➀ Intel and SoftBank jointly established Saimemory to develop a stacked DRAM technology as an alternative to HBM, aiming to reduce power consumption by half;

➁ A prototype is expected within two years, with production targeted by the end of the decade, supported by $70 million in total investment, including $21 million from SoftBank;

➂ The technology originated from Intel, Japanese academia, and partners like Riken and Shinko Electric, with potential government funding and priority supply for SoftBank's AI processors (e.g., Arm and Graphcore).

➀ Intel and SoftBank established a joint venture 'Saimemory' to develop a stacked DRAM solution aimed at replacing HBM, targeting a 50% reduction in power consumption for AI data centers;

➁ The technology leverages Intel's patents and Japanese academic research, with prototype validation by 2027 and commercialization before 2030;

➂ Japan aims to re-enter the global memory chip market after two decades, competing with current HBM leaders Samsung, SK Hynix, and Micron.

➀ Intel secured a jury ruling that Fortress Investment Group controls both VLSI and Finjan, potentially overturning over $3 billion in prior patent infringement verdicts;

➁ The decision hinged on whether Intel's 2012 licensing agreement with Finjan, under Fortress' control, extends to VLSI, which initiated lawsuits against Intel in multiple jurisdictions;

➂ Intel and Apple previously accused VLSI of patent trolling, alleging opaque ownership structures designed to profit from litigation while concealing investor identities.

➀ AMD Ryzen 7 9800X3D dominates gaming performance with 35% higher FPS and superior 1% lows;

➁ Intel Core Ultra 9 285K leads in multi-threaded productivity workloads by up to 98.6%;

➂ Ryzen 7 9800X3D offers better value with $120 lower price and higher energy efficiency.

➀ Aaeon launched two compact single board computers (Up Squared TWL and Pro TWL) with Intel Twin Lake Core 3 N355/N250/N150 CPUs;

➀ The Up Squared TWL (85.6 x 90mm) supports LPDDR5 up to 16GB, 128GB eMMC, M.2 storage, and Wi-Fi; its Pro variant (101.6 x 101.6mm) adds SATA SSD, 5G/LTE, and MIPI camera interfaces;

➂ Both feature industrial-grade durability (-20 to 70°C operation), 2.5G Ethernet, multi-display outputs, and compatibility with Windows 11/Ubuntu/Yocto OS.

➀ TSMC’s advanced roadmap for the decade positions it as the dominant leader in leading-edge logic manufacturing, creating pressure on Intel and Samsung;

➁ Intel and Samsung’s high-risk bets on GAA, BSPD, and high-NA EUV technologies failed to surpass TSMC, leaving the latter as the sole trusted choice for cutting-edge foundry services;

➂ TSMC’s execution excellence has led to a de facto monopoly, raising industry concerns about reduced competition despite its reputation for fairness and responsibility.

① Sparkle showcased its Intel Arc Pro B60 GPUs at Computex 2025, confirming dual-GPU prototypes for AI inference and professional workloads;

② The card features 24GB GDDR6 memory and three cooling solutions (blower, passive, and liquid), though liquid cooling's necessity for a 200W TDP design is questioned;

③ Priced for workstation/server markets, these entry-level GPUs aim to compete via affordability rather than raw performance.

➀ Auras showcased its next-gen Intel Oak Stream cold plates for upcoming Xeon CPUs at Computex 2025, designed to support high thermal loads;

➁ The cold plates measure 156.0×107.5×24.2mm, larger than AMD’s SP7 counterparts, and feature a revised four-post retention mechanism;

➂ These designs highlight the growing adoption of liquid cooling in data centers, particularly for accelerated servers and high-density computing environments.

➀ Intel Xeon 6 processors with High-Priority Cores (P-cores) are positioned as a key feature in NVIDIA DGX B300 AI servers, using the 64-core Xeon 6776P CPU for enhanced workload distribution;

➁ Intel markets its Xeon 6700P's 2DPC memory speed advantage (5,200 MT/s) over AMD EPYC 9005 (4,000 MT/s), though AMD offers more memory channels and capacity;

➂ NVIDIA's preference for Intel CPUs in GPU servers stems from reduced competitive overlap in AI accelerators, benefiting from Intel's canceled Rialto Bridge and Falcon Shores projects.

➀ Russia's imports of Intel and AMD processors dropped by 95% and 81% YoY, but smuggling channels in Hong Kong and India keep tech flowing;

➁ Russian companies claim no actual shortage, citing stable prices despite U.S. sanctions;

➂ Experts criticize U.S. export controls as ineffective, relying on outdated enforcement methods.

➀ Intel launched three new Xeon 6 P-Core CPUs (6732P, 6774P, 6776P) optimized for GPU-powered AI workloads, featuring dynamic core prioritization and up to 8TB memory support;

➁ The processors debut in Nvidia's DGX B300 AI systems with 30% faster memory speeds vs. AMD EPYC and 2.3x higher bandwidth over prior-gen Xeon;

➂ The 350W TDP chips include Intel AMX with FP16 support for AI tasks, alongside a lower-power 235W 40-core B-variant model.

➀ TSMC warns U.S. semiconductor tariffs could reduce demand for its Arizona fab, threatening its $165 billion investment timeline;

➁ Dell and HP oppose tariffs, citing insufficient U.S. chipmaking infrastructure and risks to domestic R&D/security;

➂ Intel seeks exemptions for U.S.-made wafers but admits full local supply chains are economically unfeasible.

➀ Maxsun and Intel showcased a dual GPU card at Computex 2025, combining two 24GB Intel Arc Pro B60 GPUs for 48GB total memory;

➁ The blower-style cooler design enables deployment in workstations/servers, supporting PCIe x8 bifurcation for efficient resource allocation;

➂ Targeting AI and graphics workloads, the solution offers cost advantages over NVIDIA's RTX 6000 Ada (48GB) at a projected lower price point.

➀ Intel launched new Arc Pro B-Series GPUs (B60 and B50) and Gaudi 3 AI accelerators for professional workloads;

➁ These tools target AI inference and tasks in engineering, design, and media with scalable configurations;

➂ Intel released an open-source AI Assistant Builder on GitHub to simplify AI agent development for its hardware.

➀ Intel is exploring the sale or partnership of its Network and Edge Group (NEX) to refocus on PC and datacenter strategies, following previous divestments like Altera and Fab 34;

➁ NEX revenue fell to $5.8B in 2023 (from $8.4B in 2022) amid strong Broadcom competition, signaling a shift away from non-core businesses;

➂ Intel holds $50B debt and $21B cash, with CEO Lip-Bu Tan prioritizing core products under ongoing financial restructuring.

➀ Intel unveiled its Arc Pro B50 and B60 GPUs at Computex 2025, targeting the workstation and AI market with 16GB (B50) and 24GB (B60) memory capacities, emphasizing cost efficiency and AI inference capabilities;

➁ The B50 features a 70W bus-powered design, while the B60 supports up to 200W, with a focus on Linux-based virtualization (SR-IOV) and scalable configurations like dual-GPU systems for AI workloads;

➂ Intel also showcased its Panther Lake 18A processors, aiming to challenge TSMC's process leadership, with GPUs expected to launch in Q3 2025 to address the underserved low-end AI inference and server market.