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May 24

May 23

  • 3AM Ransomware Gang Hacks Networks With Spoofed IT Calls And Email Bombing

    ➀ The 3AM ransomware group has been using more proactive techniques, such as email bombing and spoofed IT support calls, to gain access to corporate systems.

    ➁ Sophos has documented over 55 attempted attacks using this technique in the first quarter of 2025.

    ➂ The attackers used a pre-configured Windows 7 virtual machine to establish a hidden foothold and evade network protection software.

    Hackingsecurity
  • Netflix Goes Dark On These Fire TV Devices, Deals To Keep You Streaming

    ➀ Netflix is discontinuing support for certain Fire TV devices, including models from 2014 and 2016, due to outdated technology.

    ➁ Amazon is offering discounts on its Fire TV Stick lineup to encourage users to upgrade.

    ➂ The newer Fire TV Stick models offer 4K streaming, Dolby Vision, and Wi-Fi 6 connectivity.

    NetflixStreaming
  • Best of Computex 2025: More hardware than hype

    ➀ AMD launches Ryzen Threadripper 9000 series with Zen 5 architecture and 96 cores, extending its lead over Intel's Xeon W-series.

    ➁ Phison's E28 SSD controller achieves 14.8 GB/s speeds with 6nm efficiency, poised to dominate PCIe 5.0 storage.

    ➂ Retro-inspired SilverStone FLP02 case and innovative peripherals like Asus’s split-keyboard Falcata redefine gaming aesthetics.

    AMDAsus
  • How To Manage User Passwords in Linux

    ➀ The article demonstrates using the 'passwd' command to change personal passwords, manage other users' credentials via sudo privileges, and enforce security policies like password expiration.

    ➁ Advanced functionalities include locking/unlocking accounts, auditing password status, and setting warning/inactivity periods for system-wide security maintenance.

    ➂ Practical examples (e.g., 'sudo passwd -e tom') and terminal screenshots guide administrators through enforcing best practices in password management.

    LinuxPrivacycybersecurity
  • Intel launches three new Xeon 6 P-Core CPUs, will debut in Nvidia DGX B300 AI systems

    ➀ Intel launched three new Xeon 6 P-Core CPUs (6732P, 6774P, 6776P) optimized for GPU-powered AI workloads, featuring dynamic core prioritization and up to 8TB memory support;

    ➁ The processors debut in Nvidia's DGX B300 AI systems with 30% faster memory speeds vs. AMD EPYC and 2.3x higher bandwidth over prior-gen Xeon;

    ➂ The 350W TDP chips include Intel AMX with FP16 support for AI tasks, alongside a lower-power 235W 40-core B-variant model.

    AIIntelNVIDIA
  • Realtek's $10 tiny 10GbE network adapter is coming to motherboards later this year

    ➀ Realtek unveils RTL8127, a $10 10GbE network controller with PCIe 4.0 x2 interface, supporting 2.5/5/10 Gbps speeds and low power consumption (1.95W).

    ➁ The controller integrates error correction (ECC) and self-diagnostic features, targeting motherboards, laptops, and CPE devices, with mass production expected in late 2025.

    ➂ Adoption barriers remain due to high costs of 10GbE switches ($299+) and CAT6A cables, though demand may drive infrastructure price reductions.

    10GbERealtek
  • PCIe 6.0 SSD with 30.25 GB/s speeds debuts at Computex, release date is still a long way off

    ➀ Micron showcased a PCIe 6.0 SSD prototype (EVT3) at Computex 2025, achieving up to 30.25 GB/s speeds, though mass production remains distant;

    ➁ Astera Labs utilized the SSD to demo its PCIe 6.0 switch and software, highlighting peer-to-peer GPU-SSD communication for AI platforms;

    ➂ PCIe 6.0 certification delays until late 2025 mean interoperability testing is pending, with Micron's SSD still undergoing engineering validation phases (EVT3).

    MicronPCIe 6.0SSD
  • Excellence Clusters: KIT Successful with Proposals on Battery Research and 3D Designer Materials

    ➀ Karlsruhe Institute of Technology (KIT) secured two Excellence Cluster grants for battery research (POLiS) and 3D materials (3DMM2O), each funded up to €70 million over seven years;

    ➁ POLiS focuses on developing lithium-free batteries for sustainable energy storage, emphasizing ion tracking and cell component interactions;

    ➂ 3DMM2O pioneers molecular-scale 3D printing, targeting organoid formation, biohybrid systems, and energy-efficient optical switches.

    3D ICHPCsemiconductor

May 22

  • Outstanding Success for LUH: Three Excellence Clusters Approved

    ➀ Leibniz Universität Hannover (LUH) secured funding for three Excellence Clusters (PhoenixD, QuantumFrontiers, Hearing4all.connects), enabling its bid for "Excellence University" status by 2026;

    ➁ PhoenixD advances photonics for medical and quantum applications, QuantumFrontiers pioneers quantum metrology and next-gen sensors, and Hearing4all.connects integrates AI and genetics to enhance hearing health solutions;

    ➂ The clusters emphasize interdisciplinary collaboration with academic and industry partners, reinforcing LUH's leadership in cutting-edge research.

    AIHPCsemiconductor
  • Excellence Strategy: University of Halle Receives Funding for a Cluster of Excellence for the First Time

    ➀ The Martin Luther University Halle-Wittenberg (MLU) secured funding for the Cluster of Excellence 'Center for Chiral Electronics' (CCE), focusing on chiral materials for energy-efficient, high-performance electronic components;

    ➁ The initiative involves collaboration with Freie Universität Berlin, the University of Regensburg, and Max Planck Institute in Halle, combining expertise in chiral materials, spin dynamics, and coherent control;

    ➂ The research aims to advance semiconductor technology, aligning with the European Chips Act, while promoting STEM education and addressing future electronics challenges.

    HPCsemiconductor
  • Excellence Strategy: University of Halle Wins Excellence Cluster Grant for the First Time

    ➀ The Martin-Luther-Universität Halle-Wittenberg (MLU) secures €64.5 million in funding for the "Center for Chiral Electronics" excellence cluster, collaborating with three institutions to develop energy-efficient electronic materials and technologies;

    ➁ Research focuses on leveraging chirality in materials to create stable, high-performance electronics, addressing future semiconductor and storage technology needs;

    ➂ The initiative aligns with the European Chips Act, aiming to bolster Germany’s semiconductor production and inspire youth through science education programs.

    HPCResearch projectssemiconductor
  • Southwest Airlines Changes Its Portable Charger Policy, What To Know Before You Fly

    ➀ Southwest Airlines has updated its policy regarding portable chargers, requiring them to be visible while in use.

    ➁ This is the first such policy implemented by a U.S. airline.

    ➂ The new rule is effective starting May 28, 2025, and aims to enhance safety due to the risk of overheating and fires associated with lithium-ion batteries.

    Lithium-ionbattery
  • Thermal Grizzly’s open-air der8enchtable is designed for dedicated PC tinkerers

    ➀ Thermal Grizzly unveiled the modular der8enchtable at Computex 2025, an open-air bench table designed for hardware testing, offering extensive connectivity and cooling support;

    ➁ The DeltaMate water-cooling line targets high-end CPUs (AM5/LGA 1851) and GPUs, starting with compatibility for the Asus ROG Astral RTX 5090;

    ➂ A prototype WireView Pro tool introduces per-pin power monitoring and safety features to optimize GPU overclocking and prevent connector issues.

    CoolingOverclockingThermal Grizzly
  • TSMC calls on Washington to drop tariffs on semiconductors made outside the U.S.

    ➀ TSMC warns U.S. semiconductor tariffs could reduce demand for its Arizona fab, threatening its $165 billion investment timeline;

    ➁ Dell and HP oppose tariffs, citing insufficient U.S. chipmaking infrastructure and risks to domestic R&D/security;

    ➂ Intel seeks exemptions for U.S.-made wafers but admits full local supply chains are economically unfeasible.

    DellIntelTSMC
  • Royal Kludge highlights new mechanical keyboards at Computex 2025, available in 60% to 96% layouts

    ➀ Royal Kludge showcased diverse mechanical keyboards at Computex 2025, spanning compact 60% layouts to space-efficient 96% designs;

    ➁ Keyboards feature customizable aesthetics like swirl-pattern keycaps, LCD screens, and tri-mode wireless connectivity;

    ➂ Models cater to both minimalist preferences and functionality-seekers, including LAN-party-friendly portable options with unique color themes.

    Mechanical Keyboards
  • Kioxia demos optical SSD, boasts of high performance and 30m+ cabling

    ➀ Kioxia unveiled an optical SSD prototype at Computex 2025, demonstrating PCIe Gen5 connectivity with optical cabling spanning over 30 meters without performance loss;

    ➁ Partnered with Kyocera's Optinity PCIe card, the solution targets enterprise servers, enabling high-speed data transfer and extended reach for DRAM and storage;

    ➂ Despite the bulky prototype hardware, Kioxia plans to miniaturize the optical interface to fit within standard SSDs, aiming for data center and industrial applications.

    EnterpriseKioxiaPCIe
  • G-Skill demos ultra-high capacity DDR5-6600 512GB RAM and 'extreme' 10,934 MT/s module at Computex 2025

    ➀ G.Skill showcased DDR5-10,934 MT/s overclocking with ASUS ROG Maximus Z890 and Intel Core Ultra 9 285K;

    ➁ Demonstrated 512GB DDR5-6600 R-DIMM setup and CAMM2 modular design for improved cooling;

    ➂ Unveiled 'Neox' neon-themed RAM concept and ultra-low latency configurations down to CL26.

    DRAMddr5
  • automatica 2025: Collaborative Robots Automate Production Processes and Streamline Additive Manufacturing

    ➀ Fraunhofer IAPT presents collaborative robots (Cobots) at automatica 2025, automating production processes and reducing expertise requirements for additive manufacturing;

    ➁ The Cobots leverage sensors, end-to-end data formats, and customized tools like silicone grippers to enhance process stability and product quality;

    ➂ These solutions highlight additive design benefits for complex geometries, improving resource efficiency and productivity in low-volume, highly customized production.

    3D ICautomotivesemiconductor
  • Development of Groundbreaking and Energy-Efficient AI with Innovative Ferroelectric Technology

    ➀ The ViTFOX project, led by Fraunhofer IPMS and European-Korean partners, develops a Vision-Transformer (ViT) architecture using ferroelectric oxides to achieve AI energy efficiency exceeding 50 TOPS/W for edge applications;

    ➁ The project integrates computing-in-memory technology to reduce latency and energy consumption, leveraging ferroelectric materials like HZO compatible with silicon-based devices;

    ➂ Cross-border collaboration aims to advance semiconductor innovation, combining European expertise in epitaxial ferroelectric junctions with Korean 3D FeRAM development to enhance hardware-software co-optimization.

    AIHPCsemiconductor

May 21

  • Picometric Spectroscopy of Hydrogen Molecules in Atomic Nanocavities

    ➀ Scientists achieved the first spectroscopic observation of hydrogen (H₂) and deuterium (D₂) molecules confined in atomic-scale picocavities using advanced tip-enhanced Raman spectroscopy (TERS);

    ➁ Quantum mechanical effects, such as nuclear delocalization, were identified as the cause of distinct vibrational responses between H₂ and D₂, revealing isotope-specific behavior not detectable by conventional methods;

    ➂ The findings offer new insights for energy storage systems, catalytic surfaces, and single-molecule quantum control technologies.

    Quantumenergy storage
  • Exchange on the Future of Digital Transformation

    ➀ The IEEE ICPS 2025 conference, focused on Industry 4.0 and digital transformation, gathered 170 global experts at Hochschule Emden/Leer, highlighting Germany's leadership in industrial cyber-physical systems;

    ➁ Organized by Prof. Armando Walter Colombo, the event featured discussions on digital twins, AI-driven automation, and cybersecurity, with participation from companies like SAP, BMW, Volvo, and Volkswagen;

    ➂ Practical sessions included industry visits to Volkswagen and Meyer Werft, alongside regional tech showcases for applications in manufacturing, logistics, and circular economies.

    automotivecybersecurity
  • Digital Tools for Industrial Process Development

    ➀ The Fraunhofer IST is advancing simulation tools to bridge the gap between theoretical models and industrial applications, aiming to reduce physical experiments and enhance efficiency in processes like vacuum coating and water treatment;

    ➁ The institute plans to integrate AI, machine learning, and digital twins to make simulations accessible to non-experts, expanding beyond its established PICMC/DSMC and CFD modeling techniques;

    ➂ Fraunhofer IST emphasizes workforce training through partnerships with universities like TU Braunschweig, fostering a new generation skilled in simulation-based decision-making for sustainable industrial practices.

    AIHPC
  • Digital tools for industrial process development

    ➀ Fraunhofer IST introduces new simulation approaches to integrate numerical modeling into industrial practice, reducing physical tests and optimizing processes like vacuum coating and water treatment;

    ➁ The institute utilizes a proprietary PICMC/DSMC solver and CFD methods for plasma and gas flow simulations, aiming to democratize simulation access for non-experts;

    ➂ Future plans include AI integration, data-driven modeling, and talent development through academic courses to advance digital twins and sustainable industrial processes.

    EDAHPCsemiconductor
  • V-Color puts displays on memory modules

    ➀ V-Color introduces DDR5 memory modules with programmable LCD screens for real-time monitoring of speed, temperature, and voltage;

    ➀ Designed for gaming enthusiasts, featuring RGB lighting and dual-channel 24GB/48GB configurations;

    ➀ Prototypes debuted at Computex 2025, with planned AMD/Intel platform support and 'filler' RGB modules for cohesive aesthetics.

    DRAMgaming
  • AMD Announces Threadripper HEDT and Pro 9000-Series CPUs: 96 cores and 192 threads for Desktops and Workstations

    ➀ AMD unveils Zen 5-based Threadripper Pro 9000 WX and non-Pro CPUs, featuring up to 96 cores and 192 threads in flagship models;

    ➁ Zen 5 architecture delivers 22% performance gains, DDR5-6400 memory support, with up to 2.2X rendering speed over Intel Xeon-W;

    ➂ sTR5 socket compatibility maintained, estimated July 2025 availability starting at $1,400 for HEDT models.

    AMDHPCcpu
  • AMD launches Radeon AI Pro R9700 to challenge Nvidia's AI market dominance

    ➀ AMD unveils Radeon AI Pro R9700 at Computex 2025, targeting professional AI workloads with RDNA 4 architecture and Navi 48 chip;

    ➁ Features 32GB GDDR6, 640GB/s bandwidth, and 1,531 TOPS AI性能,宣称在Llama 8B等模型上比RTX 5080快5倍;

    ➂ Set for July 2025 launch with multi-GPU支持,但价格未公布,直面NVIDIA的专业级挑战。

    AIAMDGPU
  • AMD Radeon RX 9060 XT launches on June 5, starting at $299

    ➀ AMD announces Radeon RX 9060 XT with 8GB ($299) and 16GB ($349) variants, targeting competition against NVIDIA's RTX 5060 Ti.

    ➁ Featuring Navi 44 silicon on TSMC’s 4nm process, the GPU upgrades to PCIe 5.0 x16, offering 14% higher clock speeds and 11% more memory bandwidth than its predecessor.

    ➂ AMD highlights 6% performance lead over NVIDIA’s RTX 5060 Ti 8GB at 1440p, but 8GB VRAM model faces criticism for potential obsolescence.

    AMDGPUNVIDIA