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July 2
- Mouser signs Ampleon
➀ Mouser Electronics signed a global distribution agreement with Ampleon, a Dutch RF specialist, to supply advanced RF power devices including GaN and LDMOS ICs;
➁ Key products include ART-series LDMOS transistors (1600W-2000W, 1-425MHz) for broadcast/communications, BLF981/BLF981S for rugged applications up to 1400MHz, and CLP24H4S30P GaN-SiC HEMT (30W) for industrial/medical systems;
➂ Ampleon's portfolio targets 5G infrastructure, industrial, medical, and broadcast sectors with high-efficiency, thermally stable solutions in compact packages.
- Intel may stop marketing 18A to foundry customers
➀ Intel may halt marketing its 18A process to foundry customers, focusing instead on 14A, which could leverage high-NA EUV advantages to compete with TSMC;
➁ TSMC dominates the 2nm foundry market with high yields and significant planned capacity (50k wpm by 2025, 120-130k wpm by 2026), securing major clients like Apple and AMD;
➂ Existing 18A contracts with Microsoft and Amazon will continue, though Intel’s strategic shift aims to prioritize 14A for future competitiveness.
- Codasip looking for a quick sale
➀ Codasip, a RISC-V architecture developer, is actively seeking buyers for either the entire company or specific divisions, aiming to finalize the sale within three months starting from July 1st;
➁ The company highlights €119 million in pending EU and national grants/equity funding, with potential follow-on phases totaling €210 million and additional consortium-backed financing up to €51 million;
➂ With annual revenues around $89 million and a workforce dominated by hardware (57%) and software (30%) engineers, Codasip faces challenges in disrupting entrenched CPU architectures like x86 and ARM in competitive markets.
- Q1 server market up 134% y-o-y
➀ The Q1 2025 server market reached a record $95.2 billion, a 134.1% year-over-year increase, with full-year 2025 projections at $366 billion.
➁ Servers with embedded GPUs grew 46.7% YoY, accounting for nearly 50% of market value, driven by adoption from hyperscalers and cloud providers.
➂ Arm-based servers surged 70% YoY, capturing 21.1% of shipments, fueled by AI advancements requiring significantly increased processing capacity for inferencing.
- Skynopy raises €15m Series A for real-time space network
➀ Skynopy, an end-to-end ground station service startup, secured €15 million in Series A funding involving the French government and CNES to deploy a global high-throughput ground station network;
➁ The funds will accelerate its AKAR project (S/X/Ka bands), targeting real-time satellite data downlink by 2028, especially for Earth observation, with a goal of sub-20-minute revisit time and doubled data per satellite pass;
➂ The company’s 'as-a-service' model integrates third-party infrastructure and proprietary antennas, supported by partnerships (AWS, Kinéis), while expanding technical and marketing teams.
- Q5D to double resources
➀ Q5D is doubling resources at its Bristol Technical Assessment Centre by adding three robots and hiring staff to meet growing demand for its automated wiring technology;
➁ The company's robotic process embeds wiring directly into products, replacing manual harnesses in automotive and aerospace industries, reducing costs, errors, and reliance on offshore labor;
➂ Backed by $13.5 million funding from Lockheed Martin Ventures, the expansion aims to streamline supply chains, with potential savings of $200 per compact vehicle in automotive applications.
- Top Ten EV Vendors In Q1
➀ The article lists the top ten electric vehicle (EV) vendors in Q1 2025, based on data from TrendForce;
➀ Authored by David Manners, a veteran journalist with over 40 years of experience covering the electronics industry;
➂ Part of the "Mannerisms" blog series on Electronics Weekly, featuring market insights and industry trends.
July 1
- Raspberry Pi Radio Module 2 available for custom boards
➀ Raspberry Pi's Radio Module 2 (RM2), previously used in Pico W and Pico 2 W microcontrollers, is now available for purchase separately;
➁ The module targets developers creating custom boards, enabling integration into personalized hardware designs;
➂ This availability supports IoT and embedded system innovations by providing flexible wireless connectivity solutions.
- Chinese EVs Nearly Matching ICE On Price
➀ In 2025, 45% of ICE cars and 39% of EVs in China were priced under $25,000, with high-end models ($50k+) showing similar price parity;
➁ Europe and the U.S. had minimal affordable EV options (3% under $25k in Europe, none in the U.S.), while Chinese EVs accounted for 8% of EU production;
➂ Strict U.S. laws effectively barred Chinese EV imports and domestic manufacturing.
- TE adopts lower-CO2 plating for connector contacts
➀ TE Connectivity introduces nickel-phosphorus coating 'Econidur' to reduce CO₂ emissions by over 44% in connector contact plating compared to precious metals;
➁ The coating supports high-speed signal transmission (up to multiple Gbit/s) and demonstrates reliability in industrial applications like automation control and motor systems;
➂ TE claims it matches precious metal plating in performance while improving resistance to vibration, gas exposure, and micro-friction, though full technical details remain undisclosed.
- June 2025 – Most flaming Gadget Master posts
➀ June 2025's top Gadget Master posts, analyzed via Google Analytics, highlight trending tech topics;
➁ Featured content includes PocketBeagle boards, holographic trucks, deep learning, drone teardowns, and novel airships;
➂ Registration is required to access detailed articles, reflecting a focus on exclusive tech insights.
- Makimoto’s Wave extended to ‘at least’ 2037
➀ Future Horizons CEO Malcolm Penn asserts that Makimoto’s Wave, tracking the semiconductor industry’s cyclical shifts between standardization and customization, remains valid until at least 2037;
➁ Dr. Makimoto, the theory’s originator, highlights its unexpected 80-year relevance and recognition among foundational computing laws like Moore’s Law;
➂ The article revisits the theory’s 1991 publication in Electronics Weekly and its ongoing impact on industry analysis.
- UMC looking at regaining leading edge process capability
➀ UMC plans to re-enter advanced semiconductor process development after a decade-long gap, seeking partners to share costs;
➁ Potential collaborators include Intel (existing mature-tech partner), private equity firms, or government entities;
➂ Chinese competition intensifies: SMIC surpasses UMC in foundry rankings as customers shift to local suppliers amid geopolitical pressures
- Wolfspeed files for bankruptcy
➀ Wolfspeed filed for Chapter 11 bankruptcy, restructuring $6.5B debt by reducing $4.6B with creditor agreements and announcing a 60% cut in interest payments;
➁ The company maintains $1.3B cash reserves, secured $275M from creditors, and saw a 64.5% stock surge post-announcement;
➂ CEO emphasized leveraging automated 200mm SiC manufacturing to retain market leadership while continuing operations and customer deliveries
- IQE, Quinas complete UltraRAM industrialisation project for AI
➀ IQE and Quinas Technology announced the completion of a £1.1m UltraRAM industrialisation project, developing scalable GaSb epitaxy for memory devices;
➁ ULTRARAM integrates non-volatility of flash storage with the speed and efficiency of DRAM, targeting AI, quantum computing, and space/defense applications;
➂ The project leveraged Innovate UK funding and IQE's industrial capabilities, advancing sovereign memory technology in the UK semiconductor sector.
- Nippon Transmitter
➀ The article revisits a 1960 Electronics Weekly piece discussing historical technological advancements;
➁ It references the UK's former dominance in computers and business perspectives on the space program;
➂ Highlights the significance of GEC Semiconductors and reflects on past semiconductor industry developments.
June 30
- Anglia: ‘Lead times likely to move out rapidly’ as market picks up
➀ Anglia Components warns of rapidly extending lead times as the electronics market rebounds, urging customers to secure orders;
➁ Texas Instruments announced price increases for over 3,300 analog products, with Bernstein analysts predicting hikes ranging up to 100% for high-precision ADCs/DACs;
➂ Excess industry inventory from the past two years has largely been absorbed, signaling market recovery.
- Siemens applies AI across chip and PCB design portfolio
➀ Siemens introduced generative and agentic AI capabilities across its EDA portfolio, enhancing semiconductor and PCB design tools including Aprisa, Calibre, and Solido.
➁ Aprisa AI improves productivity by 10x, speeds tapeout time by 3x, and boosts PPA metrics by 10%, while Calibre Vision AI halves violation resolution time with intelligent clustering.
➂ The AI system offers open, customizable workflows with multi-LLM support, prioritizing data control for users, and is now available for early access across Siemens' EDA tools.
- Advanced fab capacity to grow 69% 2024-28
➀ Semiconductor manufacturing equipment industry is projected to grow at a 7% CAGR, reaching 11.1 million wafers per month (wpm) by 2028, driven by a 69% expansion in advanced process capacity (7nm and below) to 1.4 million wpm.
➁ 2nm-and-below capacity is expected to surge from 200k wpm in 2025 to 500k wpm by 2028, with equipment investment skyrocketing 120% CAGR to $43 billion, supporting mass production of 2nm chips by 2026 and 1.4nm by 2028.
➂ AI-driven demand for powerful computing (training, VR/AR, humanoid robots) is fueling investments across the semiconductor ecosystem, highlighting the industry's role in tech innovation and chip demand.
- GaN-on-SiC MMIC amplifier for 13.75 – 14.5 GHz Satcom band.
➀ Qorvo's QPA1314 is a high-power MMIC amplifier for 13.75–14.5 GHz satellite communications, built on 0.15μm GaN-on-SiC technology;
➁ It delivers 46 dBm output power, 30% efficiency, and supports extended frequencies up to 15.35 GHz in compact packaging with advanced thermal management;
➂ Designed for commercial/military radar and communication systems, the device is fully tested and RoHS compliant.
- UK Space Agency funds public services using satellite data
➀ The UK Space Agency allocated £2.5 million to five projects using satellite data to enhance public services, including infrastructure safety monitoring and biodiversity protection;
➁ Projects include CORE (structural movement tracking), THICKET (agricultural biodiversity mapping), GHGSat (methane emissions monitoring), FANTOM (environmental analytics), and EO4Biodiversity (habitat improvement support);
➂ An additional £300,000 climate fund will support early-stage initiatives leveraging satellite data for climate action and sustainable decision-making.
- Q1 AR/VR headset market up 18.1%
➀ The Q1 2025 AR/VR headset market grew 18.1% year-over-year, with Meta dominating (50.8% share) and emerging brands like XREAL, Viture (268.4% growth), and TCL driving competition;
➀ Shift toward Mixed Reality (MR) and Extended Reality (ER) is reshaping the market, with MR/ER shipments projected to reach 15.2 million and 8.6 million units by 2029, respectively;
➀ Despite a temporary 12% shipment decline in 2025, the market is expected to rebound with a 38.6% CAGR through 2029, with traditional leaders like Sony and Apple absent from top rankings due to inventory management.
- Ed And The Arms Guys
➀ Ed, a CEO, engages with lobbyists from arms and water industries, wining and dining at luxury venues;
➁ Arms lobbyists aim to deploy new weapons in Middle East conflicts to market them as "battle-tested" for increased demand;
➂ Leveraging his influence with the Prime Minister, Ed agrees to advocate for the arms industry after receiving expensive incentives like Montrachet wine.
June 27
- RS Group half-way to 2030 ESG goals
➀ RS Group showcased significant progress in its 2024/25 ESG Report, including a 7% year-on-year reduction in direct CO₂e emissions and achieving 94% recyclable packaging;
➁ Key initiatives focused on advancing sustainability, empowering employees through safety training, supporting over 913,000 youth in skills development, and collaborating with 2,500+ suppliers to raise ethical standards;
➂ The company earned top-tier sustainability recognitions, including CDP's A-List and EcoVadis Platinum status, while aligning ESG strategy with long-term growth through a new Chief Sustainability Officer role.
- Farnell adds to mission-critical parts
➀ Farnell expanded its mission-critical component portfolio for aerospace, defense, and marine industries, offering a 10% discount to qualifying customers in EMEA until September 2025;
➁ The curated product lineup includes rugged connectors, sealed devices, radiation-tolerant semiconductors, and precision tools meeting MIL-SPEC/ISO standards;
➂ The initiative supports urgent disaster response and remote operations, emphasizing component reliability, traceability, and timely delivery.
- Tesla Self-Driving Capabilities Under Scrutiny
➀ Tesla's Robotaxi trial in Austin highlights potential technological limitations rather than showcasing advancement, with safety drivers still required despite claims of 'Full Self-Driving' at ADAS Level 2;
➁ Analysts note 60% of Tesla's $1 trillion valuation hinges on autonomous driving, yet it trails Waymo (valued at $45B) which operates fully autonomous fleets in multiple cities;
➂ The trial may aim to mitigate stock risks amid scrutiny from regulators and doubts about Tesla's ability to deliver Level 5 autonomy.
June 26
- Panmesia launches Link Solution for datacentres
➀ Panmnesia launched the Link Solution product line for AI infrastructure, encompassing hardware, silicon IPs, network topology, and software;
➁ The solution reduces communication overhead, enhances system performance, and supports diverse devices/interconnects for flexible AI workload adaptation;
➂ Panmnesia collaborates with industry consortia (CXL, UALink, OCP, PCI-SIG) to advance composable architectures for GPUs, AI accelerators, and memory modules.
- 75th ECTC packaging themes
➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;
➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;
➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.
- China to have 30% of foundry capacity by 2030
➀ Mainland China is projected to dominate 30% of global foundry capacity by 2030, up from 21% in 2024, driven by rapid expansion despite low domestic wafer demand;
➁ Geopolitical shifts highlight imbalances: The U.S. accounts for 57% of wafer demand but owns only 10% of capacity, while Taiwan and South Korea maintain balanced supply-demand ratios;
➂ Global foundry utilization will remain around 70%, with ROI concerns as ownership battles and geopolitical tensions redefine industry dynamics, favoring Asian regional dominance.
- ESA, Leonardo investigate CPRAs for GNSS system resilience
➀ ESA and Leonardo collaborate on Machine Learning-based CRPAs to counter GNSS interference from jamming/spoofing;
➁ Project focuses on reducing antenna size/weight using ML optimizations, targeting space-constrained applications like aircraft;
➂ Aims to achieve Technology Readiness Level 4 in two years, including lab testing and comparison with traditional antennas.