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December 3
- Intel's CEO Pat Gelsinger Retires; TSMC's Mark Liu Considered for Succession
➀ Intel's CEO Pat Gelsinger has retired, with David Zinsner and Michelle Johnston Holthaus stepping in as interim co-CEOs.
➁ The board is said to have approached TSMC's former chairman Mark Liu as a potential successor.
➂ Gelsinger's exit follows a disappointing turnaround plan and organizational changes.
- NVIDIA's Next-Gen Blackwell GPU Production Halted Due to Technical Bottlenecks
➀ NVIDIA's next-generation Blackwell architecture GPU GB200 faces technical bottlenecks in mass production, with Microsoft reducing orders, impacting global AI supply chain and manufacturing revenue expectations.
➁ The issue is with the backplane connection design, as the main American Tier-1 supplier's cartridge connector test yield is poor, potentially delaying mass production until March 2025.
➂ NVIDIA GB200 uses TSMC's most advanced CoWoS-L advanced packaging technology, but due to the complexity of the design, production schedules have been delayed multiple times due to overheating issues, liquid leakage in connectors, and insufficient copper wire yield.
October 11
- Phison's Revenue Dives as Market Shifts to Mid-Range SSDs➀ Phison's September revenue fell to NT$4.431 billion, setting a new 13-month low; ➁ The third quarter revenue was NT$13.943 billion, relatively low in the past four quarters; ➂ The year-on-year growth rate of NAND storage bit shipments in the first nine months of 2024 reached 30%, a historical high; ➃ Weak demand for low-end SSDs in the retail market aligns with Phison's strategy of shifting to mid-to-high-end SSD markets; ➄ Phison is actively expanding into the non-retail customized mid-to-high-end SSD market to mitigate market fluctuations; ➅ Phison's enterprise SSD brand PASCARI is shipping steadily, and the aiDAPTIV+ solution for edge micro-tuning in generative AI is expanding successful case applications in various AI scenarios.
September 3
- TSMC's CoW-SoW Technology Expected to Enter Mass Production in 2027➀ TSMC plans to combine InFO-SoW and SoIC technologies to form CoW-SoW, addressing the trend of larger chips and the need for more HBM in AI workloads. ➁ The new technology is expected to enter mass production by 2027, aiming to stack memory or logic chips directly on the wafer. ➂ Challenges in chip design and manufacturing complexity are increasing as chip sizes expand, necessitating changes in design to improve yield and performance.
September 2
- Intel's Altera Sale: Potential Buyer Could Be Marvell➀ Intel is reportedly considering selling its programmable chip division, Altera, as part of a cost-cutting plan. ➁ The potential buyer could be Marvell, a leading networking IC design company. ➂ Intel's CEO, Pat Gelsinger, is set to present the cost-cutting plan to the board later this month, which may include halting or stopping expansion projects in Germany.
September 1
- Intel Nears Breakup Moment! Kuo Ming-Chi Exposes Insider Secrets, Chen Lip-Bu Prepares for Major Move➀ Intel's board member Chen Lip-Bu resigns to join a split committee. ➁ The committee aims to help Intel separate its chip design and foundry businesses. ➂ This move is seen as Intel's closest step towards a major restructuring.
August 31
- CEO Leung's Headache as Dark History Resurfaces➀ Supermicro faced financial reporting issues in the past, including delayed filings and delisting in 2018 due to internal audit requirements. ➁ In 2020, the SEC fined Supermicro $17.5 million for improper accounting practices, including premature revenue recognition and underestimation of liabilities and expenses. ➂ CEO Charles Liang was required to return $2.1 million in stock gains during the improper accounting period, while the former CFO was fined and had to repay illegal gains.