1. Micron has announced that its new fabs in Idaho and New York will start operating between 2026 and 2029. 2. The company is optimizing its spending and managing the timing of future equipment investments to align with expected demand growth. 3. Micron's capital expenditure for FY2024 is around $8 billion, with plans for a substantial increase in FY2025 to support technological advancements and new fab construction.
Related Articles
- Semiconductor Equipment Spending Healthyabout 1 month ago
 - Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques2 months ago
 - The Memory Magic Inside Your Devices3 months ago
 - Three SSDs for AI datacentres3 months ago
 - Micron 9650 PCIe Gen6 SSD Announced with Micron 6600 ION 122TB and 7650 SSDs3 months ago
 - Micron details new U.S. fab projects: HBM assembly comes to the U.S., Idaho Fab comes online in 2027, New York fabs later4 months ago
 - Low-power DRAM For Faster AI On Smartphones4 months ago
 - Micron Begins Shipping HBM4 Memory for Next-Gen AI5 months ago
 - Micron balks at court order to share 73 pages of sensitive data with China's banned YMTC chipmaker — Micron strives to protect IP from Chinese chip firm on the entity list5 months ago
 - PCIe 6.0 SSD with 30.25 GB/s speeds debuts at Computex, release date is still a long way off5 months ago