➀ National Electric Investment Group's affiliated company, NARI Chip Core Technology (Wuxi) Co., Ltd., has delivered the first batch of hydrogen ion implantation performance optimization chips. The hydrogen ion implantation is a crucial step in semiconductor wafer manufacturing, second only to lithography. It plays a key role in the production of various types of semiconductor products. ➁ The key technical points of hydrogen ion implantation include precise control of dosage, energy, and depth, vacuum environment for injection, material compatibility, and post-treatment. ➂ NARI Chip Core Technology's breakthrough has marked a major technological achievement in China's semiconductor manufacturing field, breaking the monopoly of foreign technology and equipment in this field and laying a solid foundation for the full domestic substitution of semiconductor ion implantation equipment and technology.

➀ The National Third-Generation Semiconductor Technology Innovation Center (Nanjing) has successfully developed trench-type SiC MOSFET chips, breaking through the technical barriers of planar SiC MOSFET chips. ➁ These new chips offer a 30% improvement in conduction performance compared to planar types. ➂ The trench-type SiC MOSFET chips are expected to be applied in areas such as new energy vehicle electric drives, smart grids, and photovoltaic energy storage within a year, potentially increasing the range of electric vehicles by about 5% and reducing chip costs.

➀ Overview of semiconductor manufacturing processes, divided into front-end (wafer processing) and back-end (assembly and testing) stages. ➁ Detailed steps in the front-end process include silicon wafer input, cleaning, film deposition, photolithography, and impurity diffusion. ➂ Back-end processes involve chip assembly, packaging, and final testing for quality assurance. ➃ Advanced exposure technologies, such as stepper systems and immersion lithography, are crucial for achieving smaller transistor sizes. ➄ Emerging technologies like EUV lithography promise further miniaturization and efficiency improvements in semiconductor manufacturing.

1. German research partners have successfully demonstrated the practical implementation of an aluminum nitride-based value chain for power semiconductors. 2. The new semiconductor technology based on aluminum nitride has the potential to significantly reduce losses in electrical energy conversion and high frequency transmission. 3. The consortium has successfully produced AlN/GaN high electron mobility transistors with promising electrical properties, supported by funding from the German Federal Ministry of Education and Research.

1. German research partners have demonstrated the practical implementation of an aluminum nitride-based value chain for power semiconductors. 2. The new aluminum nitride semiconductor technology has the potential to significantly reduce losses in electrical energy conversion and high-frequency transmission. 3. The consortium has successfully demonstrated the practical implementation of the value chain for aluminum nitride components in Germany and Europe.

1. Researchers from Germany, Italy, and the UK have developed a new thermoelectric material made from germanium and tin, which can convert waste heat from processors into electricity. 2. The new semiconductor alloy, compatible with the CMOS process in chip manufacturing, is based on Group IV elements from the periodic table. 3. The integration of this material into silicon-based microchips could significantly reduce the need for external cooling and power, enhancing the efficiency of electronic devices.

1. CEA-Leti plans to construct an €830 million FD-SOI pilot line, focusing on 7nm and 10nm process nodes. 2. The project is part of four semiconductor pilot line initiatives by the European chip consortium Chip JU. 3. The pilot line will develop various technologies including eNVM memories, RF components, and 3D integration processes, aiming to enhance applications in low-power MCUs, AI/ML devices, and automotive chips.

1. BCDMOS is a semiconductor process that combines Bipolar, CMOS, and DMOS technologies. 2. This integration offers unique advantages in the electronics industry. 3. The guide explores the detailed features and applications of BCDMOS.