➀ Infineon launches PSOC 4100T Plus, an Arm Cortex-M0+ MCU integrating Multi-Sense technology for HMI applications, with 128K Flash and 32K SRAM;

➁ The MCU supports capacitive/inductive sensing, ML-based liquid level detection, and hover touch, enabling versatile roles as a standalone controller or an HMI interface chip;

➂ Targets user-friendly interfaces for industrial and consumer systems through advanced sensing and system control capabilities.

➀ Infineon launched CoolSiC MOSFET 750V G2 technology for automotive and industrial applications, enhancing power efficiency and density;

➁ Chinese car companies are expanding overseas manufacturing to bypass tariffs, with BYD building a $1 billion plant in Turkey for EU market access;

➂ Q1 global semiconductor sales grew 18.8% YoY, and NIST unveiled a high-precision atomic clock to refine timekeeping standards.

➀ Nathan Richardson, a UKESF Scholar and student at the University of Surrey, has achieved notable accomplishments in robotics and electronics.

➁ His final year project involved creating a robotic submersible for ecological research, using a Raspberry Pi and node.js for control.

➂ During his placement year at Infineon Technologies, he worked as a verification engineer, developing tests for a register block within the system.

➀ Infineon has launched the CoolSiC Schottky diode 2000 V G5 product family, its first discrete SiC diode with a breakdown voltage of 2000V, packaged in TO-247-2.

➁ The product is suitable for applications with DC link voltages up to 1500 V DC, such as solar and EV chargers.

➂ The diode allows for higher power levels and reduced component count, simplifying the overall design.

➀ Infineon has received approval from the European Commission (EC) for €1 billion in funding under the European Chips Act for its Dresden fabs.

➁ The funding requires final approval from the Federal Ministry for Economic Affairs and Climate Action (BMWK).

➂ The Dresden site is also supported under the EC's IPCEI ME/CT program.

➀ Infineon expands its discrete CoolSiC MOSFETs portfolio with two new families in Q-DPAK and TOLL packages.

➁ These families are designed for high- and medium-power SMPS applications such as AI servers, electric vehicle chargers, and humanoid robots.

➂ The TOLL package features TCoB capability for compact system designs, while the Q-DPAK package complements Infineon's Topside Cooled (TSC) products.

➀ DeepSeek AI项目开发者引起AI界的惊讶；

➁ 四大NAND厂商被迫削减产量；

➃ 欧洲分销组织FBDi主席Georg Steinberger突然去世；

➄ 欧洲分销组织FBDi主席Georg Steinberger突然去世；

➅ Infineon推出世界上最小的符合GSMA标准的e-SIM芯片；

➆ 石墨烯结构中的太赫兹波增强成像能力。