Recent #Intel news in the semiconductor industry

about 1 year ago
➀ Intel has made significant advancements in transistor performance using ultra-thin 2D materials; ➁ These materials, such as MoS₂ and WSe₂, are suitable for scaled-down devices due to their excellent electrical properties; ➂ Challenges include integrating these materials into existing technology and overcoming the lack of atomic 'dangling bonds' for strong connections.
2D MaterialsIntelTransistorselectronicssemiconductor technology
about 1 year ago

➀ Intel announced the expansion of its Chengdu Packaging and Testing Base in Beijing, adding server chip packaging and testing services.

➁ The expansion aims to enhance local supply chain efficiency and support Chinese customers.

➂ The new Intel Customer Solution Center will be a one-stop platform for industry solutions.

➃ Intel has invested over $4 billion in the Chengdu base since 2003.

➄ Chengdu is a key production center for Intel's mobile device microprocessors.

Intelsemiconductor
about 1 year ago
➀ Corsair tease DDR5-10000 CUDIMMs for Intel's Core Ultra 200S platforms; ➁ Based on SK hynix's 24Gb memory ICs; ➂ Features XMP-10000 profile for 10,000 MT/s data transfer rate; ➃ Gear 4 mode required, with memory controller operating at 1/4 the memory's transfer rate; ➄ Also includes XMP-8400 profile for 8,400 MT/s transfer rate with lower voltage and potential higher real-world performance.
CorsairIntelSK Hynixddr5gamingmemory
about 1 year ago
➀ Four former Intel board members express concerns about Intel's future and the importance of maintaining its manufacturing capabilities; ➁ They argue for the separation of Intel's design and manufacturing businesses, suggesting a new foundry independent of Intel; ➂ They emphasize the need for government intervention and support to revitalize American semiconductor manufacturing.
IntelTSMCTechnology Industryfoundrysemiconductor
about 1 year ago
➀ Intel's reported move to discuss cooperation with Samsung in their foundry businesses suggests a lack of confidence in achieving process technology leadership next year; ➁ Both companies aimed to incorporate GAA transistors and backside power delivery into a 2nm process to challenge TSMC; ➂ Samsung failed to achieve commercially viable yields, delaying orders for new production machinery, while Intel has ordered all five of the high-NA EUV machines made this year.
IntelSamsungTSMCTechnology Leadershipsemiconductor