➀ The QSens cluster at the Universities of Stuttgart and Ulm focuses on quantum sensor research and practical applications. ➁ The BMBF is funding QSens with EUR 15 million for another three years. ➂ QSens aims to develop quantum sensors for biomedical technology, energy storage, and intelligent systems, with a focus on market maturity and technology transfer.
Recent #IoT news in the semiconductor industry
1. NXP introduces the Trimension SR250, the first single-chip solution integrating short-range UWB radar and secure ranging. 2. The solution aims to enable new user experiences in autonomous homes and industrial IoT applications. 3. The Trimension SR250 supports 3D AoA, TDOA, and ToF, and can be combined with secure elements for added security.
➀ u-blox introduces CloudTrack, an end-to-end asset-tracking service that redefines the IoT landscape; ➁ The service offers ultra-low-power positioning, global connectivity, and seamless cloud integration; ➂ It provides businesses with transparent, pay-as-you-go pricing without hidden fees or concerns about data usage.
➀ CoreHW and Presto Engineering have collaborated to develop an ultra-low-power RF 2.4GHz front-end module. ➁ The module is packaged in an ultra-small and thin wafer-scale format. ➂ This collaboration aims to advance the global penetration of IoT devices.
➀ Introduces a Wi-Fi-enabled standalone lidar system for flexible deployment in mapping and monitoring. ➁ Combines the IndusBoard with a YD X2 lidar to create real-time wireless maps. ➂ Utilizes a 5V battery and a 3.3V voltage regulator for power, with data transmitted via serial peripherals at 115200 baud rate.
➀ Crypto Quantique introduces TuRiNG, a randomness test suite for PUFs, addressing NIST 800-22 limitations. ➁ The suite adapts existing tests to PUF characteristics, ensuring independence of outputs and cryptographic security. ➂ It introduces innovative techniques to efficiently validate PUF randomness, enhancing security in IoT devices.
➀ HaiLa Technologies Inc. and e-peas Semiconductor collaborate to develop battery-free solutions for Wi-Fi sensors, reducing costs and environmental impact. ➁ The HaiLa BSC2000 RF Evaluation Chip uses passive backscatter technology for Wi-Fi frequencies, integrating with various IoT devices. ➂ e-peas' AEM10941 energy management circuit extends battery life and aims to eliminate disposable batteries in wireless applications.
➀ The PD Stepper is an integrated stepper motor driver and controller board combining ESP32-S3 and TMC2209 for smart home and automation applications. ➁ It features a USB-C connector supporting Power Delivery up to 50W, enabling efficient motor control. ➂ The board includes an AS5600 magnetic rotary position sensor and supports Wi-Fi, I2C, UART, and BLE for versatile control options. ➃ The device is open-source, with all design files available on GitHub, and is currently available for pre-order.
➀ The integration of AI and IoT is driving the semiconductor industry towards more efficient and domain-specific chipsets. ➁ AI applications are reducing human error and enhancing device capabilities, necessitating advanced system-on-chip architectures. ➂ The semiconductor industry is undergoing significant changes with the adoption of AI in manufacturing processes and lifecycle management, promising substantial revenue growth and operational efficiencies.
➀ The AVR-IoT Cellular Mini is a comprehensive development board designed for secure and connected IoT solutions, integrating a microcontroller, secure element, and cellular module. ➁ It supports multiple power sources and includes an on-board debugger for ease of development. ➂ The design is fully tested with all necessary design files and software provided by Microchip Technology.
➀ The number of satellites usable for IoT connectivity is expected to grow by 150% over the next five years, reaching over 24,000 by 2029. ➁ Juniper Research attributes this growth to increased demand for connectivity in nomadic locations. ➂ The report highlights that 98% of new satellites will be LEOs due to their low launch costs.
➀ ROHM has developed the TLR377GYZ, an ultra-compact CMOS op amp optimized for sensor signal amplification in smartphones and IoT devices. ➁ The device achieves high accuracy with a maximum offset voltage of 1mV and low noise performance without increasing transistor size. ➂ The TLR377GYZ features a WLCSP package, reducing size by 69% compared to conventional products and 46% over existing compact products.
1. Power Over Ethernet (PoE) technology simplifies installation and reduces costs for industrial gateways by integrating data and power transmission over a single Ethernet cable. 2. Texas Instruments' reference design TIDM-1018 combines PoE technology with the SimpleLink MSP432E4 Ethernet microcontroller, enhancing IoT applications. 3. The design features a compact board with advanced capabilities, including dual BoosterPack headers and support for various gateways like HVAC and security systems.
1. Epishine, a Swedish company, introduces organic solar cells for indoor IoT devices, enhancing performance in low light conditions. 2. The technology uses a blend of polymer chains and fullerenes to create efficient, robust solar cells suitable for various indoor applications. 3. Epishine's solar cells are designed to be lightweight, environmentally friendly, and easily integrated into IoT devices, providing a reliable power source.
1. Infineon has launched an evaluation kit for embedded, Edge AI, and ML system designs, aimed at intelligent consumer, smart home, and IoT applications. 2. The PSoC 6 AI Evaluation Kit offers enhanced real-time performance and power efficiency by executing inferencing near the sensor data source. 3. The kit includes a range of integrated sensors and connectivity options, and supports development using Infineon's extensive portfolio of products and software environments.
❶ Remote.It introduces an open-source tool for easy Wi-Fi setup on Raspberry Pi 5 and older models. ❷ The tool uses Bluetooth to share connection details from smartphones and computers, eliminating the need for physical peripherals. ❸ Post-setup, users can manage services like SSH and share access with other Remote.It users.
1. ADIY has launched the ESP32 Development Board, featuring the ESP32-WROOM-32E, 32D, and 32U modules, designed for IoT applications with Wi-Fi, Bluetooth, and BLE support. 2. The board uses a 32-bit dual-core MCU with low power consumption and high performance, suitable for both novice and advanced users. 3. It supports multiple wireless modes and comes in various memory configurations, making it versatile for different project needs.
1. The reference design features low standby power, high efficiency, and robust protection for IoT applications. 2. Utilizes Infineon's CoolSET ICE3RBR4765JG for a 5 V, 600 mA output. 3. Suitable for intelligent wall plugs, metering, and general IoT device power supplies.
1. STMicroelectronics introduces the ST4SIM-300, the first eSIM compliant with the GSMA's new SGP.32 standard for IoT deployments. 2. The new eSIM standard addresses specific IoT needs, including advanced features for remote SIM provisioning and simplified management of large device fleets. 3. The ST4SIM-300 is designed for security and compatibility with 5G and LPWAN devices, suitable for applications like smart meters and medical wearables.
1. Infineon Technologies introduces the AIROC CYW5591x Connected Microcontroller family, integrating Wi-Fi 6/6E and Bluetooth Low Energy 5.4. 2. The platform is designed for smart home, industrial, wearable, and other IoT applications, featuring comprehensive software tools and extensive peripheral support. 3. The device family includes three versions with varying frequency bands and supports Matter-over-Wi-Fi, offering robust security and high-speed wireless connectivity.