➀ The ASUS RS720-E12-RS8G is a 2U server supporting dual Intel Xeon 6 CPUs and up to three GPUs, including NVIDIA H100 NVL models;

➁ It features eight front NVMe drive bays, ten expansion slots (eight PCIe and two OCP NIC 3.0), and flexible storage/accelerator configurations;

➂ The design emphasizes thermal efficiency with tool-less components, modular risers, and ASUS-standard cooling solutions.

➀ Intel's third-generation Celestial GPUs are confirmed to be on the way;

➁ The chips are currently in pre-silicon validation phase, with Intel working on power and voltage management;

➂ The Xe3 IP is designed to scale across various power classes, and the team is optimizing the frequency and power curves.

➀ Dynatron发布三款新型散热器，最高支持660W功耗，适配英特尔Diamond Rapids和AMD Venice下一代服务器CPU；

➁ AMD Venice将基于台积电N2工艺和Zen 6架构，采用SP7插槽；英特尔Diamond Rapids则采用18A工艺和Foveros Direct 3D堆叠技术，使用LGA 9324插槽；

➂ J24/J25散热器针对AMD平台设计，C21散热器专为英特尔平台打造，暗示两家公司服务器平台将迎来重大升级。

➀ Intel's Xe3 Celestial GPU has entered pre-silicon validation, testing architecture via software models with OEMs and BIOS vendors;

➀ Employee profiles reveal progress in power management and firmware development, indicating advanced preparation for system integration;

➂ The GPU is on track for potential release in 12-18 months, though Intel remains silent on higher-end Battlemage models.

➀ Intel adopts dual strategies for 14A node: High-NA EUV and Low-NA EUV with triple-patterning, both achieving yield parity and design compatibility;

➁ High-NA EUV reduces 40 process steps, lowering costs, but faces challenges in complementary technologies like photomasks and computational lithography;

➂ Intel's backup plan reflects lessons from past 10nm failures, while TSMC remains cautious on High-NA adoption for its A14 node.

➀ Intel faces significant challenges, with CEO Pat Gelsinger's pledge to 'return to basics by listening to customers' being a key focus, despite the company's historical struggles in customer care;

➁ The article references Andy Grove's infamous 'Ship the shit' remark, highlighting Intel's past cultural issues in prioritizing product delivery over customer satisfaction;

➂ Anecdotes from other chip companies, including a CEO's symbolic 'customer dummy' initiative that was quickly abandoned, underscore systemic industry-wide neglect of customer-centric practices.

➀ Researchers from Queen Mary University, Nottingham, and Glasgow received £6M EPSRC funding to develop 2D materials and devices, with £2M contributed by 20+ industrial partners;

➁ The project aims to replace silicon with 2D materials, potentially reducing data center energy consumption by 90% and supporting Net Zero goals;

➂ Major semiconductor firms like TSMC, Intel, and Samsung have included 2D materials in their 2040 roadmaps, with the UK aiming to lead in ultra-low-energy 2D devices before 2040.

➀ Intel announced its 14A process node at Intel Foundry Direct 2025, claiming 35% power reduction and 1.3X transistor density improvement over 18A;

➁ The new Turbo Cells technology optimizes critical speed paths in CPUs/GPUs through customizable double-height libraries, balancing power/performance/area (PPA);

➂ 14A node introduces three standard cell libraries (tall/mid/short) and RibbonFET 2 transistors, with risk production scheduled for 2027.

➀ Intel showcased its 18A process node (planned for late 2025 HVM) and 14A roadmap (15-20% performance per watt gain) with advanced technologies like RibbonFET and High-NA EUV tools;

➁ Collaborations with EDA giants (Synopsys, Cadence, Siemens) emphasized AI-driven design flows, DTCO optimization, and advanced packaging solutions like EMIB-T and 2nd-gen co-packaged optics;

➂ Focused on U.S.-based ecosystem expansion, including Arizona fabs, partnerships with Amkor for advanced packaging, and leveraging government support for secure semiconductor supply chains.

➀ AMD Senior VP Samuel Naffziger discusses the demand and solutions for efficient zettascale computing in the AI era, emphasizing holistic innovation across devices to datacenters;

➁ Intel introduces fluidic self-alignment technology using capillary action for precise 3D chip stacking in hybrid bonding, achieving sub-micron alignment accuracy;

➂ IBM demonstrates machine learning models reducing thermal resistance prediction errors to <15%, significantly outperforming traditional methods (300% error) for advanced packaging reliability.

➀ Intel's Core Ultra 5 245K processor hits an all-time low price of $269 (originally $319) with 14 cores (6 P-cores up to 5.2 GHz and 8 E-cores up to 4.6 GHz).

➁ Supports DDR5-6400 RAM (up to 256GB), PCIe 5.0/4.0 devices, and integrates Intel graphics for basic display output without a dedicated GPU.

➂ Despite being a mid-range CPU, it offers strong performance for modern computing tasks and compatibility with emerging technologies.

➀ A Chinese YouTuber transformed an Intel Core i9-14900KS CPU's heatspreader (IHS) into a functional water block using CNC machining, bypassing traditional cooling methods;

➁ Testing involved a bucket-based coolant reservoir and revealed lower idle/60W load temps but rapid overheating at reduced pump speeds due to design limitations;

➂ The mod reduces die-to-coolant distance by 4x but sacrifices surface area optimization, highlighting trade-offs between innovation and practicality.

➀ Intel continues its major turnaround effort under new CEO Lip-Bu Tan;

➁ Q1 revenue flat year-over-year at $12.7 billion;

➂ Tan emphasizes no quick fixes and focuses on operational efficiency;

➃ Layoffs expected as Tan streamlines operations;

➄ Data Center and AI division sees 8% gain;

➅ CFO predicts mid-point revenue of $11.8 billion for the current quarter.

➀ US-China trade deficit down 30% from its 2018 peak;

➁ Apple loses market share in China's smartphone market;

➂ TSMC plans an independent GigaFab cluster in Arizona;

➃ Intel to cut 20% of workforce and outsource 2nm processors to TSMC;

➄ Qualcomm files a countersuit against Arm.

➀ Intel reported Q1 revenue of $12.7 billion, flat y-o-y with a gross margin of 36.9% down 4.1 points y-o-y.

➁ The company expects Q2 revenue between $11.2-12.4 billion.

➂ CEO Lip-Bu Tan emphasized the need for better execution and operational efficiency to regain market share and drive sustainable growth.

➀ Intel lays off 20% of its workforce and outsources its 2nm processor production to TSMC;

➁ The British Army demonstrates a directed energy weapon against drones, with a range of up to 1km;

➂ The African Space Agency (AfSA) is officially inaugurated in Cairo, Egypt, with representatives from various African governments and international space organisations in attendance.

➀ Lenovo's new ThinkPad laptops are designed for AI-powered workflows, featuring the latest mobile processors from AMD and Intel.

➁ The ThinkPad P16s Gen 4 and ThinkPad P14s Gen 6 are equipped with AMD Ryzen AI 9 HX Pro 370 processors, offering high performance and AI capabilities.

➂ The laptops offer various display options, including IPS panels and OLED, and support up to 96GB of DDR5-5600 memory and 2TB of SSD storage.

➀ Intel is expected to announce a 20% workforce reduction this weekend, as reported by Bloomberg;

➁ The new CEO, Lip-Bu Tan, has previously criticized Intel's bloated bureaucracy;

➂ Intel has outsourced the compute tile of its Nova Lake processor to TSMC, which is in trial production on TSMC's 2nm process in Hsinchu.

➀ Rumors suggest the existence of a 24GB variant of the Intel Arc B580 GPU;

➁ Sparkle's initial confirmation was followed by a retraction;

➂ The GPU is said to be part of Intel's Arc Pro family, targeting AI applications.