➀ Advanced logic chips have up to 20 metal layers to support two types of lines; ➁ The move of power lines to the back of the wafer is expected to reduce complexity and increase space for transistors; ➂ The challenges of wiring on the front side of the wafer need to be addressed to extend transistors to 2nm and below; ➃ The progression in graphic technology allows for smaller transistor characteristics but also requires smaller wiring, leading to increased resistance and signal delay; ➄ Innovations in materials and material engineering are crucial to overcome the challenges of miniaturization and extend the life of copper wiring; ➅ The industry is seeking innovative products to extend copper to 2nm and beyond.