➀ The transition of AI servers from HBM to CXL technologies; ➁ The importance of high-speed memory bandwidth in AI servers; ➂ The rise of HBM technology to overcome 'memory wall' issues; ➃ Market dominance of HBM suppliers like SK Hynix, Samsung, and Micron; ➄ The impact of new interconnect technologies like CXL and MCR/MDIMM on AI server performance; ➅ Micron's product roadmap and Rambus' interconnect solutions; ➆ The significance of SPD EEPROMs in DDR5 memory systems.

➀ Saniffer releases updated version 11.1 of its PCIe5&6.0, CXL, NVMe/NVMoF, SSD, NAND, DDR5, 800GE test technology and tool whitepaper; ➁ PCIe Gen6 NVMe SSD testing begins, with focus on E3.S or E1.S interfaces; ➂ FMS 2024 participation summary with 3505 attendees, including 12 Chinese companies; ➃ PCIe Gen6 interoperability issues identified and scheduled for further testing in October; ➄ AI infrastructure hardware diagnosis, analysis, and testing added to whitepaper, including AI training and inference architectures; ➅ 800G/1.6T optical module development and testing advancements driven by AI and data center demands; ➆ Nvidia starts certifying 1.6T optical modules in June 2024.

➀ YEESTOR showcased its CXL SSD solutions at FMS 2024, addressing the 'storage wall' issue with innovative CXL technology. ➁ The company demonstrated a range of storage solutions including PCIe SSD controllers and UFS controllers, tailored for AI, mobile, cloud computing, and more. ➂ YEESTOR also highlighted its advancements in automotive, industrial, and enterprise-grade storage solutions, emphasizing its commitment to innovation and market diversification.

1. JEDEC has released JESD405-1B, a standard for CXL memory module labels, detailing information like memory type, protocol revision, and capacity. 2. The standard supports SNIA EDSFF form factors E1.S and E3.S, and includes connector and I/O configuration details. 3. JESD405-1B, along with JESD317A, aims to support and expand the CXL market by ensuring multiple sourcing options for CMMs.