Recent #eSIM news in the semiconductor industry

6 months ago

➀ Infineon has claimed the world's smallest GSMA-compliant e-SIM IC, the OC1230, which measures 1.8 x 1.6 x 0.4mm and is fabricated using a 28nm process.

➁ The chip includes an Arm v8 processor and Infineon's 'Integrity Guard 32' IP, ensuring security as per BSI-CC-PP-0100-2018 specifications.

➂ It supports GSMA SGP.22 v3 compliant remote SIM provisioning and multiple enabled profiles, suitable for applications like smartphones, tablets, notebooks, smartwatches, 5G, and point-of-sale payment terminals.

InfineonIoTeSIM
10 months ago
1. iPhone 16 models in the US lack a SIM card tray, requiring users to switch to eSIMs; 2. This change is not applicable outside the US, where all models come with a SIM card tray; 3. iPhone 16 models outside the US lack 5G mmWave support, which is available in the US models; 4. eSIMs offer benefits like multiple numbers and networks on a single device; 5. Removing the SIM card tray simplifies manufacturing and improves water and dust resistance.
5GeSIMiPhone 16
about 1 year ago
1. STMicroelectronics introduces the ST4SIM-300, the first eSIM compliant with the GSMA's new SGP.32 standard for IoT deployments. 2. The new eSIM standard addresses specific IoT needs, including advanced features for remote SIM provisioning and simplified management of large device fleets. 3. The ST4SIM-300 is designed for security and compatibility with 5G and LPWAN devices, suitable for applications like smart meters and medical wearables.
IoTSTMicroelectronicseSIM