➀ Catalyx Space secured $5.4 million in an oversubscribed Seed round led by Outlander VC, focusing on commercializing cargo return services from space;

➁ Funding will support reentry technology development and global expansion, following a $1.7 million pre-Seed raise in early 2025;

➂ The global space infrastructure market is projected to grow from $146 billion (2024) to $308 billion by 2032, driven by demand for microgravity manufacturing logistics.

➀ The EPC91118 reference design by Efficient Power Conversion Corporation (EPC) utilizes GaN technology to create a compact, high-efficiency 3-phase inverter for motor-drive applications in robotics, e-mobility, and drones;

➁ Featuring the EPC23104 ePower Stage IC, it integrates a GaN half-bridge and driver, delivering up to 15 A peak current with a 15-60 V input range, enhancing energy efficiency and thermal management;

➂ The design includes microcontroller interfaces, precision sensing, protection circuits, and extensive support materials like schematics and simulation tools, facilitating rapid development of advanced motor control systems.

➀ Terahertz radiation faces challenges in generating strong, continuous signals, with existing diode chains suffering from uneven electromagnetic field distribution;

➁ Researchers designed an asymmetric C-shaped diode chain to reshape electromagnetic fields, achieving a frequency-doubling efficiency of 38% and over 300 mW output at 170 GHz;

➂ This innovation enables compact terahertz transmitters for advanced imaging, sensing, and communication systems.

➀ Infineon launches new MOTIX TLE994x/5x 32-bit motor control SoCs for brushed (BDC) and brushless (BLDC) motors in automotive applications;

➁ The chips integrate gate drivers, microcontrollers, and safety features (ISO 26262 ASIL B), enhancing efficiency and reliability for functions like EV battery cooling and seat adjustment;

➂ A unified development ecosystem with reference designs and software accelerates prototyping and reduces time-to-market for automotive systems.

➀ A startup seeks government funding to disrupt the chip industry with a low-cost wafer patterning technology using multiple ion beams, potentially rendering existing fabs obsolete and democratizing chip production;

➁ The initiative risks undermining Western geopolitical strategies focused on maintaining dominance in advanced chip technology through heavy investments in entities like ASML and TSMC;

➂ The author plans to exploit the situation by both suppressing the startup for personal gain and privately investing in it, leveraging leaked claims of government backing to attract funding.

➀ Biocomputers utilize living neurons instead of silicon, offering millionfold energy efficiency and potential for sustainable AI development;

➀ By integrating biological systems with optics and electronics, researchers enable neuron-based computing, though practical applications remain experimental;

➂ Market projections suggest growth to $17 billion by 2032, driven by biocomputing's niche advantages in neural simulations over traditional silicon.

➀ Samsung reported strong Q3 results with operating profit of $8.6 billion, up 160% quarter-on-quarter and 8.9% year-on-year;

➁ Memory chip sales reached $23.6 billion, with operating profit surging 81% to $4.9 billion due to rising AI server demand;

➂ The company highlighted robust growth in smartphone and wearable sales, driven by its latest folding phone launch, while forecasting continued AI infrastructure investments.

➀ Colab Platforms Ltd has announced plans to establish a fully owned subsidiary in India, Colab Semiconductor Pvt Ltd, focused on semiconductor manufacturing and OSAT.

➁ The new unit aims to support India's domestic chip supply chain and capitalize on the country's growing semiconductor market.

➂ Colab Platforms believes the Indian chip market will grow from $52 billion in 2024-25 to $108 billion by 2030, with a CAGR of about 15%.

➀ Substrate, a San Francisco-based startup, is developing an alternative semiconductor manufacturing process that could reduce costs by half;

➁ The company has received over $100 million in investment and is using particle accelerators in its process;

➂ Substrate aims to compete with industry leaders like ASML, which currently dominates the market for semiconductor manufacturing equipment.

➀ PI showcases high-precision motion systems, including linear stages and piezo-driven nano-focus motors, for super-resolution microscopy and live-cell imaging at Neuroscience 2025;

➁ Advanced solutions like 6-axis hexapod manipulators and low-profile XY stages support microsurgery robotics and rapid 3D imaging;

➂ Compact voice-coil stages and nanopositioning systems emphasize OEM integration and enhanced resolution for DNA sequencing and bio-nanotechnology.

➀ Substrate, a Peter Thiel-backed startup, raised $100 million to compete with ASML in lithography tools using X-Ray technology;

➁ Its proprietary particle accelerator-based X-Ray lithography claims to produce wafers at a fraction of ASML's EUV cost, achieving 2nm resolution;

➂ The team includes experts from TSMC, Applied Materials, and U.S. National Labs, with validation from defense and intelligence-linked investors like In-Q-Tel.

➀ POLYN Technology has validated its Neuromorphic Analogue Signal Processing (NASP) chip, which performs AI inference in the analog domain with microwatt-level power consumption, significantly lower than digital processors;

➁ The NASP platform processes sensor signals in their native analog form, targeting always-on edge devices for applications like wearables, automotive sensing, and robotics;

➂ The first chip features a Voice Activity Detection (VAD) core, with future plans for speaker recognition and voice extraction, and evaluation kits are now available for ultra-low-power voice control development.

➀ Nordic Semiconductor launched an open-source Android app (nRF Toolbox) to support Bluetooth Channel Sounding, integrated with its nRF54L Series SoCs;

➁ The solution demonstrates interoperability with Google Pixel 10 smartphones, achieving ±1m accuracy within 20m range for applications like asset tracking and indoor positioning;

➂ Nordic played a key role in developing the Bluetooth LE standard, leveraging its expertise to drive adoption in healthcare, retail, and industrial sectors.

➀ Samsung led global smartphone shipments in Q2 2025 with 58 million units and 19.7% market share, followed by Apple (15.7%) and Xiaomi (14.4%);

➁ vivo and Transsion ranked fourth and fifth, with Transsion experiencing a 1.7% YoY decline;

➂ Total shipments increased 1% YoY to 295.2 million units, while 'Others' category declined by 3.1%.

➀ The semiconductor industry is advancing towards sub-2nm chip technology, facing challenges like traditional lithography limitations and quality control complexities.

➁ Advanced deposition chemistry, such as ALD and CVD, is being explored to overcome these challenges, with companies like Lam Research developing new tools for atomic layer deposition.

➂ Korean researchers have achieved a breakthrough in large-area semiconductor fabrication using plasma-enhanced deposition, potentially leading to solutions for sub-2nm manufacturing.

➃ Intel is preparing for advanced chip production with a roadmap to develop five nodes in four years, aiming to reduce dependence on external foundries.

➀ Researchers developed Surface Immobilised Electrides, enabling free electron movement for quantum applications;

➁ New material offers improved stability and scalability over previous electrides;

➂ Potential uses in quantum computing and efficient chemical production systems.

➀ Mouser signs a global distribution agreement with Northern Technologies, a division of EDAC Group specializing in data communication shielding products;

➀ The agreement enables Mouser to stock a variety of Northern Technologies connectors, including D-subminiature solder cup connectors, dust covers, and crimp connectors, featuring high-density designs, durable materials (steel, copper alloy), and robust electrical specifications (e.g., 3A current, 250V AC voltage);

➃ Products emphasize protection against environmental contaminants, minimal signal loss, and compatibility across temperature ranges (-55°C to 105°C).

➀ Researchers at the University of Würzburg developed a topological insulator that operates at higher temperatures (around -213°C), overcoming previous limitations of functioning near absolute zero;

➁ The material uses a three-layer quantum well structure (InAs/GaInSb/InAs) to enhance band-gap energy and structural symmetry, enabling robust spin-polarized electron transport;

➂ This breakthrough enables compatibility with existing silicon-chip technology, paving the way for energy-efficient topological electronics in practical applications.

➀ Researchers at the University of Würzburg developed a topological insulator functioning at higher temperatures (−213°C), overcoming previous limitations requiring near-absolute-zero conditions;

➁ The material features a three-layer quantum well (InAs/GaInSb/InAs), enhancing bandgap energy and structural symmetry for robust, low-loss electron transport;

➂ This breakthrough paves the way for energy-efficient topological electronics compatible with silicon chip technology, enabling scalable and reliable applications.

➀ The JTF3 G3 tray feeder by Quasys automates precise placement of heavy/sensitive chips onto PCBs, enhancing assembly line efficiency;

➁ It supports up to 24 trays, handles components up to 600g per tray, and achieves positioning accuracy within ±50 micrometers;

➂ Equipped with safety sensors and standard interfaces, it integrates seamlessly into existing systems while improving production speed and reliability.