlier statement that its HBM capacity is sold out until next year. 3. Micron reported a revenue of $6.811 billion for the fiscal quarter from March to May, marking an increase.

1. Micron has announced that its new fabs in Idaho and New York will start operating between 2026 and 2029. 2. The company is optimizing its spending and managing the timing of future equipment investments to align with expected demand growth. 3. Micron's capital expenditure for FY2024 is around $8 billion, with plans for a substantial increase in FY2025 to support technological advancements and new fab construction.

1. Micron is advancing its DRAM technology by adopting EUV lithography. 2. The company aims to commence mass production in 2025. 3. Micron has already initiated pilot production on the 1-gamma node, with plans to use EUV for high-volume production next year.

1. A fire occurred at Micron's facility in Taichung, Taiwan, reportedly due to a high-pressure gas leak. 2. The incident was quickly managed by automated fire suppression systems, onsite response, and Taichung firefighters, resulting in no injuries and minimal damage. 3. The fab continues to operate normally without any impact on worker safety.

1. Micron is planning to increase production of HBM3E memory globally to enhance its market share in the HBM sector. 2. The expansion includes boosting production in Taiwan, expanding R&D operations in the U.S., and initiating HBM3E memory production in Malaysia.

1. Q1 DRAM revenues increased by 5.1% despite a fall in units, driven by contract ASP increases. 2. The Big Three in DRAM saw seasonal shipment declines but benefited from price increases. 3. Mobile DRAM prices rose the most due to strong sales of Chinese smartphones, while consumer DRAM had the lowest price rises.

As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era. Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings. Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products. Source: Micron LPDDR5X LPCAMM2 Technical Brief It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering