<p>➀ AMD Senior VP Samuel Naffziger discusses the demand and solutions for efficient zettascale computing in the AI era, emphasizing holistic innovation across devices to datacenters;</p><p>➁ Intel introduces fluidic self-alignment technology using capillary action for precise 3D chip stacking in hybrid bonding, achieving sub-micron alignment accuracy;</p><p>➂ IBM demonstrates machine learning models reducing thermal resistance prediction errors to &lt;15%, significantly outperforming traditional methods (300% error) for advanced packaging reliability.</p>