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August 5
- UCIe 3.0 Spec Released with Big Speed Up for Chiplets
➀ The UCIe 3.0 specification doubles data transfer rates to 64GT/s for chiplet-based designs, significantly improving bandwidth density and enabling faster interconnects for 2D/2.5D packaging;
➁ Introduces new features like continuous transmission protocols, enhanced runtime recalibration, and L2 exit handshake to optimize power efficiency and link reliability;
➂ UCIe 3.0 lays the foundation for future chiplet ecosystems, with commercial products expected around 2026-2028 as adoption by major semiconductor companies accelerates.
- Broadcom Jericho4 51.2Tbps AI Router Chip Now Shipping with 3.2Tbps HyperPorts
➀ Broadcom Jericho4 51.2Tbps AI router chip is now shipping, targeting large AI clusters with 3.2Tbps HyperPorts and 3nm process technology;
➁ Features 100Km+ RoCE deployment for long-distance AI cluster communication and 200G PAM4 signaling;
➂ Part of Broadcom's expanded switch/routing portfolio, including Tomahawk 6 and Tomahawk Ultra, for high-tier AI network infrastructure.
- Storage.AI Project by SNIA Looks to Re-frame AI Storage Discussion
➀ SNIA launched the Storage.AI project to optimize AI storage efficiency by integrating storage with high-performance networks like InfiniBand and Ethernet;
➁ The initiative proposes shifting storage to scale-out networks to enhance GPU utilization and reduce pre-processing bottlenecks;
➂ Key industry players including AMD, Dell, and Intel have joined, but NVIDIA's absence raises questions about future collaboration.
August 4
- Dell PowerEdge R6715 Review A Spiffy 1U AMD EPYC Server
➀ The Dell PowerEdge R6715 is a 1U server with direct liquid cooling for AMD EPYC processors, emphasizing efficient thermal management for high-density computing;
➁ It features flexible configurations including multiple drive bays, dual OCP NIC 3.0 slots, and PCIe Gen5 expansion options;
➂ The system is designed for modern data centers with standardized rack liquid cooling integration and redundant Titanium-level power supplies.
August 2
- Deploying AMD Instead of Arm in our Infrastructure 2025 Here is Why
➀ STH explains its choice of AMD EPYC over Arm in 2025 infrastructure, citing Arm's challenges in enterprise adoption, including installed base compatibility, hardware limitations, and insufficient software support;
➁ Power efficiency gains from Arm are now minimal compared to AMD/Intel x86 CPUs, especially with AI GPU servers dominating power consumption (e.g., AMD Instinct MI325X at 1kW/accelerator);
➂ Enterprise Arm adoption faces hardware scarcity and vendor neglect: NVIDIA Grace CPUs are outdated for general workloads, while major vendors like Dell/HPE offer limited Arm options (e.g., HPE ProLiant RL300 Gen11's market failure).
August 1
- Seagate Expansion 28TB External Hard Drive and the HAMR HDD Within Mini-Review
➀ Seagate's 28TB Expansion external hard drive integrates HAMR (Heat-Assisted Magnetic Recording) technology, offering high-capacity storage in a compact design with USB 3.2 and external power support;
➁ Opening the enclosure reveals a Seagate Barracuda 28TB HAMR drive, typically not sold separately and possibly rebadged from enterprise-grade Exos or IronWolf Pro HDDs;
➂ Shucking the external drive provides significant cost savings ($240 less than standalone 28TB HDDs), though sacrificing warranty coverage.
July 30
- Enfabrica Elastic Memory Fabric System aka EMFASYS Launched
➀ Enfabrica launched the Elastic Memory Fabric System (EMFASYS), integrating its 3.2Tbps ACF-S SuperNIC with CXL memory to create a high-bandwidth RDMA solution for AI clusters;
➁ The system consolidates networking (RDMA) and memory expansion (CXL) into a single chip architecture, eliminating multi-chip complexity and enabling memory pooling over 144 CXL lanes;
➂ EMFASYS addresses AI memory scaling limitations by allowing flexible, large-scale memory access beyond traditional HBM/DRAM, with compatibility for devices like Astera Labs CXL modules.
July 29
- Micron 9650 PCIe Gen6 SSD Announced with Micron 6600 ION 122TB and 7650 SSDs
➀ Micron announced three new SSDs: the 9650 PCIe Gen6 (up to 30.72TB) for AI servers with 28GB/s reads and liquid cooling support;
➁ The 6600 ION offers massive 122TB capacity in E3.S form factor, targeting AI data storage;
➂ The mainstream 7650 PCIe Gen5 SSD focuses on low latency and capacities down to 1.92TB, replacing smaller Gen5 drives.
- NVIDIA Starts to Tackle GPU Power Smoothing with the NVIDIA GB300 NVL72
➀ NVIDIA addresses GPU power fluctuation challenges in large AI clusters using the GB300 NVL72, targeting peak-to-valley transitions during AI training workloads;
➁ Implements GPU Burn and enhanced power supply capacitance to flatten power demand, reducing strain on power infrastructure like diesel generators;
➂ Highlights industry trends toward integrating battery systems in AI data centers to stabilize clusters with extreme GPU spike loads.
July 28
- HPE OCP NIC 3.0 Intel i350-T4 Quick Look
➀ The article provides a quick overview of the HPE OCP NIC 3.0 featuring the Intel i350-T4 controller, a quad-port 1GbE adapter commonly used in basic server configurations;
➁ The NIC follows the OCP NIC 3.0 design with an internal latch mechanism, which complicates maintenance due to the lack of a rear ejector or pull tab;
➂ Despite its widespread OS support and legacy relevance, the Intel i350-T4's PCIe Gen2 x4 interface and 1GbE speeds are considered outdated compared to modern high-speed solutions like 400GbE adapters.
July 27
- QCT QuantaEdge EGX88D-1U Intel Xeon 6 SoC Xeon D Server Shown
➀ QCT unveiled the QuantaEdge EGX88D-1U 1U server powered by Intel Xeon 6 SoC (Xeon D), offering up to 24x25GbE ports for high-density networking;
➁ The server supports future Xeon 6 SoC CPUs up to 325W with 8-channel memory and includes specialized components like an OCXO oscillator and GNSS receiver for timing precision;
➂ Designed for hyperscalers and telcos, it highlights Intel's focus on integrating accelerators for Open RAN and edge applications.
July 26
- Intel Looking to Spin and Sell its Networking and Edge Business
➀ X-Epic and Agile Analog announced a strategic collaboration to advance EUV lithography technology for semiconductor manufacturing;
➁ The partnership aims to optimize analog IP designs for EUV processes, enhancing performance and efficiency in advanced nodes;
➂ The collaboration will accelerate development of EDA tools tailored for 3nm and below process technologies, benefiting AI and HPC applications.
July 25
- HPE ProLiant MicroServer Gen11 Review Great New Mini Server
➀ The HPE ProLiant MicroServer Gen11 features an upgraded design with four 3.5" SATA bays and tool-less drive installation;
➀ It includes two PCIe slots for expansion, enhanced cooling with a single large fan, and Broadcom 1GbE quad-port NICs;
➀ HPE retains iLO remote management and introduces a DC power retention clip for improved stability.
July 24
- OCP DC-MHS Demo at HPE Discover 2025
➀ HPE showcased an OCP DC-MHS demo at HPE Discover 2025, highlighting a modular server design to reduce costs through standardized I/O and layouts;
➁ The demo featured a single-socket Intel Xeon motherboard with OCP NIC 3.0 slots, DC-SCM modules for system control, and flexible storage/RAID configurations via MCIO connectivity;
➂ The modular approach emphasizes industry standardization, enabling adaptable server designs for diverse form factors (e.g., 1U/2U) and aligning with trends like NVIDIA MGX in AI hardware.
July 23
- Inside the NVIDIA Cedar Module with 1.6Tbps of Networking Capacity
➀ NVIDIA's Cedar Module integrates four ConnectX-7 NICs to deliver 1.6Tbps networking capacity, designed as a compact alternative to PCIe-based solutions;
➀ The custom horizontal form factor enables optimized cooling solutions and high-density deployment in DGX H100/H200 systems through optical cage connections;
➂ The module features specialized connectors similar to NVIDIA SXM GPUs, with future systems likely transitioning to ConnectX-8 integration.
July 22
- Kioxia LC9 SSD Hits 245.76TB of Capacity in a Single Drive
➀ Kioxia launches the LC9 SSD with a groundbreaking 245.76TB capacity in a 2.5-inch drive, utilizing QLC NAND and 8th-gen BiCS FLASH technology;
➁ Achieves high-density storage through 32-layer stacking of 2Tb NAND dies, offering sequential performance optimized for data center applications;
➂ Challenges HDD dominance by delivering ~8x the capacity of Seagate's 30TB 3.5-inch HDDs in a single drive, signaling rapid SSD capacity scaling trends.
July 21
- ASRock Rack Shows off Intel Xeon 6 SoC Platforms
➀ ASRock Rack showcased its Intel Xeon 6 SoC-based platforms at Computex 2025, featuring next-generation Xeon D processors;
➁ The GNRDD8HM-2O motherboard supports 100GbE, E1.S storage, and a 2U4N-EGB chassis for high-density 4-node configurations;
➂ While the design offers unique cooling and expandability, the higher cost of Xeon 6 SoC may limit adoption compared to traditional Xeon D solutions.
July 19
- Rapidus Starts 2nm Gate All Around Prototype Production at IIM-1
➀ Rapidus announced it has commenced prototype production of 2nm Gate-All-Around (GAA) transistors at its new IMM-1 fab in Hokkaido, Japan, marking a significant advancement in semiconductor manufacturing;
➁ The facility achieved milestones including EUV tool installation in December 2024 and completed over 200 equipment installations, with volume production targeted for 2027;
➂ The earthquake-resistant design features specialized steel dampers and sliding column structures to ensure operational stability in seismically active regions.
- STH Hardware Upgrades 2025 Edition
➀ STH plans to replace all remaining HDDs in production clusters with SSDs for higher reliability, accepting 3-4x higher costs;
➁ Deployment of Ampere Altra Max platforms faced unexpected challenges, offering insights for ARM-based server adoption;
➂ Transitioning from Google Drive to integrated storage solutions to handle growing 4K video production demands and reduce cost inefficiencies;
➃ Upgrading network testing capabilities using Supermicro Hyper SuperServer SYS-222HA-TN for advanced traffic generation up to 800GbE.
July 17
- Phison Pascari X200P 7.68TB PCIe Gen5 NVMe SSD Review
➀ The Phison Pascari X200P 7.68TB PCIe Gen5 NVMe SSD offers a balance of high capacity and performance in a 2.5" U.2 form factor, targeting enterprise storage solutions;
➀ The drive features a unique heatsink fin design for efficient thermal management and delivers up to 30.72TB capacity in its product line, with the 7.68TB variant showcasing the best performance;
➂ Performance metrics vary significantly across different capacities, emphasizing the importance of checking specifications for targeted use cases following the X200P-X200E comparison.
July 15
- Broadcom Tomahawk Ultra Launch for Scale-up Ethernet
➀ Broadcom launched the Tomahawk Ultra, a 51.2Tbps Ethernet switch chip optimized for small packet sizes and ultra-low latency (250ns), targeting HPC and AI clusters;
➁ The chip challenges NVIDIA's NVLink and InfiniBand by offering 'Scale-Up Ethernet' (SUE) with features like in-network collectives, compressed headers, and lossless fabric technology;
➂ Pin-compatible with Tomahawk 5 and shipping alongside Tomahawk 6, it emphasizes scalability for AI workloads while maintaining Ethernet compliance.
- Gigabyte G893-ZX1-AAX2 AMD Instinct MI325X Server Review
➀ Reviewed the Gigabyte G893-ZX1-AAX2 server with eight AMD Instinct MI325X GPUs and dual AMD EPYC CPUs, offering 2TB of HBM3E memory;
➁ Features air-cooled design for versatile deployment in AI and HPC workloads;
➂ Includes extensive connectivity options: PCIe Gen5 slots, NVMe storage bays, twelve 3kW power supplies, and management NICs.
July 14
- Beelink Mate Mini Add Dual M.2 Storage to an Apple Mac Mini
➀ The Beelink Mate Mini is an external Thunderbolt 5 dock designed to add dual M.2 SSD storage and expand connectivity for Apple Mac Mini, offering a cost-effective alternative to Apple's internal storage upgrades.
➁ It features two M.2 slots, a 2.5GbE port, SD card reader, USB-A ports, and a headphone jack, with a design matching the Mac Mini's footprint for stacking compatibility.
➂ While the dock provides flexible mounting options (top or bottom), its placement may obstruct the Mac Mini's power button, requiring trade-offs between aesthetics and functionality.
July 13
- Cadence IP for LPDDR6 Launched
➀ Cadence launched its LPDDR6 IP with 14.4Gbps performance, enhancing future mobile devices and AI accelerators;
➁ The LPDDR6 memory subsystem supports AI chip designs combining HBM and LPDDR for bandwidth-sensitive workloads;
➂ The IP release aligns with industry trends, enabling next-gen chiplet integration for high-performance computing platforms.
July 12
- GMKtec EVO-X2 Review an AMD Ryzen AI Max 395 Powerhouse
➀ The GMKtec EVO-X2 is a compact AI mini PC featuring AMD's Ryzen AI Max+ 395 APU with 16 CPU cores, a 40-core RDNA 3.5 GPU, and 128GB LPDDR5X memory;
➁ It offers extensive connectivity options, including dual USB4 ports, 2.5GbE, HDMI 2.1, and DisplayPort, with a vertical/horizontal hybrid design;
➂ The review highlights its cooling system, performance modes, and positioning as a high-performance yet portable solution for AI and compute-intensive tasks.
July 11
- The ASUS Ascent GX10 Super NVIDIA GB10 System Has Changed
➀ The ASUS Ascent GX10 system underwent a chassis redesign, replacing its original clear plastic case to address thermal challenges observed in March 2025;
➁ The NVIDIA GB10 platform, targeting consumer markets, integrates 128GB memory and ConnectX networking, enabling cost-effective clustering solutions;
➂ OEM differentiation in this segment focuses on chassis aesthetics and support, as hardware components remain standardized across partners.
July 9
- IBM Power11 Launched with Up To 2048 Threads and DDIMM Support
➀ IBM launched Power11 servers featuring up to 2048 threads in a 16-socket configuration and DDIMM memory technology for enhanced density;
➁ The platform emphasizes AI capabilities with IBM Watsonx Code Assistant and custom Spyre AI accelerators, extending beyond Z-series mainframes;
➂ Power11 introduces hybrid cloud support via PowerVS and reliability features like Spare Cores, targeting existing enterprise customers with upgraded hardware and software ecosystems.
July 8
- This is the New Double Wide NIC with 8x 25GbE Ports Using the Intel E830 NIC
➀ Intel introduced a new double-wide OCP NIC 3.0 DSFF card with 8x 25GbE ports, delivering 200Gbps bandwidth via the E830 controller;
➁ The card uses a unique dual small form factor (DSFF) design with a single PCIe Gen4 x16/Gen5 x8 interface, enabling high-density networking in compact edge servers;
➂ Demonstrated at HPE Discover 2025, it targets edge computing scenarios where dual cards could provide 16x 25GbE ports in 1U servers for enhanced connectivity.
July 7
- Kyocera Pegatron and SMART Show CXL Over Optics at Computex 2025
➀ Kyocera Pegatron and SMART showcased a prototype demonstrating CXL memory accessed remotely via optical connections at Computex 2025;
➁ The setup utilized SMART's CXL memory module, Kyocera's PCIe-to-optical converter, and MTP/MPO fiber cables, enabling dynamic memory allocation in distributed systems;
➂ The technology highlights future applications in AI clusters and aligns with upcoming PCIe Gen6 advancements, signaling progress toward optical co-packaging solutions.
July 5
- New Intel E610 NICs Shown for Low Power 10Gbase-T and 2.5GbE
➀ Intel showcased its new E610 series NICs at HPE Discover 2025, including a dual-port 10Gbase-T model and a quad-port 2.5GbE variant;
➁ The dual 10Gbase-T PCIe Gen4 x4 NIC consumes only 5.1W at full load, supporting 10GbE/5GbE/2.5GbE/1GbE speeds;
➂ The quad 2.5GbE OCP NIC 3.0 model offers up to 8.6W power efficiency, positioning it as an upgrade path for legacy Intel i350 users.