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September 3
- Jiufengshan Lab Draws Nearly 30 Semiconductor Companies, Total Valuation Surpasses $10 Billion
第一财经
➀ Jiufengshan Lab, established a year and a half ago, has attracted nearly 30 semiconductor companies, with a total valuation exceeding $10 billion. ➁ The lab has cultivated over 30,000 talents in the semiconductor field and has become a hub for breakthroughs in advanced semiconductor technologies. ➂ Jiufengshan Lab has successfully operated an 8-inch pilot line, producing the first wafers of high-precision gratings, filling a domestic gap in high-density, ultra-high refractive index, and non-periodic high-precision grating production processes. ➃ The lab has also produced the world's first 8-inch silicon photonics thin-film niobate optoelectronic integrated wafer, enabling high-end optical chip manufacturing with ultra-low loss and ultra-high bandwidth. ➄ Jiufengshan Lab collaborates with industry leaders to develop common technologies and promote the verification of domestic semiconductor materials and equipment, aiming to lead global compound semiconductor technology advancements. - 2024 Insights into Supercomputing, Infrastructure, HPC Cloud, and Quantum Computing
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➀ The HPC market, including servers and cloud, was valued at $372 billion in 2023, with a slight decrease from 2022. ➁ The on-prem HPC server market was $150 billion in 2023, expected to grow to $163 billion in 2024. ➂ HPC cloud market is projected to grow strongly, with a 21% increase in spending on public cloud resources for HPC workloads. ➃ HPC/AI storage continues to be the fastest-growing element, accounting for about 21% of on-prem HPC spending. ➄ Quantum computing market is expected to reach $15 billion by 2026, with a 22.1% annual growth rate. - Tachyon Invasion: Particle Challenges Raspberry Pi
SSDFans
➀ Particle Industries has released Tachyon, a single-board computer competing with Raspberry Pi. ➁ Tachyon features an 8-core CPU from Qualcomm, with speeds up to 2.7 GHz, 4GB RAM, and 64GB UFS flash storage. ➂ It includes a neural processing unit for AI applications and supports Wi-Fi and 5G connectivity. - Huawei HiSilicon May Go Independent!
芯榜
➀ Huawei HiSilicon is predicted to potentially become independent from Huawei Group, similar to the independent Huawei Car BU, aiming to empower the national chip industry. ➁ The company plans to hold a Global Connectivity Conference on September 9, 2024, featuring new chip releases, StarFlash, HarmonyOS, and a white goods summit. ➂ HiSilicon is set to open its chips to global manufacturers, moving beyond exclusive supply to Huawei.
September 2
- The Importance of 3D Stacked Packaging in Meeting AI's Power Demands
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➀ AMD's Victor Peng highlights the challenge of meeting AI's growing power demands at Hot Chips. ➁ 3D stacked silicon offers 50 times the efficiency of discrete solutions. ➂ AMD advocates for advanced packaging and heterogeneous computing to improve performance and efficiency. - Jiangbolong Unveils eMMC Master Control Chip and SLC NAND at Elexcon 2024
芯智讯
➀ Jiangbolong showcased its self-developed 28nm eMMC master control chip with a unique QLC algorithm, offering up to 512GB storage capacity and technical capability for 1TB. ➁ The company also displayed its 28nm SLC NAND flash memory, featuring a 166MHz operating frequency and innovative circuit design to reduce noise interference. ➂ Jiangbolong's LPCAMM2 memory for AI applications supports LPDDR5/5x颗粒 and has been adopted by AI PC manufacturers like Lenovo. - Montage Technology Sees Explosive Growth in Revenue and Profit
张通社
➀ Montage Technology reported a significant increase in revenue and net profit for the first half of 2024, with net profit more than six times higher than the previous year. ➁ The company's success is attributed to the recovery of the semiconductor industry and the rise in demand, particularly for AI-related chips. ➂ Montage Technology has been actively developing new products and enhancing its technological capabilities to maintain its competitive edge in the market. - Over 30 Billion in VCM Market: Top 5 Driver Chip Companies Take Proactive Actions
潮电视觉与感知
➀ The global VCM market is expected to reach 32.2 billion by 2028. ➁ Major driver chip suppliers are from Korea, Japan, and the USA. ➂ Chinese companies like Hilis Microelectronics, Awinic, Giantec Semiconductor, JD Chip, and PUYA Semiconductor are actively expanding their VCM driver chip business. ➃ These companies are focusing on developing advanced technologies like OIS and close-loop VCM drivers. - The Unsung Heroes of the AI Revolution: HBM Memory Chips
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➀ HBM memory chips are becoming crucial for AI applications, especially for large language models like ChatGPT. ➁ SK Hynix and Samsung are leading the development and supply of HBM devices, with SK Hynix having a significant advantage. ➂ SK Hynix plans to develop HBM4, which will integrate memory directly onto processors, revolutionizing chip design and manufacturing. - Chongqing GPU Unicorn Denies 'Total Dissolution' Rumors
芯东西
➀ Xiangdixian, a Chongqing-based GPU unicorn, has issued a clarification denying rumors of 'total dissolution'. The company states it is not dissolving or liquidating but is optimizing its organizational structure and personnel to adapt to market and strategic changes. ➁ The company is actively seeking external financing opportunities and remains confident in the future of domestic GPU development. ➂ Xiangdixian's founder, Tang Zhimin, is a renowned expert in high-performance processors and has led significant projects in the field. - The Epitome of the Domestic GPU Industry Cycle
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➀ DiXian, a domestic GPGPU manufacturer, announced a 'hibernation status' and terminated contracts for all 400 employees, due to financial issues and market challenges. ➁ The company, led by strategic scientist Tang Zhimin, had previously achieved success in CPU projects but faced difficulties in GPU commercialization. ➂ The collapse of DiXian reflects broader issues in the domestic chip industry, including weak core technology, market competition, and financing difficulties. - Intel's 1.8nm Process: Up to 16-core CPU and 12-core Xe3 GPU
芯智讯
➀ Intel officially announced the Lunar Lake (Core Ultra 200 series) AI PC chip at Computex 2024, with a comprehensive computing power of 120TOPS. ➁ The upcoming Panther Lake, based on Intel's 18A (1.8nm) process, will feature advanced technologies like hybrid bonding and wafer-to-wafer stacking. ➂ Panther Lake will offer up to 16 CPU cores and 12 Xe3 GPU cores, significantly enhancing AI and graphics performance.
September 1
- Innoscience's IPO Journey: Challenges and Opportunities in the Semiconductor Sector
芯潮IC
➀ Innoscience, a leading GaN semiconductor company, has filed for IPO in Hong Kong with a post-E round valuation of $3.4 billion. ➁ Founded by Dr. Luo Weiwei, a former NASA scientist, the company is the first to mass-produce 8-inch silicon-based GaN wafers and offers a full voltage spectrum of products. ➂ Despite being the market leader with a 33.7% share, Innoscience faces significant financial losses, totaling over $6.7 billion in the past three years, due to heavy investments in production facilities and R&D. - Future of Solid-State Batteries: Insights from CATL Chairman Zeng Yus群
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➀ Chairman Zeng Yus群 emphasized the critical importance of high safety standards in the power battery industry, calling it the 'lifeline' for sustainable development. ➁ He highlighted the potential of high-performance batteries, mentioning the upcoming first flight of an electric aircraft powered by CATL batteries by the end of 2024. ➂ Zeng also discussed the challenges in developing all-solid-state batteries, particularly the interface issues between particles, and CATL's progress in this area. - Maia 100: Microsoft's 5nm AI Accelerator Unveiled at Hot Chips 2024
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➀ Microsoft unveiled its first custom AI accelerator, Maia 100, designed for large-scale AI workloads on Azure, featuring a 5nm process and COWOS-S technology. ➁ The chip integrates large on-chip SRAM and four HBM2E chips, offering 1.8TB/s bandwidth and 64GB memory. ➂ Maia 100 supports up to 700W TDP, optimized for high performance and efficient power management. ➃ The accelerator includes advanced tensor units and vector processors, enhancing AI computation efficiency. ➄ A comprehensive SDK is provided for seamless integration with Azure OpenAI services, supporting PyTorch and other development tools. - The Fall of Silicon Carbide Leader Wolfspeed: A Comprehensive Analysis
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➀ Wolfspeed, formerly Cree, has seen its market cap plummet from $12 billion to $1.7 billion, facing significant financial losses and operational challenges. ➁ The company's pivot from LED to compound semiconductor applications has been met with fierce competition from Chinese manufacturers, who have driven down prices and eroded profits. ➂ The transition to 8-inch silicon carbide wafers, a strategic move by Wolfspeed, faces technological and cost hurdles, with the 6-inch vs. 8-inch debate still unresolved in the industry. - Mexican Assembly Plant Lease and Purchase Requirements
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➀ The plant requires an area of 6000-8000 square meters, with a standard steel structure, a height of no less than 8 meters, and preferably a steel floor and epoxy resin flooring. ➁ The plant should include a material/component warehouse, which can be in the form of shelves and fences. ➂ The plant must be fully compliant and suitable for long-term stable use. ➃ The plant is divided into two spans, each with a 10-ton overhead crane. ➄ Deionized water production equipment is required, and liquid cooling equipment must not use tap water for debugging. ➅ Standard industrial three-phase electricity is needed, with a single machine position requiring a 125A or higher distribution box and corresponding cables, and a total of four test positions. ➆ Large ceiling fans are needed within the site to ensure a good working environment for workers in summer. ➇ Regular industrial compressed gas must be provided. ➈ The surrounding area should have a range of outsourced resources such as argon arc welding, pickling and passivation, sheet metal spraying, wire harness making, and complete machine wiring. - Cloud Gaming Experience: Play 'Black Myth: Wukong' on Any Device, Even Your TV!
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➀ 'Black Myth: Wukong' is now accessible via cloud gaming, allowing play on various devices including Mac, Windows, and TV without high-end hardware requirements. ➁ The game can be purchased through WeGame and played on the Tencent START cloud gaming platform, which offers both standard and high-quality versions. ➂ The experience varies across devices, with Mac and Windows laptops providing decent gameplay despite lower specifications, and TV version being user-friendly for those without gaming consoles. - Full Liquid Cooling System Reference Design and Performance Testing Whitepaper (2024)
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➀ The development of a full liquid cooling system is based on the high-density computing server i24, supporting two Intel fifth-generation Xeon processors per node. ➁ The system achieves a 95% heat removal rate through liquid cooling, with the remaining 5% managed by a rear-mounted air-liquid heat exchanger. ➂ The design focuses on high energy efficiency, low cost, and ease of maintenance, exploring liquid cooling solutions for high-power memory, SSDs, OCP network cards, and more. - Analog Chips: Rising Giants in the Semiconductor Industry
半导体行业观察
➀ Analog chip giants Texas Instruments and ADI have seen their market capitalization reach historic highs, with TI surpassing Intel. ➁ Both companies have a history of stable revenue growth and strong financial management, despite market fluctuations. ➂ The analog chip market is facing challenges in 2024, with intense price competition and weak recovery, testing the resilience and strategies of chip manufacturers.
August 31
- SMIC's Profits Plummet by 60%, Yet Revenue and Capacity Utilization Rise
金角财经
➀ SMIC's Q2 2024 net profit dropped by 62.9% to $172 million, but revenue increased by 21.8% to $1.901 billion, indicating a recovery in downstream demand. ➁ The company's capacity utilization rate improved to 85.2%, up from 76.8% in Q4 2023, showing resilience in the face of global overcapacity and price wars. ➂ Despite the profit decline, SMIC's strategy of focusing on low-end consumer electronics and domestic chip demand is paying off, with expectations of further growth in the second half of 2024. - AI Accelerator Interconnect and Cloud AI Processors: Tesla Shines
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➀ Tesla introduces TTPoE for Lossy Fabric, combining iWARP TCP congestion control and RoCEv1 layer-2 forwarding. ➁ Azure Maia 100 targets OpenAI's inference business with high-density deployment and standard Ethernet integration. ➂ Meta MTIA focuses on search, advertising, and promotion with a dense model approach and cost-effective LPDDR5 usage. - Broadcom's SCIP: Enhancing Interconnectivity in AI and Machine Learning
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➀ Meta Platforms identifies a widening gap between computing power and interconnect bandwidth at the 2022 OCP Global Summit. ➁ Broadcom proposes SCIP (Silicon Photonics in Package) as a solution to bridge this gap, focusing on low-cost, high-performance, and low-power interconnects. ➂ SCIP utilizes TSV technology and detachable optical connectors to achieve shorter interconnect distances and higher energy efficiency, targeting AI and machine learning applications. - Alibaba's Next Journey: Towards the Next Mountain and Sea
正解局
➀ Alibaba's stock surged 4.6% pre-market after completing a three-year整改. ➁ The company faced regulatory scrutiny and a hefty fine for垄断 practices. ➂ Now, Alibaba faces new challenges with competitors like Pinduoduo and TikTok gaining momentum. - PCIe 7.0 External Cable Specifications Update
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➀ PCIe 7.0 external cable specifications are under discussion and update, with a focus on signal integrity. ➁ The differential insertion loss for PCIe 7.0 cables is required to reach 48GHz. ➂ Return loss is specified to be -15dB at 32GHz. ➃ Near-end and far-end crosstalk requirements are provided without specifying ICN. ➄ Cable skew and lane-to-lane skew are also defined, with EIPS less than 2ps and lane-to-lane skew less than 200ps for cables up to 1m. - Groq LPU Design Principles
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➀ Software-first approach to simplify development and maximize hardware utilization; ➁ Programmable Assembly Line Architecture with data 'conveyor belts' for efficient instruction and data movement; ➂ Deterministic Compute & Networking ensuring predictable execution times; ➃ On-chip Memory integration for high-speed data access and reduced latency. - The Rise and Fall of Wolfspeed: A Tale of SiC Industry Turbulence
半导体行业观察
➀ Wolfspeed, a leading player in the SiC industry, has faced significant challenges including market share loss, financial losses, and a drastic drop in stock value. ➁ The company's strategy of heavy investment in 8-inch SiC wafer production has led to high costs and low profitability. ➂ Amidst intense competition and market saturation, Wolfspeed is considering cost-cutting measures such as factory closures and strategic partnerships to regain market position. - AmpereOne: A 192-Core Arm Server CPU Revolutionizing Cloud Native Computing
架构师技术联盟
➀ The AmpereOne CPU introduces a custom-core design, differing from the licensed Neoverse cores of the Altra series. ➁ It includes significant new features such as nested virtualization, which are absent in the Altra/Altra Max series. ➂ The platform adopts DDR5 and PCIe Gen5, marking a step forward in modernization and performance. - Deity Pioneer GPU Manufacturer Dissolves, 400 Employees Laid Off!
芯智讯
➀ Deity Pioneer, a domestic GPU manufacturer, announced its dissolution on August 30, laying off all 400 employees. ➁ The company had previously faced financial difficulties, including layoffs of fresh graduates and salary reductions. ➂ Despite launching two GPU products, the company failed to gain market recognition and ran out of funding, leading to its closure. - Wearable Microneedle Patch for Closed-Loop Diabetes Management
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➀ The patch uses hollow microneedles made of polystyrene (PS) with graphene-based biosensors for glucose detection. ➁ It incorporates an electroosmotic micropump with an anti-fouling layer to enhance insulin delivery stability. ➂ The system is controlled by a printed circuit board (PCB) for automated glucose management, aiming to reduce the physical and psychological burden on diabetic patients. ➃ The patch is designed to be compact, wearable, and cost-effective, with potential for further miniaturization and wireless data transmission.