➀ Introduces Intel's Core™ Ultra 200V series, claiming the title of the most efficient x86 processor with significant improvements in CPU, GPU, and AI performance. ➁ Features a new Xe2 graphics microarchitecture that enhances mobile graphics performance by 30% and supports advanced ray tracing. ➂ Boasts a total AI performance of 120TOPS, integrating CPU, NPU, and GPU capabilities, and claims superior battery life compared to competitors.

➀ Germany is investing heavily in its chipmaking industry with a new €10 billion factory in Silicon Saxony, expected to employ 2,000 people by 2027. ➁ The region of Silicon Saxony, home to 3,600 companies in microelectronics, is poised to become the most important industry in Saxony by 2030. ➂ Challenges include attracting skilled workers and addressing infrastructure needs, as well as competing with larger investments in the US.

➀ Japan and Intel are partnering to build a research and development center for advanced semiconductor manufacturing technology. ➁ The facility will feature extreme ultraviolet lithography (EUV) equipment and will be the first in Japan where different industry participants can jointly use EUV equipment. ➂ Manufacturers of equipment and materials will pay a fee to use the facility for prototyping and testing.

➀ TSMC plans to combine InFO-SoW and SoIC technologies to form CoW-SoW, addressing the trend of larger chips and the need for more HBM in AI workloads. ➁ The new technology is expected to enter mass production by 2027, aiming to stack memory or logic chips directly on the wafer. ➂ Challenges in chip design and manufacturing complexity are increasing as chip sizes expand, necessitating changes in design to improve yield and performance.

➀ Huawei's performance dominates the stock market from late August to the end of the year, with significant impacts on related industries. ➁ In 2024, Huawei reported a 34.3% increase in sales revenue to 417.5 billion yuan, driven by strong smartphone sales and other tech products. ➂ Huawei's upcoming events include the Huawei HiSilicon Connect conference, featuring new technologies like StarFlash, and a series of product launches, including a revolutionary tri-fold smartphone.

➀ Huawei announces the upcoming launch of the Mate XT Master, a new foldable phone. ➁ Huawei reports strong financial results for the first half of 2024, with a 34.3% increase in sales revenue. ➂ Huawei continues to innovate in satellite communication and foldable display technologies.

➀ AMD MI300X features Infinity Fabric Advanced Package for high-speed interconnects and supports FP8 operations. ➁ Intel Gaudi 3 introduces a 256x256 matrix multiplication engine and enhanced interconnectivity. ➂ SambaNova SN40L offers large on-chip memory and a hybrid Mesh/Ring interconnect structure. ➃ FuriosaAI introduces a Tensor Contraction Processor based on Einstein summation notation. ➄ Tenstorrent's architecture emphasizes asynchronous memory access and a scalable 2D/3D Torus network. ➅ BRCM focuses on CPO technology for high-density optical interconnects. ➆ IBM Telum 2 integrates a DPU and AI accelerator in its next-gen mainframe processor.

➀ OpenAI's first custom chip will utilize TSMC's cutting-edge A16 process, specifically designed for the Sora video application. ➁ OpenAI has reserved TSMC's A16 production capacity alongside Apple, aiming to reduce external AI chip dependency. ➂ TSMC's A16 process, entering the angstrom-level node for the first time, promises significant enhancements in speed, power efficiency, and chip density.

➀ Researchers at the University of Notre Dame are developing a robotic platform that uses lasers and computer-controlled stages to replicate the traditional glassblowing technique, aiming to create transparent solid structures for optical, microfluidic, and photonic devices. ➁ Ed Kinzel, an associate professor at Notre Dame, aims to capture the geometric freedom of hand-blown glass methods with the precision of modern 3D printing, addressing the challenges of rapid prototyping in glass. ➂ The team has developed a digital glass forming technique using a CO2 laser to locally melt small diameter glass filaments, allowing for the creation of 3D shapes through controlled deformation and interaction with a substrate.

➀ The article discusses the challenges in creating accurate models for MOSFET devices due to the complexity of quantum mechanics and multi-scale interactions. ➁ It highlights the role of BSIM models in semiconductor design, which incorporate both theoretical physics and empirical data to describe device behavior. ➂ The limitations of current models and the potential for future advancements through computational methods are explored.

➀ Jiufengshan Lab, established a year and a half ago, has attracted nearly 30 semiconductor companies, with a total valuation exceeding $10 billion. ➁ The lab has cultivated over 30,000 talents in the semiconductor field and has become a hub for breakthroughs in advanced semiconductor technologies. ➂ Jiufengshan Lab has successfully operated an 8-inch pilot line, producing the first wafers of high-precision gratings, filling a domestic gap in high-density, ultra-high refractive index, and non-periodic high-precision grating production processes. ➃ The lab has also produced the world's first 8-inch silicon photonics thin-film niobate optoelectronic integrated wafer, enabling high-end optical chip manufacturing with ultra-low loss and ultra-high bandwidth. ➄ Jiufengshan Lab collaborates with industry leaders to develop common technologies and promote the verification of domestic semiconductor materials and equipment, aiming to lead global compound semiconductor technology advancements.

➀ Particle Industries has released Tachyon, a single-board computer competing with Raspberry Pi. ➁ Tachyon features an 8-core CPU from Qualcomm, with speeds up to 2.7 GHz, 4GB RAM, and 64GB UFS flash storage. ➂ It includes a neural processing unit for AI applications and supports Wi-Fi and 5G connectivity.

1. Apple AirTag 4-pack is currently on sale for $75, a significant discount from its usual $99 price. 2. Each AirTag in the pack costs just $18.75, making it a cost-effective solution for tracking personal belongings. 3. The AirTags utilize Apple's Find My network and ultra wideband technology for secure and efficient tracking.

➀ The Indian Cabinet has approved Kaynes Semicon's proposal to establish a chip manufacturing facility in Gujarat. ➁ This approval is a part of India's strategy to enhance its semiconductor manufacturing capabilities and reduce dependency on imports. ➂ The move is anticipated to stimulate further investments in the semiconductor sector and generate employment opportunities in the region.

➀ Foxconn's research institute and the team from National Yang Ming Chiao Tung University have developed a high-frequency, high-efficiency laser driver circuit based on gallium nitride transistor complementary architecture. ➁ The research team has applied for patents related to the complementary pulse laser driver method using gallium nitride transistors. ➂ The developed high-frequency short-pulse laser driver features a switching frequency of up to 50MHz, pulse width less than 10 nanoseconds, and peak power of 50W, with a conversion efficiency of 75%.

➀ SMIC has been producing 7-nanometer chips since 2021 and is now developing 5-nanometer chips using alternative methods like quadruple patterning. ➁ Despite US sanctions, SMIC has received significant government support and subsidies to advance its semiconductor technology. ➂ SMIC's progress in chip manufacturing positions it as a key player in China's quest for semiconductor self-sufficiency, though challenges remain in achieving high yields and accessing advanced tools.

➀ Xiangdixian Computing Technology, a Chinese semiconductor start-up, has collapsed due to a cash crunch and legal issues, dismissing all employees. ➁ The company held an all-staff meeting to announce its dissolution and termination of nearly 400 employees' contracts. ➂ Xiangdixian failed to meet terms in a previous funding round, leading to a lawsuit and the freezing of its bank account. ➃ The firm denies reports of dissolution and is seeking new investors and external financing opportunities.

➀ Intel's share price surged after reports of a potential split into production and development entities. ➁ CEO Pat Gelsinger faces pressure to address liquidity issues and market share loss. ➂ The split could impact Intel's operations in Israel, potentially halting expansion and leading to job cuts.

➀ A collection of humorous and sarcastic remarks about various technological and societal issues; ➁ Highlights the irony in topics like education, politics, and technology; ➂ Uses wit to comment on the complexities and absurdities of modern life and technology.

➀ Montage Technology reported a significant increase in revenue and net profit for the first half of 2024, with net profit more than six times higher than the previous year. ➁ The company's success is attributed to the recovery of the semiconductor industry and the rise in demand, particularly for AI-related chips. ➂ Montage Technology has been actively developing new products and enhancing its technological capabilities to maintain its competitive edge in the market.