➀ Overview of semiconductor manufacturing processes, divided into front-end (wafer processing) and back-end (assembly and testing) stages. ➁ Detailed steps in the front-end process include silicon wafer input, cleaning, film deposition, photolithography, and impurity diffusion. ➂ Back-end processes involve chip assembly, packaging, and final testing for quality assurance. ➃ Advanced exposure technologies, such as stepper systems and immersion lithography, are crucial for achieving smaller transistor sizes. ➄ Emerging technologies like EUV lithography promise further miniaturization and efficiency improvements in semiconductor manufacturing.