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October 24
- NVIDIA & AMD GPU Virtualization: Technical Analysis
➀ GPU virtualization splits a physical GPU into multiple virtual CPUs for different virtual machines to use.
➁ NVIDIA's vGPU solution involves hardware support, virtualization layers, and VM drivers to enable GPU virtualization.
➂ AMD's MxGPU offers hardware-level GPU virtualization, allowing for better performance isolation and resource allocation.
- ECOC2024: Nokia Bell Labs on 100G or 200G PONs
➀ Nokia Bell Labs discusses the current status, path, and challenges of achieving and standardizing 100G or 200G-PONs, focusing on technical choices between IM-DD or coherent solutions.
➁ The next generation of PONs should continue to use the existing mass market ecosystem, using TDM to increase line rates 2-4 times, and continue to use IM-DD and NRZ PAM2.
➂ The key indicators of 100GPON TRx are expected, including key performance parameters such as transmitter optical bandwidth, extinction ratio, and receiver technology.
October 23
- Semiconductor Foundry Suffers 1.2 Billion New Taiwan Dollar Loss!
➀ Largan Precision reported a net loss of NT$2.88 billion (US$80.9 million) in the third quarter of 2024;
➁ The company's revenue for the first three quarters of 2024 reached NT$33.594 billion, with an EPS loss of NT$1.27;
➂ Largan Precision's capital expenditures for the year are expected to be between US$855 million and US$905 million, mainly for the capital investment of the P5 factory.
- Texas Instruments Achieves Over 4.1 Billion USD in Revenue Growth in China Market Continues to Expand
➀ Texas Instruments' third-quarter revenue exceeded analyst expectations, with the company's revenue reaching 4.15 billion USD, up 9% from the previous quarter.
➁ The company's net profit was 1.36 billion USD, and the EPS was 1.47 USD.
➂ Despite the softness in the industrial market, other terminal markets such as smartphones and PCs have shown signs of recovery, driving the sales performance of TI's semiconductor products for power electronic devices.
- Arm Cancels Licensing Agreement with Qualcomm Amid Patent Dispute
➀ Arm has given Qualcomm a 60-day notice to terminate their architecture licensing agreement, potentially leaving Qualcomm unable to use Arm's instruction set for chip design.
➁ The termination is related to a lawsuit between the two companies since 2022, involving Qualcomm's acquisition of Nuvia and Arm's claims of contract breach and trademark infringement.
➂ Qualcomm, which relies on Arm's instruction set, may face significant disruptions if the licensing agreement is not renewed, as they would not be able to use Arm's instruction set for their own designs.
- China's Photoresist: How Far Behind Japan?
➀ Photoresist is a critical material for chip manufacturing, with Chinese companies making significant progress in breaking international monopolies.
➁ The article explains the working principle of photoresist and its applications in various industries.
➂ It highlights the progress made by Chinese companies in the field of photoresist, including the success of some domestic companies in developing and producing various types of photoresist.
➃ However, it emphasizes the significant gap between Chinese and Japanese photoresist technologies, particularly in the high-end and advanced markets.
➄ The article discusses the reasons behind the strength of Japanese photoresist companies and suggests that Chinese companies need to focus on research and development, industrialization, and building an industry ecosystem to catch up.
- Qualcomm Auto Chips Take Off! AI Performance Boosts 12 Times, Ideal Mercedes-Benz on Board
➀ Qualcomm unveiled two new automotive chip products: the Snapdragon Cabin Ultimate Platform and the Snapdragon Ride Ultimate Platform.
➁ The Snapdragon Cabin Ultimate Platform supports multiple applications to run simultaneously without performance loss or delay.
➂ The Snapdragon Ride Ultimate Platform supports over 40 sensors and offers a high-quality sensor data processing capability.
- ECOC2024: Huawei's 50G PON
➀ The article discusses the use of analog equalizer ICs in 50G PON systems, comparing them to traditional DSPs, and highlights their potential power, cost, and size advantages.
➁ Huawei and Orange have evaluated the performance of a new analog equalizer IC for 50G-PON applications, achieving a 33dB link budget.
➂ The article also covers the implementation of a 50G-PON downstream (DS) link analog ONU Rx side equalizer ASP-IC and a 25G burst mode (BM) upstream (US) Tx driver.
October 22
- Single Crystal Silicon Substrate Crystal Directions: How to Choose?
➀ Single crystal silicon has a diamond-like crystal structure with a face-centered cubic cell structure, where the smallest unit is a regular tetrahedron made of five atoms.
➁ The distribution of atoms on different crystal faces of silicon crystals is different due to the microstructure anisotropy.
➂ The (111) crystal face has the highest silicon atom density, and one silicon atom on the (111) crystal face forms three covalent bonds with three silicon atoms on the next surface.
➃ The (100) crystal face has the next highest silicon atom density, and one silicon atom on the (100) crystal face forms two covalent bonds with two silicon atoms on the next surface.
➄ The (110) crystal face has the lowest atom density, and one silicon atom on the (110) crystal face forms one covalent bond with one silicon atom on the next surface and two covalent bonds with surface atoms.
➅ (100) crystal direction silicon is commonly used in MEMS processing for V-slot formation.
➆ (110) crystal direction silicon is used for making MEMS optical switches and achieving high aspect ratio etching slots.
➇ (111) crystal direction silicon allows for selective lateral corrosion for the release of movable structures.
- Understanding Full-Mask in Wafer and Chip Production Stages
➀ Full-mask is a key concept in integrated circuit manufacturing, involving the use of masks in semiconductor manufacturing processes.
➁ Masks are optical tools used in photolithography for patterning the surface of silicon wafers.
➂ Full-mask covers the entire wafer during exposure and is used for mass production, offering efficiency and precision but at a higher cost.
- New 200,000 Pieces/Year SiC Production Capacity Added, Project Completed
➀ Shuoke Crystal's SiC Phase II project has been completed;
➁ Additional 200,000 pieces/year of SiC production capacity added;
➂ Project located in Shanxi Transformation Comprehensive Reform Demonstration Area, with phase I completed in May 2024;
➃ Total investment of 520 million yuan for the expansion;
➄ To produce 200,000 pieces/year of N-type SiC substrate and 25,000 pieces/year of high-purity substrate after completion.
- Guangdong Issues Action Plan to Accelerate the Innovation and Development of Optical Chip Industry (2024-2030)
➀ Guangdong Province has issued an action plan to accelerate the innovation and development of the optical chip industry (2024-2030);
➁ The plan aims to achieve breakthroughs in 10 or more key core technologies in the optical chip field by 2030;
➂ It focuses on fostering international competitive leading enterprises, constructing national and provincial innovation platforms, and forming a new billion-level industrial cluster.
- Nordic Semiconductor Giant Acquires a Chip Manufacturer!
➀ Norwegian wireless chip supplier Nordic has agreed to acquire Norwegian peer UWB (ultra-wideband) chip company Novelda.
➁ The acquisition amount has not been disclosed, and the transaction is subject to satisfactory due diligence, final board approval, and certain other conditions.
➂ Nordic, founded in 1983, is a leading integrated circuit hardware and software supplier, focusing on the research, design, and sales of wireless IoT system-on-chip and has been a pioneer in ultra-low-power wireless technology.
- Qualcomm Flagship Chip Performance Soars, Bursting the Toothpaste!
➀ Qualcomm has officially launched the new generation of annual flagship mobile phone SoC, Snapdragon 8 Elite, and the second generation of Qualcomm Oryon CPU for AI PCs.
➁ Snapdragon 8 Elite features the new Hexagon NPU that supports on-device multimodal and 4k context windows.
➂ The CPU of Snapdragon 8 Elite, known as the "global fastest mobile CPU", is the second-generation customized Qualcomm Oryon CPU, using TSMC's second-generation 3nm process technology.
- Microsoft: What are the Challenges for the Next Step of AI Computing Power Expansion?
➀ Microsoft's Zaid Kahn, the vice president of Cloud AI and Advanced Systems, discussed the challenges faced when expanding AI clusters to tens of thousands of accelerators and larger scales at the AI Hardware Summit.
➁ He believes that the next generation of systems requires new system architectures, vertical power transmission, interconnect innovations, and new advanced cooling technologies.
➃ Microsoft has increased its supercomputing capabilities by over 30 times in the past six months.
- ECOC2024: Lasers and Their Packaging Devices
➀ Introduction of wavelength locking chips based on silicon photonics, highlighting their trend, functionality, and challenges with temperature dependence.
➁ Discussion on passive optical isolators based on silicon photonics, focusing on optical Kerr effect and micro-ring resonators.
➂ Presentation of a tunable C+L band laser, featuring a novel TOSA with over 100nm tuning range and high output power.
- The Story Behind 'Special' Server Models and CPUs
➀ Special server models like SA5212 M5 and CPU models like Intel Xeon 8375C are created to cater to specific industries, such as the internet industry, to avoid impacting traditional industries and maintaining high prices for those markets.
➁ These special models often come from sources like outdated equipment, major clients' canceled orders, and irregular channels, which can lead to low prices in the market.
➂ Special models are generally cost-effective, but some are designed for high-profit margins, especially in industries that are less price-sensitive.
➃ Server manufacturers can request custom CPU models, but large CPU manufacturers like Intel and AMD usually only offer this service to major end-users or provide discounted models in their regular lists.
October 21
- Soaring High! SMIC Sets New Record High!
➀ SMIC's A-share stock surged, hitting a historical high of 105 yuan at one point during the morning trading session on October 21, with a closing price of 97.48 yuan, up 8.14% from the previous day, marking another historical high.
➁ The stock's year-to-date increase is 70.72%, outperforming the 12.10% rise in the Shanghai-Hong Kong Stock Connect Index.
➂ The rise in SMIC's stock is seen as a sign of the A-share semiconductor market's strength. Analyst Mo Wenyu from XinDa Securities attributes the rise to the strong sci-tech nature of the semiconductor industry and its role as an important part of new quality productivity. The recovery trend in the semiconductor industry is becoming clearer with continuous policy support from the government, presenting long-term investment opportunities.
- Chip Employees: Making Millions, No Time to Spend!
➀ Employees at NVIDIA report long work hours and high workloads, with some working until 1 or 2 AM;
➁ Meetings at NVIDIA are described as chaotic with shouting and even physical fights;
➂ Despite the pressure, some employees enjoy the work and the chance to solve interesting technical problems;
➃ The article mentions that after working at NVIDIA for five years, employees can earn over a million dollars, making it a place where millionaires are common;
➄ Some employees share their high salaries, with one employee earning over 11 million yuan in December 2021.
- TCL Zhonghuan's Suspected Mass Resignation
➀ TCL Zhonghuan, a leading photovoltaic silicon wafer company, has significantly reduced its production rates, possibly facing a wave of employee resignations.
➁ Employees have reported that since August, multiple production bases of Zhonghuan have started to arrange for rest days, resulting in significantly lower wages in October.
➂ There are at least hundreds of employees who have demanded compensation plans from the company's management. Some employees are currently in negotiations with the company, which has promised to provide solutions by October 21st.
- An All-around Explanation of CMP: Deep Dive into Chemical Mechanical Polishing Technology
➀ CMP technology combines chemical and mechanical actions for surface planarization;
➁ CMP plays a crucial role in semiconductor manufacturing, including initial wafer flattening, metal interconnect structure fabrication, and chip packaging;
➂ Key components of CMP equipment include polishing heads, polishing pads, and polishing slurries, each requiring precise control and optimization;
➃ CMP technology faces challenges such as nanometer-level precision, adaptation to new materials, and environmental and cost pressures;
➄ The future of CMP technology includes technological advancement, market demand growth, and a diversifying industry landscape.
- What is the Ashing Process for Removing Photoresist
➀ The ashing process is used to remove photoresist after etching, as it is no longer needed.
➁ Originally, wet methods were used for removing photoresist after etching, but they could not remove the degraded photoresist during etching.
➂ Dry etching became mainstream, and ashing in dry processes started in the late 1970s.
➃ Dry plasma ashing has the advantages of high ashing rate and reliability.
➄ The process involves plasma and gas diffusion in a vacuum chamber.
➅ The photoresist's main components are resins, photoactive materials, and organic solvents, all consisting of long-chain carbon, hydrogen, and oxygen molecules.
➆ Oxygen plasma ashing uses highly reactive atomic oxygen to react with the carbon-hydrogen-oxygen polymer compounds in the photoresist, forming volatile reactants and removing the photoresist layer.
- 4 Chinese SiC Projects Reach New Milestones: Over 13.4B Yuan, Set for Year-End Commissioning!
➀ Several Chinese SiC projects have reached new progress, with total investment exceeding 13.4 billion yuan.
➁ Shilanwei's 8-inch SiC project is in the final phase of civil engineering, expected to be put into trial production in Q4 2025.
➂ Yuqin Semiconductor's SiC crystal material research and industrialization project has a capacity of 840 ingots per year.
➃ Xujie Energy's headquarters and SiC/GaN industrialization project is expected to be completed and put into use by the end of the year.
➄ Shandong University and Zhongjing Xinyuan have signed a project to develop 8-inch SiC single crystal growth and substrate processing technology.
- Yu Renrong of Weilai Shares: The 'Three Investments' That Stirred the Industry
➀ Yu Renrong, the CEO of Weilai Shares, plans to donate 25 million shares worth 2.8 billion yuan to the Ningbo Oriental Polytechnic University Education Foundation.
➁ Yu's donation is part of a larger plan to donate over 30 billion yuan to support the university's development.
➂ Yu's success is attributed to his leadership in Weilai Shares' growth and investments in the semiconductor industry, including the acquisition of CMOS image sensor leaders.
➃ As a personal investor, Yu has also invested in at least 10 semiconductor private equity funds and has seen significant returns from his investment in Zhongke Feicel.
➄ Yu is currently waiting for the IPO of a new company, Xinhenghui, in which he is a major shareholder.
- Czechia Eyes Chip Supremacy with Building of Major Semiconductor Plant
➀ Onsemi, a U.S. semiconductor manufacturer, is investing up to USD 1.9 billion to build a silicon carbide semiconductor factory in Rožnov pod Radhoštěm, Czech Republic.
➁ The factory will strengthen the local production capabilities and position the Czech Republic as a key player in the semiconductor industry.
➂ Onsemi aims to capture 40% of the European market share and create hundreds of jobs, with many requiring university degrees.
- India's Chip Industry: A Deep Dive!
➀ India's semiconductor industry has made significant progress under the government's $76 billion incentive fund for the India Semiconductor Mission (ISM) launched in December 2021.
➁ The first phase of ISM has approved five semiconductor projects, including four chip packaging factories and one chip manufacturing factory, to be operational between 2025 and 2027.
➂ Experts are urging the next phase of ISM to focus on partnerships with global semiconductor leaders, expanding the ecosystem for raw materials like chemicals and gases, and increasing efforts to train skilled talent for the growing industry.
- Material Giants Plan for Glass Substrate, How Special Glass Becomes Key for AI
➀ Intel has officially launched the industry's first glass substrate for next-generation advanced packaging and plans to mass-produce it by the second half of this century, sparking a discussion about glass substrates in the industry.
➁ The advantages and disadvantages of glass substrates have been shared by packaging giants like Intel over the past year, but there is still some skepticism about switching from organic substrates to a new material.
➂ Glass substrates have become a key factor in advanced packaging due to their advantages over traditional organic substrates, such as high heat tolerance and increased interconnect density.
- Next-Generation Chip Technology: New Breakthroughs
➀ A new study shows that using 'chaotic edges' can greatly simplify electronic chips, as chaotic edges can amplify signals and act as superconductors, reducing the need for separate amplifiers and lowering power consumption.
➁ Researchers have discovered how 'chaotic edges' help electronic chips overcome signal loss, making them simpler and more efficient.
➂ By using metal lines on semi-stable materials, this method allows long metal lines to act like superconductors and amplify signals, potentially changing chip design by eliminating the need for transistor amplifiers and reducing power consumption.
- TSMC Surging to Become the World's Largest Packaging Factory?
➀ TSMC is the leading player in the semiconductor industry.
➁ Advanced packaging is becoming a key technology path for chip performance improvement.
➂ TSMC is expected to become the largest packaging service provider with the rapid adoption of Chiplet architecture.
➃ TSMC has invested heavily in advanced packaging technology, with capacity set to grow significantly.
➄ TSMC's CoWoS, InFO, and SoIC technologies are driving the company's leadership in advanced packaging.
➅ TSMC is expanding its capacity to meet the increasing demand for advanced packaging.
➆ TSMC is also investing in optical packaging technology to meet the growing bandwidth needs.
- ECOC2024: EML Innovations and Developments
➀ ECOC2024 showcased EML advancements, focusing on bandwidth enhancement through capacitor optimization.
➁ Broadcom presented a hybrid CMBH-Ridge O波段EML with 75GHz 3dB BW and 7dBm output power, suitable for PAM4 (240 Gbits/s) applications.
➂ Orange and Sumitomo's DFB-EAM-SOA achieved +13.3 dBm average emission power for 50G PON, exceeding D-level requirements.
➃ III-V-on-Si chip-on-EML demonstrated by III-V Lab, Nokia, offered 16 mW chip power and 22 GHz bandwidth.
➄ McGill University and Lumentum Japan achieved 200 Gbps IM/DD transmission over 80 km using InP EML and QD-SOA.