➀ The Alienware 16 Area-51 delivers top-tier gaming performance with an Intel Core Ultra 9 CPU and NVIDIA RTX 5080 GPU, excelling in AAA titles like Alan Wake 2 and Cyberpunk 2077.

➁ Despite its power, the laptop's bulky design (7.49 lbs) and short battery life (4h) make it better suited as a desktop replacement than a portable device.

➂ Unique features include a teal-colored chassis, quad-fan cooling, and a $50 mechanical keyboard upgrade, but it lacks OLED display options at its $3,000+ price point.

➀ Intel's Nova Lake CPUs adopt a groundbreaking chiplet design, integrating Xe3 Celestial for iGPU and Xe4 Druid for media/display engines on separate tiles;

➁ The split architecture allows TSMC N6/N5 nodes for non-critical components, improving cost-efficiency while preparing for future Druid-based products;

➂ Performance upgrades focus on media codec support (e.g., H.266 decode) and a potential tripling of iGPU power to rival low-end discrete GPUs.

➀ Gordon Moore’s 25-acre Mountain Meadow estate in the San Francisco Bay Area, featuring a 9,000 sq ft main house with luxury amenities, is listed for $29.5 million.

➁ The property is protected by a conservation covenant requiring new owners to maintain its historical and natural features, including redwood groves and gardens designed by renowned landscape architects.

➂ Moore, co-founder of Intel and creator of Moore’s Law, lived here for 30 years, with the estate originally purchased for $6 million in the 1990s and renovated at a cost exceeding $15 million.

➀ Intel collaborates with SoftBank to develop stacked DRAM alternatives to HBM through joint venture Saimemory, targeting commercialization by 2030;

➁ NVIDIA unveils plans for a China-compliant B30 AI chip with multi-GPU scaling, circumventing export controls;

➂ TSMC explores building a UAE-based fab with US government support, mirroring its Arizona project scale.

➀ Intel and SoftBank jointly established Saimemory to develop a stacked DRAM technology as an alternative to HBM, aiming to reduce power consumption by half;

➁ A prototype is expected within two years, with production targeted by the end of the decade, supported by $70 million in total investment, including $21 million from SoftBank;

➂ The technology originated from Intel, Japanese academia, and partners like Riken and Shinko Electric, with potential government funding and priority supply for SoftBank's AI processors (e.g., Arm and Graphcore).

➀ Intel and SoftBank established a joint venture 'Saimemory' to develop a stacked DRAM solution aimed at replacing HBM, targeting a 50% reduction in power consumption for AI data centers;

➁ The technology leverages Intel's patents and Japanese academic research, with prototype validation by 2027 and commercialization before 2030;

➂ Japan aims to re-enter the global memory chip market after two decades, competing with current HBM leaders Samsung, SK Hynix, and Micron.

➀ Intel secured a jury ruling that Fortress Investment Group controls both VLSI and Finjan, potentially overturning over $3 billion in prior patent infringement verdicts;

➁ The decision hinged on whether Intel's 2012 licensing agreement with Finjan, under Fortress' control, extends to VLSI, which initiated lawsuits against Intel in multiple jurisdictions;

➂ Intel and Apple previously accused VLSI of patent trolling, alleging opaque ownership structures designed to profit from litigation while concealing investor identities.

➀ AMD Ryzen 7 9800X3D dominates gaming performance with 35% higher FPS and superior 1% lows;

➁ Intel Core Ultra 9 285K leads in multi-threaded productivity workloads by up to 98.6%;

➂ Ryzen 7 9800X3D offers better value with $120 lower price and higher energy efficiency.

➀ Aaeon launched two compact single board computers (Up Squared TWL and Pro TWL) with Intel Twin Lake Core 3 N355/N250/N150 CPUs;

➀ The Up Squared TWL (85.6 x 90mm) supports LPDDR5 up to 16GB, 128GB eMMC, M.2 storage, and Wi-Fi; its Pro variant (101.6 x 101.6mm) adds SATA SSD, 5G/LTE, and MIPI camera interfaces;

➂ Both feature industrial-grade durability (-20 to 70°C operation), 2.5G Ethernet, multi-display outputs, and compatibility with Windows 11/Ubuntu/Yocto OS.

➀ TSMC’s advanced roadmap for the decade positions it as the dominant leader in leading-edge logic manufacturing, creating pressure on Intel and Samsung;

➁ Intel and Samsung’s high-risk bets on GAA, BSPD, and high-NA EUV technologies failed to surpass TSMC, leaving the latter as the sole trusted choice for cutting-edge foundry services;

➂ TSMC’s execution excellence has led to a de facto monopoly, raising industry concerns about reduced competition despite its reputation for fairness and responsibility.

① Sparkle showcased its Intel Arc Pro B60 GPUs at Computex 2025, confirming dual-GPU prototypes for AI inference and professional workloads;

② The card features 24GB GDDR6 memory and three cooling solutions (blower, passive, and liquid), though liquid cooling's necessity for a 200W TDP design is questioned;

③ Priced for workstation/server markets, these entry-level GPUs aim to compete via affordability rather than raw performance.

➀ Auras showcased its next-gen Intel Oak Stream cold plates for upcoming Xeon CPUs at Computex 2025, designed to support high thermal loads;

➁ The cold plates measure 156.0×107.5×24.2mm, larger than AMD’s SP7 counterparts, and feature a revised four-post retention mechanism;

➂ These designs highlight the growing adoption of liquid cooling in data centers, particularly for accelerated servers and high-density computing environments.

➀ Intel Xeon 6 processors with High-Priority Cores (P-cores) are positioned as a key feature in NVIDIA DGX B300 AI servers, using the 64-core Xeon 6776P CPU for enhanced workload distribution;

➁ Intel markets its Xeon 6700P's 2DPC memory speed advantage (5,200 MT/s) over AMD EPYC 9005 (4,000 MT/s), though AMD offers more memory channels and capacity;

➂ NVIDIA's preference for Intel CPUs in GPU servers stems from reduced competitive overlap in AI accelerators, benefiting from Intel's canceled Rialto Bridge and Falcon Shores projects.

➀ Russia's imports of Intel and AMD processors dropped by 95% and 81% YoY, but smuggling channels in Hong Kong and India keep tech flowing;

➁ Russian companies claim no actual shortage, citing stable prices despite U.S. sanctions;

➂ Experts criticize U.S. export controls as ineffective, relying on outdated enforcement methods.

➀ Intel launched three new Xeon 6 P-Core CPUs (6732P, 6774P, 6776P) optimized for GPU-powered AI workloads, featuring dynamic core prioritization and up to 8TB memory support;

➁ The processors debut in Nvidia's DGX B300 AI systems with 30% faster memory speeds vs. AMD EPYC and 2.3x higher bandwidth over prior-gen Xeon;

➂ The 350W TDP chips include Intel AMX with FP16 support for AI tasks, alongside a lower-power 235W 40-core B-variant model.

➀ TSMC warns U.S. semiconductor tariffs could reduce demand for its Arizona fab, threatening its $165 billion investment timeline;

➁ Dell and HP oppose tariffs, citing insufficient U.S. chipmaking infrastructure and risks to domestic R&D/security;

➂ Intel seeks exemptions for U.S.-made wafers but admits full local supply chains are economically unfeasible.