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September 17

September 16

  • Khadas Mind 2 Meteor Lake Edition Review
    ➀ The Khadas Mind 2 review examines the new Intel Meteor Lake SoC and its impact on the mini PC's capabilities; ➁ The mini PC is compact, featuring a metal case and a variety of I/O ports; ➂ The review highlights the system's performance and usability, including its peripheral attachments and expansion options.
    IntelKhadasMeteor LakeMini PC
  • Samsung V9 QLC V-NAND Goes into Production
    ➀ Samsung has started mass production of its new V9 QLC V-NAND; ➁ The technology enables larger SSDs with features like channel hole etching for higher layer counts; ➂ Improved data retention performance and reduced power consumption are noted.
    NANDQLCSSDSamsungstorage

September 14

September 13

September 12

  • JUPITER Exascale Supercomputer Starts Installation
    ➀ The JUPITER Exascale Supercomputer has commenced installation with the Modular data center, set to be a unique European Exascale supercomputer using all NVIDIA CPUs and GPUs. ➁ The system is expected to house around 125 BullSequana XH3000 racks in 50 containers, with the finished system consisting of approximately 24,000 NVIDIA GH200 Superchips. ➂ JUPITER will utilize NVIDIA Quantum-2 InfiniBand networking and is expected to be a significant win for Arm in the HPC space.
    ArmHPCNVIDIASupercomputing

September 11

September 10

  • Supermicro ARS-111GL-NHR NVIDIA GH200 Grace Hopper 1U Server Review
    ➀ This article reviews the Supermicro ARS-111GL-NHR server, a 1U air-cooled server featuring the NVIDIA Grace Hopper architecture with 72-core Arm Neoverse V2 CPU and NVIDIA Hopper GPU. The review highlights the server's NVLink-C2C connection between CPU and GPU for high-speed data transfer. ➁ The review includes an overview of the server's hardware, including its front and rear design, I/O options, and power supplies. ➂ The article also touches on the significance of the server in the context of NVIDIA's expanding market in high-performance computing and data centers.
    ArmGH200NVIDIANeoverse V2Supermicro

September 8

September 7

September 3

  • Samsung BM1743 Shows How a 128TB NVMe SSD is Made
    ➀ The Samsung BM1743, a 128TB NVMe SSD, was showcased at the Future of Memory and Storage 2024 event, revealing its internal structure. ➁ The SSD features dual PCBs with a large number of NAND and DRAM chips, indicating high storage density. ➂ Samsung uses QLC technology in the BM1743, with reported 45K Random Write IOPS at 16KB, shifting from typical 4K benchmarks.
    NVMeNVMe SSDQLC

August 28

  • AMD Zen 5 Core Unveiled at Hot Chips 2024
    ➀ AMD Zen 5 features improved branch predictor and instruction decode advances. ➁ The architecture includes a full FP512 data path for AVX-512 execution. ➂ Zen 5 introduces larger L1D cache while maintaining 4-cycle load characteristics. ➃ The new Zen 5 ISA features and cache hierarchy are detailed. ➄ AMD showcases Zen 5's power efficiencies and performance improvements over Zen 4.
    AMDHot ChipsZen 5

August 27

  • Tenstorrent Blackhole and Metalium for Standalone AI Processing
    ➀ Tenstorrent unveiled its Blackhole silicon at Hot Chips 2024, featuring a standalone AI computer based on Ethernet. ➁ The Blackhole chip includes sixteen RISC-V cores in four clusters, with additional 'baby' RISC-V cores for compute, data movement, and storage. ➂ It supports 10x 400Gbps Ethernet and 512GB/s of bandwidth, emphasizing data locality and minimizing off-chip DRAM usage. ➃ The architecture leverages Ethernet for scaling, avoiding the need for specialized interconnects like NVLink or InfiniBand. ➄ TT-Metalium is introduced as part of the low-level programming model to facilitate AI operations on the hardware.
    AI ProcessingRISC-VTenstorrent
  • Snapdragon X Elite: Qualcomm Oryon CPU Design and Architecture at Hot Chips 2024
    ➀ Qualcomm's Snapdragon X Elite introduces the Oryon CPU, an Arm-based core from the Nuvia team, focusing on power efficiency. ➁ The CPU features include an Instruction Fetch Unit, Vector Execution Unit, Rename and Retire Unit, Integer Execution Unit, Memory Management Unit, and Load and Store Unit. ➂ The Oryon CPU showcases a balanced 13 cycle branch mispredict latency and supports a wide range of data types. ➃ The memory system includes a large L2 cache and a 6MB system-level cache, enhancing performance and efficiency. ➄ Security features are integrated to protect against potential threats in notebook environments.
    Oryon CPUQualcommSnapdragon X Elite
  • Broadcom AI Compute ASIC with Optical Attach Detailed at Hot Chips 2024
    ➀ Broadcom showcased an AI compute ASIC with optical attach at Hot Chips 2024, highlighting its use of co-packaged optics and silicon photonics. ➁ The company discussed the challenges of electrical I/O reach through PCB and the benefits of using silicon photonics for optical modules. ➂ Broadcom's Tomahawk 5 Bailly, a 51.2T Ethernet switch, demonstrates the integration of co-packaged optics and improved packaging techniques.
    AI Compute ASICBroadcomOptical Attach
  • SK Hynix Unveils AiMX-xPU AI-Specific Memory Solution at Hot Chips 2024
    ➀ SK Hynix introduced its in-memory computing advancements for LLM inference with AiMX-xPU and LPDDR-AiM, focusing on enhanced power efficiency and speed. ➁ The company showcased a GDDR6 Accelerator-in-Memory card utilizing Xilinx Virtex FPGAs and GDDR6 AiM package. ➂ SK Hynix aims to scale memory capacity from 32GB to 256GB per card and explore on-device AI applications.
    AIcomputingmemory
  • Intel Xeon 6 SoC for the Edge: Hello Granite Rapids-D
    ➀ Intel Xeon D series is getting an upgrade with Granite Rapids-D in 2025, featuring new cores and next-gen packaging. ➁ The new chips support PCIe Gen5, 100GbE connectivity, and Intel QuickAssist, DLB, DSA, and vRAN Boost. ➂ AI acceleration is enhanced with support for AMX, and there is a new feature for single pass, verified compression.
    Edge ComputingIntelXeon

August 18