➀ AMD MI300X features Infinity Fabric Advanced Package for high-speed interconnects and supports FP8 operations. ➁ Intel Gaudi 3 introduces a 256x256 matrix multiplication engine and enhanced interconnectivity. ➂ SambaNova SN40L offers large on-chip memory and a hybrid Mesh/Ring interconnect structure. ➃ FuriosaAI introduces a Tensor Contraction Processor based on Einstein summation notation. ➄ Tenstorrent's architecture emphasizes asynchronous memory access and a scalable 2D/3D Torus network. ➅ BRCM focuses on CPO technology for high-density optical interconnects. ➆ IBM Telum 2 integrates a DPU and AI accelerator in its next-gen mainframe processor.