1. Researchers from Germany, Italy, and the UK have developed a new thermoelectric material made from germanium and tin, which can convert waste heat from processors into electricity. 2. The new semiconductor alloy, compatible with the CMOS process in chip manufacturing, is based on Group IV elements from the periodic table. 3. The integration of this material into silicon-based microchips could significantly reduce the need for external cooling and power, enhancing the efficiency of electronic devices.
Related Articles
- Ultra-Thin Film Powers Wearables With Body Heat9 months ago
- Samsung will reportedly replace silicon with glass interposers in 20283 months ago
- Will Glass Substrates Become Unnecessary with TSMC SoW-X?4 months ago
- Hybrid Material Doubles Thermoelectric Efficiency5 months ago
- The Impenetrable Technological Moat of ASML6 months ago
- South Korea's Semiconductor Technology Almost Entirely Behind China, Say Media Reports7 months ago
- FD-SOI, Advancing to 7nm7 months ago
- ISSCC: Energy harvesting7 months ago
- Sponsored Content: About Supercapacitors and Eaton Electronics’ Offerings7 months ago
- Optimizing Energy Harvesting with Granular Triboelectric Nanogenerators7 months ago